FP1007 EATON | Alldatasheet

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Technical content

High frequency, high current power inductors Product description

  • High current carrying capacity
  • Low core loss
  • Frequency range up to 2MHz
  • Inductance Range from 115 nH to 300nH
  • Current range from 32 to 94 amps
  • 10.4 x 8.0mm footprint surface mount package in 6.5, 7.5 or 7.5mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Servers
  • Multi-phase and Vcore regulators
  • Voltage Regulator Modules (VRMs)
  • Desktop VRMs and EVRDs
  • Data networking and storage systems
  • Graphics cards and battery power systems
  • Point-of-Load modules
  • DCR Sensing circuits Environmental data
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE

High frequency, high current power inductors www.eaton.com/elx Product specifications Part Number7 OCL1 (nH)±10% FLL2 (nH) minimum Irms (amps) Isat14 (amps) Isat25 (amps) DCR (mΩ) @ 20°C ±5% K-factor8 R1 version FP1007R1-R12-R 120 86 60 81 65 0.29 ± 10% 371 FP1007R1-R14-R 140 100 60 72 56 0.29 ± 10% 371 FP1007R1-R17-R 170 122 60 58 46 0.29 ± 10% 371 FP1007R1-R22-R 215 155 60 50 36 0.29 ± 10% 371 FP1007R1-R30-R 300 216 60 32 26 0.29 ± 10% 371 R2 version FP1007R2-R12-R 120 86 51 81 65 0.48 ± 8% 368 FP1007R2-R14-R 140 100 51 72 56 0.48 ± 8% 368 FP1007R2-R17-R 170 122 51 58 46 0.48 ± 8% 368 FP1007R2-R22-R 215 155 51 50 36 0.48 ± 8% 368 FP1007R2-R30-R 300 216 51 32 26 0.48 ± 8% 368 R3 version FP1007R3-R12-R 115 83 61 94 86 0.29 ± 5% 354 FP1007R3-R15-R 150 108 61 76 70 0.29 ± 5% 354 FP1007R3-R17-R 175 126 61 66 60 0.29 ± 5% 354 FP1007R3-R22-R 215 155 61 50 43 0.29 ± 5% 354 FP1007R3-R23-R 230 165 61 48 40 0.29 ± 5% 354 FP1007R3-R27-R 270 194 61 40 34 0.29 ± 5% 354 FP1007R3-R30-R 300 216 61 35 30 0.29 ± 5% 354 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25°C 3. I rms: Irms: DC current for an approximate temperature rise of 40ºC without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. I sat1: Peak current for approximately 20% rolloff @ +25°C 5. I sat2: Peak current for approximately 20% rolloff @ +125°C 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007Rx-Rxx-R FP1007R= Product code and size x = DCR indicator Rxx = Inductance value in μH, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Part marking: FP1007Rx (x = DCR indicator), Rxx (xx = inductance value in uH, R = decimal point, wwllyy = date code, R = revision level Tolerances are ±0.25 millimeters unless stated otherwise. PCB tolerances are ±0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor Recommended Pad Layout Schematic

High frequency, high current power inductors www.eaton.com/elx Packaging information (mm) T emperature rise vs. total loss Supplied in tape and reel packaging, FP1007R1 700 parts per 13 ” diameter reel FP1007R2 750 parts per 13 ” diameter reel FP1007R3 650 parts per 13 ” diameter reel User direction of feed

High frequency, high current power inductors www.eaton.com/elx Core loss vs. Bp-p Inductance characteristics

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4341 BU-10927 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Technical Data 4341 Effective October 2015 FP1007 High frequency, high current power inductors Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C