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Technical content

Features

 Single 4th-Order 8 MHz (SD) Filter  Drives Single, AC- or DC-coupled, Video Loads (2 Vpp, 150 Ω)  Drives Dual, AC- or DC-coupled, Video Loads (2Vpp, 75Ω)  Transparent Input Clamping  AC- or DC-Coupled Input  AC- or DC-Coupled Output  DC-Coupled Output Eliminates AC-Coupling Capacitors  Single Supply  Robust 8 kV ESD Protection  Lead-Free Packages: SOIC-8 or SC70-5

Applications

 Cable Set-Top Boxes  Satellite Set-Top Boxes  DV D Players  HDTVs  Personal Video Recorders (PVR)  Video On Demand (VOD)

Description

The FMS6141 Low-Cost Video Filter is intended to replace passive LC filters and drivers w ith a low -cost integrated device. The 4th- order filter provides improved image quality compared to typical 2nd or 3rd- order passive solutions. The FMS6141 may be directly driven by a DC -coupled DAC output or an AC-coupled signal. Internal diode clamps and bias circuitry may be used if an AC -coupled input is required (see Application Information for details). The FMS6141’s output can drive an AC - or DC-coupled single (150 Ω) or dual (75 Ω) load. DC-coupling the output removes the need for output coupling capacitors. The input DC level is offset approximately +280 mV at the output (see Application Information for details). Related Applications Notes  http://w w w .onsemi.com/pub/Collateral/AN- 6041.pdf.pdf  http://w w w .onsemi.com/pub/Collateral/AN- 6024.pdf.pdf Functional Block Diagram Figure 1. Block Diagram

FMS6141 — Low-Cost, Single-Channel 4th-Order Standard Definition Video Filter Driver www.onsemi.com

Ordering Information

Temperature Range Package Packing Method FMS6141CSX -40°C to +85°C 8-Lead, Small Outline Integrated Circuit (SOIC) Tape and Reel FMS6141S5X -40°C to +85°C 5- Lead SC70 Pac kage Tape and Reel Pin Configurations VIN VOUT N/C N/C GND VCC N/C N/C FMS6141 SOIC-8 GND VCC1 FMS6141 SC70-5 GND VIN VOUT Figure 2. SOIC-8 Figure 3. SC70

2 N/C No Connect

4 N/C No Connect

5 N/C No Connect

6 N/C No Connect

FMS6141 — Low-Cost, Single-Channel 4th-Order Standard Definition Video Filter Driver www.onsemi.com Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressi ng the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC DC Supply Voltage -0.3 6.0 V VIO Analog and Digital I/O -0.3 VCC +0.3 V IOUT Output Current, Do Not Exceed 50 mA Recommended Operating Conditions Symbol Parameter Min. Typ. Max. Unit TA Operating Temperature Range -40 85 °C VCC VCC Range 4.75 5.00 5.25 V ESD Information Symbol Parameter Value Unit ESD Human Body Model, JESD22-A114 8.0 kV Charged Device Model, JESD22-C101 1.5 kV Reliability Information Symbol Parameter Min. Typ. Max. Unit TJ Junction Temperature +150 °C TSTG Storage Temperature Range -65 +150 °C TL Lead Temperature (Soldering, 10 s) 300 °C ΘJA Thermal Resistance (JEDEC Standard Multi-Layer Test Boards, Still Air) SOIC-8 115 °C/W SC70-5 332 °C/W

FMS6141 — Low-Cost, Single-Channel 4th-Order Standard Definition Video Filter Driver www.onsemi.com DC Specifications TA = 25°C, VCC = 5.0 V, RS = 37.5 Ω; input is AC coupled w ith 0.1 µF; output is AC coupled w ith 220 µF into a 150 Ω load; unless otherw ise noted. Symbol Parameter Conditions Min. Typ. Max. Unit ICC Supply Current(1) No Load 7 12 mA VIN Video Input Voltage Range Referenced to GND if DC-Coupled 1.4 Vpp PSRR Pow er Supply Rejection Ratio DC 40 dB Note : 1. 100% tested at 25°C TA = 25°C, VCC = 5.0 V, RS = 37.5 Ω; input is AC coupled w ith 0.1 µF; output is AC coupled w ith 220 µF into a 150 Ω load; unless otherw ise noted. Symbol Parameter Conditions Min. Typ. Max. Unit AV Channel Gain(2) 5.6 6.0 6.4 dB f1dB -1dB Bandw idth(2) 4.0 6.5 MHz fC -3dB Bandw idth 7.7 MHz fSB Attenuation (Stopband Reject) f = 27 MHz 42 dB dG Differential Gain 0.4 % dφ Differential Phase 0.4 ° THD Output Distortion (all channels) VOUT = 1.8 Vpp, 1 MHz 0.4 % SNR Signal-to-Noise Ratio NTC-7 Weighting; 100 kHz to

