FP1008L1-R150-R

FP1008L EATON | Alldatasheet

Document overview

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Technical content

High frequency, high current power inductors

Description

• High current carrying capacity
• Low DCR
• Low core loss
• Controlled DCR for sensing circuits
• Inductance range from 100nH to 150nH
• Current range from 50 to 75 amps
• 9.6 x 6.4 and 7.5mm footprint surface mount package in an 8.0mm height
• Ferrite core material
• Halogen free, lead free, RoHS compliant

Applications

• Servers
• Multi-phase and Vcore regulators
• Voltage Regulator Modules (VRMs)
• Server and desktop
• Central processing unit (CPU)
• Graphics processing unit (GPU)
• Application specific integrated circuit (ASIC)
• High power density
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-Load modules
• DCR Sensing circuits Environmental Data
• Storage temperature range (Component): -40°C to +125°C
• Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/elx Product Specifications Part Number8 OCL1 (nH) ±10% FLL2 (nH) minimum Irms (amps) Isat14 (amps) Isat25 (amps) Isat36 (amps) DCR (mΩ) @ 20°C K-factor7 L1 Version FP1008L1-R100-R 100 72 65 75 65 63 0.17 ±5% 461 FP1008L1-R150-R 150 108 65 50 44 42 0.17 ±5% 461 L2 Version FP1008L2-R150-R 150 108 65 65 57 55 0.17 ±15% 411 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, @ +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, @ I sat1, @ +25ºC 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25°C 5. Isat2: Peak current for approximately 20% rolloff @ +100°C 6. Isat3: Peak current for approximately 20% rolloff @ +125°C 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10 -3 Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps). 8. Part Number Definition: FP1008Lx-Rxxx-R FP1008L = Product code and size x= Version indicator Rxxx= inductance value in μH, R= decimal point , -R suffix = RoHS compliant Dimensions (mm)

High frequency, high current power inductors www.eaton.com/elx Packaging information (mm) Supplied in tape and reel packaging FP1008L1: 600 parts per 13” diameter reel FP1008L2: 500 parts per 13” diameter reel T emperature rise vs. total loss FP1008L1 (Drawing not to scale) FP1008L2 (Drawing not to scale) Temperature Rise (°C) Total Loss (W) FP1008L1 Total Loss (W) FP1008L2 Temperature Rise (°C)

High frequency, high current power inductors www.eaton.com/elx Core loss vs. Bp-p 0.001 0.01 0.1 100 1000 10000 Core Loss (W) Bp-p (Gauss) FP1008L1 300kHz 500kHz 800kHz 1.0MHz 0.001 0.01 0.1 100 1000 10000 Core Loss (W) Bp-p (Gauss) FP1008L2 300kHz 500kHz 800kHz 1.0MHz

High frequency, high current power inductors www.eaton.com/elx Inductance characteristics 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 08 09 0 100 110 % of OCL IDC (Amps) FP1008L1-R100-R -40C +25C +100C +125C 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 0 % of OCL IDC (Amps) FP1008L1-R150-R -40C +25C +100C +125C 20% 40% 60% 80% 100% 120% 01 02 03 04 05 06 07 08 09 0 % of OCL IDC (Amps) FP1008L2-R150-R -40C +25C +100C +125C

Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 10450 BU-MC15059 December 2015 Technical Data 10450 Effective December 2015 FP1008L High frequency, high current power inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C