FMH30N60S1FD ISC | Alldatasheet

Document overview

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Technical content

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark1 iscN-ChannelMOSFETTransistor FMH30N60S1FD

  • FEATURES
  • WithTO-3PNpackaging
  • Highspeed switching
  • Standardlevelgate drive
  • Easytouse
  • 100% avalanchetested
  • MinimumLot-to-Lotvariations forrobustdevice performanceandreliable operation
  • APPLICATIONS
  • Powersupply
  • Switching applications
  • ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VALUE UNIT VDSS Drain-SourceVoltage 600 V VGSS Gate-SourceVoltage ±30 V ID DrainCurrent-Continuous@Tc=25℃ Tc=100℃ 19 A IDM DrainCurrent-SinglePulsed 90 A PD TotalDissipation 220 W Tj OperatingJunctionTemperature -55~150 ℃ Tstg StorageTemperature -55~150 ℃
  • THERMALCHARACTERISTICS SYMBOL PARAMETER MAX UNIT Rth(ch-c) Channel-to-casethermalresistance 0.46 ℃/W

iscwebsite:www.iscsemi.cn isc & iscsemi isregisteredtrademark2 iscN-ChannelMOSFETTransistor FMH30N60S1FD ELECTRICALCHARACTERISTICS TC=25℃ unlessotherwisespecified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT BVDSS Drain-SourceBreakdownVoltage VGS=0V;ID=0.25mA 600 V VGS(th) GateThresholdVoltage VDS=±30V;ID=1.0mA 3.0 5.0 V RDS(on) Drain-SourceOn-Resistance VGS=10V;ID=15A 111 132 mΩ IGSS Gate-SourceLeakageCurrent VGS= ±30V;VDS=0V ±0.1 μA IDSS Drain-SourceLeakageCurrent VDS=600V;VGS=0; 25 μA VSDF Diodeforwardvoltage ISD=30A;VGS =0V 1.35 V