4.2 MHz 75 dB

tpd Propagation Delay Delay from input to output,

4.5 MHz 55 ns

Note : 2. 100% tested at 25°C

close to the input pin for optimal signal integrity. Figure 6. Typical Input Configuration

800 K ohms

Figure 7. Conceptual Illustration — Input Clamp Circuit and Output Driver Figure 8. DC-Coupled Input and DC -Coupled Output

75 LCVF

Figure 9. AC-Coupled Input and DC -Coupled Output Figure 10. DC-Coupled Input and AC -Coupled Output Figure 11. AC-Coupled Input and AC -Coupled Output

FMS6141 — Low-Cost, Single-Channel 4th-Order Standard Definition Video Filter Driver www.onsemi.com Layout Considerations General layout and supply bypassing play a major role in high-frequency performance and thermal characteristics. ON Semiconductor offers a demonstration board for the FMS6141 to guide layout and aid device evaluation. The demo board is a four -layer board w ith full pow er and ground planes. Follow ing this layout configuration provides optimum performance and thermal characteristics for the device. For the best results, follow the steps and recommended routing rules listed below . Recommended Routing/Layout Rules  Do not run analog and digital signals in parallel.  Use separate analog and digital pow er planes to supply pow er.  Traces should run on top of the ground plane at all times .  No trace should run over ground/pow er splits.  Avoid routing at 90-degree angles.  Minimize clock and video data trace length differences.  Include 10 µF and 0.1 µF ceramic pow er supply bypass capacitors.  Place the 0.1 µF capacitor w ithin 0.1 inches of the device pow er pin.  Place the 10 µF capacitor w ithin 0.75 inches of the device pow er pin.  For multilayer boards, use a large ground plane to help dissipate heat.  For tw o-layer boards, use a ground plane that extends beyond the device body by at leas t 0.5 inches on all sides. Include a metal paddle under the device on the top layer.  Minimize all trace lengths to reduce series inductance. Thermal Considerations Since the interior of most system s, such as set -top boxes, TVs, and DV D players are at +70ºC; consideration must be given to providing an adequate heat sink for the device package for maximum heat dissipation. When designing a system board, determine how much pow er each device dissipates . Ensure that devices of high pow er are not placed in the same location, such as directly above (top plane) and below (bottom plane) each other on the PCB. PCB Thermal Layout Considerations  Understand the system pow er requirements and environmental conditions.  Maximize thermal performance of the PCB.  Consider using 70 µm of copper for high- pow er designs.  Make the PCB as thin as possible by reducing FR4 thickness.  Use vias in pow er pad to tie adjacent layers together.  Remember that baseline temperature is a function of board area, not copper thickness.  Modeling techniques can provide a first -order approximation. Power Dissipation Consider the FMS6141’s output drive configuration w hen calculating overall pow er dissipation. Care must be taken not to exceed the maximum die junction temperature. The follow ing example can be used to calculate the FMS6141’s pow er dissipation and internal temperature rise. T J = TA + PCHANNEL ΘJA w here PCHANNEL = VCC • ICH + (VO 2/RL) VO = 2VIN + 0.280V ICH = ICC + (VO/RL) VIN = RMS value of input signal ICC = 7mA VS = 5V RL = channel load resistance The FMS6141 is specified to operate w ith output currents typically less than 50 mA , w hich is more than sufficient for a dual (75 Ω) video load. The internal amplifiers of the FMS6141 are current limited to a maximum of 100 mA and can w ithstand a bri ef-duration short-circuit condition, but this capability is not guaranteed.

B) ALL DIMENSIONS ARE IN MILLIMETERS. D) LANDPATTERN STANDARD: SOIC127P600X175-8M.

1.75 MAX

Figure 12. SOIC-8 Package

Figure 13. SC70-5 Package

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