FP1007R2-R30-R

FP1007R1-R12-R COOPER | Alldatasheet

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Technical content

• Frequency range up to 2MHz  RoHS compliant Applications:  Multi-phase regulators  Voltage Regulator Module (VRM)  Desktop and server VRMs and EVRDs  Notebook regulators  Data networking and storage systems  Graphics cards and battery power systems  Point-of-load modules  DCR sensing Environmental Data:  Storage temperature range: -40°C to +125°C  Operating temperature range: -40°C to +125°C (With derated current)  Solder reflow temperature: J-STD-020D compliant Packaging:  Supplied in tape and reel packaging on 13” diameter reel  FP1007R1 700 parts per reel  FP1007R2 750 parts per reel  FP1007R3 650 parts per reel Product Specifications Part Number7 OCL1 ± 10% (nH) FLL 2 Min. (nH) I rms 3 (Amps) Isat14 @ 25°C (Amps) I sat25 @ 125°C (Amps) DCR (m Ω) @ 20°C K-factor 6 R1 Version FP1007R1-R12-R 120 86 81 65 371 FP1007R1-R14-R 140 100 72 56 371 FP1007R1-R17-R 170 122 60 58 46 0.29 ± 10% 371 FP1007R1-R22-R 215 155 50 36 371 FP1007R1-R30-R 300 216 32 26 371 R2 Version FP1007R2-R12-R 120 86 81 65 368 FP1007R2-R14-R 140 100 72 56 368 FP1007R2-R17-R 170 122 51 58 46 0.48 ± 8% 368 FP1007R2-R22-R 215 155 50 36 368 FP1007R2-R30-R 300 216 32 26 368 R3 Version FP1007R3-R12-R 120 86 94 86 354 FP1007R3-R15-R 150 108 76 70 354 FP1007R3-R17-R 170 122 66 60 354 FP1007R3-R22-R 215 155 61 50 43 0.29 ± 8% 354 FP1007R3-R23-R 230 165 48 40 354 FP1007R3-R27-R 270 194 40 34 354 FP1007R3-R30-R 300 216 35 30 354 HALOGEN HFFREE Description:  Halogen free  125°C maximum total temperature operation  Ferrite core material  High current carrying capacity, low core losses  Controlled DCR tolerance for sensing circuits  Inductance range from 120nH to 300nH  Current range from 32 to 94 Amps High Current, High Frequency, Power Inductors FLAT-PAC™ FP1007 Series

0209 BU-SB09133 Page 1 of 4 Data Sheet: 4341

1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms,I sat1 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 4I sat1: Peak current for approximately 20% rolloff at +25°C. 5I sat2: Peak current for approximately 20% rolloff at +125°C. 6 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3,B p-p : (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).

7 Part Number Definition: FP1007Rx-Rxx-R

 FP1007 = Product code and size  Rx is the DCR indicator  Rxx= Inductance value in μH, R = decimal point  “-R” suffix = RoHS compliant

7.8 +0.2/-0.3 Rxx wwllyy R 1007Rx 10.2 ± 0.2 2.54 ± 0.20 2.5 3.0 4.7 a b Side View Bottom ViewTop View 2.24 ± 0.15 Recommended Pad Layout Schematic F P 1007R 1-R = 6.80 ± 0.2 F P 1007R 2-R = 6.30 ± 0.2 F P 1007R 3-R = 7.30 ± 0.2 DDiimmeennssiioonnss -- mmmm Section A-A User direction of feed Section B-B 1.75 11.5 4.0 12.0 1.5 dia. 2.0 24 ± 0.310.5 8.1 1.5 dia. wwllyy R Rxx 1007Rx FP1007R1 = 7.1 FP1007R2 = 6.6 FP1007R3 = 7.6 Total Loss (W) Temperature Rise (°C) FP1007R1-R FP1007R2-R FP1007R3-R Part Marking: Coiltronics Logo 1007Rx (Rx = DCR Indicator) Rxx = Inductance value in μH. (R = Decimal point) wwllyy = Date code R = Revision level The nominal DCR is measured from point “a” to point”b.” Supplied in tape-and-reel packaging, on 13” diameter reel; FP1007R1 700 parts, FP1007R2 750 parts, FP1007R3 650 parts Packaging Information - mm Temperature Rise vs.Total Loss

0209 BU-SB09133 Page 2 of 4 Data Sheet: 4341

0209 BU-SB09133 Page 3 of 4 Data Sheet: 4341

0.00001 0.0001 0.001 0.01 0.1 100 1000 10000 B (Gauss) Core Loss (W) 100kHz 200kHz 300kHz 500kHz1MHz p-p Core Loss vs. Bp-p % of OCL vs. I sat 1 100 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 % of I sat 1 % of OCL +125°C +25°C -40°C Inductance Characteristics Core Loss

© 2009 Cooper Bussmann St. Louis, MO 63178 www.cooperbussmann.com

0209 BU-SB09133 Page 4 of 4 Data Sheet: 4341

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. A ll other copies of this document are by definition uncon- trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will he lp the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution o f any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it sh ould be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in ac cordance with instructions for use provided in the label- ing, can be reasonably expected to result in significant injury to the user. North America Cooper Electronic Technologies

1225 Broken Sound Parkway NW

Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P .O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies

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#06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) Volume Vol ume Package mm 3 mm3 Thickness <350 > _350 <2.5mm 235° C 220°C >_2.5mm 220° C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Vol ume Vol ume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 2 60°C 260°C 260°C 1.6 – 2.5mm 2 60°C 250°C 245°C >2.5mm 250° C 245°C 245°C Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (P b) Free Solder Preheat and Soak T emperature min. (Tsmin) 100° C 150°C  Temperature max. (Tsmax) 150° C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3° C/ Second Max. Liquidous temperature (TL) 183° C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1T able 2 Time (tp) within 5 °C of the specified classification temperature (Tc) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature6 Minutes Max. 8 Minut es Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.