FP1007R6 EATON | Alldatasheet

Document overview

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  • PDF pages: 4

Technical content

  • 10.5 x 8.0 x 7.0mm Maximum surface mount package
  • Ferrite core material
  • Controlled DCR tolerance for sensing circuits
  • Inductance Range from 150nH to 470nH
  • Current range from 23.5 to 75 Amps
  • Frequency range up to 2MHz
  • Halogen free, lead free, RoHS compliant

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant FP1007R6 High frequency, high current power inductors Pb HALOGEN HFFREE
  • Multi-phase regulators
  • Voltage Regulator Modules (VRMs)
  • Desktop and server VRMs and EVRDs
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules
  • DCR Sensing Environmental data SMD Device

High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff at +25°C. 5. Isat2: Peak current for approximately 20% rolloff at +100°C. 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007R6-Rxx-R FP1007R6 = Product code and size Rxx= Inductance value in uH, R = decimal point -R suffix = RoHS compliant Product Speci/f_ications Part OCL 1 ±10% FLL 2 Min. I rms 3 Isat 14 @25°C I sat 25 @100°C DCR @20°C Number 7 (nH) (nH) (Amps) (Amps) (Amps) (m/uni03A9) K-Factor 6 FP1007R6-R15-R 150 108 75.0 60.0 FP1007R6-R18-R 180 129 60.0 50.0 FP1007R6-R22-R 220 158 50.0 40.0 FP1007R6-R27-R 270 194 61 41.0 33.0 0.29 ± 5% 348.8 FP1007R6-R33-R 330 237 33.0 26.5 FP1007R6-R39-R 390 280 28.0 22.5 FP1007R6-R47-R 470 338 23.5 19.0 The nominal DCR is measured from point "A" to point "B" Part Marking: 1007R6, Rxx = Inductance value in µH. (R = Decimal point) wwllyy = Date code R = Revision level Tolerance are ±0.15mm unless otherwise specified. Soldering surfaces to be coplanar within 0.1016mm. PCB tolerance ±0.1mm unless otherwise specified. 24.0 ±0.30 1.75 11.5 1.5 dia 1.5 dia 4.0 2.0 8.1 12.0 7.1 10.60 A A SECTION A-A Supplied in T ape-and-Reel packaging, 700 parts per 13 inch diameter reel.

3www.eaton.com/electronics Technical Data 10007 Effective June 2017 Core loss vs Bp-p Inductance characteristics FP1007R6 High frequency, high current power inductor Temperature rise vs total loss 1MHz 500kHz 10 300kHz 200kHz 1 100kHz 0.1 0.01 0.001 0.0001 0.00001 100 1000 10000 Bp-p (Gauss) Core Loss (W) % of OCL vs. Isat1 100% 80% 60% 40% -40°C +100°C +25°C 20% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of Isat1 % of OCL Total Loss (W) Temperature Rise (°C)

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10007 BU-SB12795 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 10007 Effective June 2017 FP1007R6 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.