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even more. The Coiltronics brand of magnetics (formerly of the Bussmann Division of Cooper Industries) is now part of Eaton’s Electrical Group, Electronics Division. Coiltronics FP1008 Family High frequency, high current power inductors Product description

  • High current carrying capacity
  • Low core loss
  • Controlled DCR for sensing circuits
  • Inductance range from 120nH to 180nH
  • Current range from 63 to 100 Amps
  • 10.8 x 8.0mm footprint surfaace mount package in a 8.0mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Desktop and server VRMs and EVRDs
  • Laptop and notebook regulators
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules
  • DCR Sensing circuits Environmental data
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/elx Product specifications Part Number9 OCL1 (nH)±10% FLL2 (nH) minimum Irms (amps) Isat14 (amps) Isat25 (amps) Isat36 (amps) Isat47 (amps) DCR (mΩ) @ 20°C ±5% K-factor8 FP1008-120-R 120 82 63 100 95.0 91.0 82 0.17 366 FP1008-150-R 150 104 63 82 78.0 75.0 68 0.17 366 FP1008-180-R 180 130 63 64 60.8 58.6 53 0.17 366 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc @ 25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3. I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is neces - sary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. I sat1: Peak current for approximately 20% rolloff @ 25°C 5. I sat2: Peak current for approximately 20% rolloff @ 85°C 6. I sat3: Peak current for approximately 20% rolloff @ 100°C 7. I sat4: Peak current for approximately 20% rolloff @ 125°C 8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps). 9. Part Number Definition: FP1008-xxx-R - FP1008= Product code and size - xxx= Inductance value in nH - “-R” suffix = RoHS compliant Dimensions (mm) DCR measured from point “A” to point “B” Part marking: FP1008-xxx, xxx = inductance value in nH wwllyy = date code, R = revision level Tolerances are ±0.205 millimeters unless stated otherwise. All soldering surfaces to be coplanar within 0.1 millimeter Do not route traces or vias underneath the inductor Recommended Pad Layout Schematic 3.0 4.06 11.18 3.56 8.0 max. 8.0 max. B 2.5 2.6 2.6 2.5 ±0.1A 10.8 max. 10.0 max. FP1008-XXX wwllyy R

High frequency, high current power inductors www.eaton.com/elx Packaging information (mm) Core loss vs. B p-p User Direction of Feed Section A – A 16.0 24.0 +/–0.3 2.0 10.4 8.3 1.5 dia 11.5 1.75 4.0 1.5 dia Supplied in tape-and-reel packaging, 350 parts on a 13” diameter reel. Core Loss (W) 0.1 0.01 0.001 B p-p (Gauss) 100 1000 10000 1MHz800kH z 500kH z 300kH z 100kH z

High frequency, high current power inductors www.eaton.com/elx Inductance characteristics 100 120 02 04 06 08 01 00 120 Idc (Amps) FP1008-150-R 100 120 02 04 06 08 01 00 120 140 % of OCL FP1008-120-R % of OCL Idc (Amps)

High frequency, high current power inductors www.eaton.com/elx Inductance characteristics 100 120 02 04 06 08 0 100 FP1008-180-R Idc (Amps) % of OCL

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 10155 — BU-SB14841 March 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. FP1008 Family High frequency, high current power inductors Technical Data 10155 Effective March 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C