FP1006 EATON | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
- 10.2 x 8.0 x 6.0mm surface mount package
- Ferrite core material
- High current carrying capacity, Low core losses
- Controlled DCR tolerance for sensing circuits
- Inductance range from 85nH to 220nH
- Current range from 38 to 100 amps
- Frequency range up to 2MHz
Applications
- Storage temperature range (component): -40 °C to +125 °C
- Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
- Solder reflow temperature: J-STD-020 (latest revision) compliant FP1006 High frequency, high current power inductors Pb HALOGEN HFFREE
- Multi-phase regulators
- Voltage Regulator Module (VRM)
- Point-of-load modules
- Desktop and server VRMs and EVRDs
- Data networking and storage systems
- Graphics cards and battery power systems
- DCR sensing SMD Device Environmental data
High frequency, high current power inductors www.eaton.com/electronics Packaging information - mm Dimensions- mm Product Specifications Part Number7 OCL1 ± 10% (nH) FLL 2 Min. (nH) I rms 3 (Amps)Isat14 @ 25°C (Amps) I sat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor 6 R1 Version FP1006R1-R08-R 85 61 100 70 454 FP1006R1-R10-R 100 72 85 64 454 FP1006R1-R12-R 120 86 53 71 53 0.27 ± 12% 454 FP1006R1-R16-R 160 115 55 40 454 FP1006R1-R22-R 220 158 38 28 454 R2 Version FP1006R2-R08-R 85 61 100 70 454 FP1006R2-R10-R 100 72 85 64 454 FP1006R2-R12-R 120 86 45 71 53 0.36 ± 8.6% 454 FP1006R2-R16-R 160 115 55 40 454 FP1006R2-R22-R 220 158 38 28 454 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V rms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V rms,I sat1 3I rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 4I sat1: Peak current for approximately 20% rolloff at +25°C. 5I sat2: Peak current for approximately 20% rolloff at +125°C. 6 K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3,B p-p : (Gauss), K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1006Rx-Rxx-R
Rx is the DCR indicator FP1006 = Product code and size Rxx= Inductance value in μH, R = decimal point “-R” suffix = RoHS compliant Top View Side View Bottom View Recommended Pad Layout Schematic A 1006Rx Rxx wwllyy R 8.0 max 6.56 1.92 1.92 a b 3.1 8.0 Part Number FP1006R1-R FP1006R2-R A max 10.2 6.0 max 2.8 ± 0.1 1.52 ± 0.2 1.52 ± 0.2 6.9 ref Part Marking: 1006Rx (Rx = DCR Indicator) Rxx = Inductance value in μH. (R = Decimal point) wwllyy = Date code R = Revision level The nominal DCR is measured from point “a” to point”b.” SECTION A-A A A 1.5 dia 1.5 dia 4.0 2.0 1.75 11.5 24.0 +/-0.3 User direction of feed wwllyy Rxx R 1006Rx 8.1 10.3 6.1 12.0 Supplied in tape-and-reel packaging, 850 parts per reel, 13” diameter reel.
3www.eaton.com/electronics Technical Data 4338 Effective June 2017 Core loss vs Bp-p Inductance characteristics FP1006 High frequency, high current power inductor Temperature rise vs total loss Total Loss (W) Temperature Rise (°C) 1MHz 10 500kHz 300kHz 200kHz 100kHz 0.1 0.01 0.001 0.0001 0.00001 100 1000 10,000 Bp -p (Gauss) Core Loss (W) % of O C L v s. % of I sat 1 100% -40°C 80% 60% +25°C 40% 20% +125°C 0% 20% 40% 60% 80% 100% 120% % of Isat 1 % of O C L
1000 Eaton Boulevard
Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4338 BU-SB08861 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4338 Effective June 2017 FP1006 High frequency, high current power inductor Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C Temperature max. (Tsmax) 150°C 200°C Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T
20 Seconds 30 Seconds
6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.