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Technical content

Small Signal Schottky Diode http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. DS-22160B 2008/02/10 2010/12/10 C 7

Surface Mount Small Signal

Features

Lead-free parts for green partner, exceeds environmental standards of MIL-STD-19500 /228

  • Suffix "-H" for Halogen-free part, ex. FM751V-NL-H. Low reverse current and low forward voltage Small surface mounting type SOD-323F High reliability Construction silicon epitaxial planar http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Dimensions in inches and (millimeters) SOD-323F 0.039(1.00) 0.031(0.80) 0.071(1.80) 0.063(1.60) 0.053(1.35) 0.045(1.15) 0.016(0.40) 0.010(0.25) 0.106(2.70) 0.091(2.30) 0.003(0.08) 0.016(0.40) Mechanical data
  • Case : Molded plastic,
  • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity : Indicated by cathode band
  • Mounting Position : Any
  • Weight : Approximated 0.005 gram Epoxy:UL94-V0 rated flame retardant SOD-323F Document ID Issued Date Revised Date Revision Page. Forward voltage I = 1.0 mAF V = 30 VR VF IR 0.37 V uA PARAMETER Peak reverse voltage Mean rectifying current Junction temperature Storage temperature CONDITIONS Symbol IO TJ TSTG Limits -40~+125 UNIT mA V o C o C o Maximum ratings (AT T =25 C unless otherwise noted)A VRM V V = 1 V, f = 1MHzR Reverse current Diode capacitance CT pF 0.5 2.0 125 VRDC reverse voltage 30 Peak forward surge current 60Hz for 1cycle IFSM 200 Electrical Characteristics o (AT T =25 C unless otherwise noted)A PARAMETER CONDITIONS Symbol MIN. TYP. MAX. UNIT mA FM751V-NL DS-22160B 2008/02/10 2010/12/10 C 7 Small Signal Schottky Diode

REVERSE VOLTAGE , (V) REVERSE CURRENT , (A) Rating and characteristic curves (FM751V-NL) INSTANTANEOUS FORWARD CURRENT,(A) CHARACTERISTICS FIG.1-TYPICAL FORWARD FORWARD VOLTAGE,(mV) FIG.2 - TYPICAL REVERSE CHARACTERISTICS CAPACITANCE BETWEEN TERMINALS , (pF) REVERSE VOLTAGE ,(V) FIG.3-CAPACITANCE BETWEEN TERMINALS CHARACTERISTICS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. 10u 100u DS-22160B 2008/02/10 2010/12/10 C 7

Pin Simplified outline Symbol Marking Type number Marking code FM751V-NL Suggested solder pad layout Page 4 1 2 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Dimensions in inches and (millimeters) A C B Document ID Issued Date Revised Date Revision Page. FM751V-NL DS-22160B 2008/02/10 2010/12/10 C 7 B 0.039 (1.00) A 0.059 (1.50) C 0.051 (1.30) PACKAGE SOD-323F Small Signal Schottky Diode

E B d F W PA D D1D2 C T Page 5 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 unit:mm Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Item Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F T W P A D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 1.46 2.95 1.25 Document ID Issued Date Revised Date Revision Page. FM751V-NL DS-22160B 2008/02/10 2010/12/10 C 7 Small Signal Schottky Diode

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Reel packing SOD-323F 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time TL TP Ramp-down Temperature FM751V-NL DS-22160B 2008/02/10 2010/12/10 C 7 Small Signal Schottky Diode

High reliability test capabilities http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16"±1/32" O at 245±5 C for 5 sec. O V =80% rate at T =125 C for 168 hrs.R J O Rated average rectifier current at T =25 C for 500hrs.A O T = 25 C, I = IA F O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. O 15P at T =121 C for 4 hrs.SIG A O O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. O at T =85 C, RH=85% for 1000hrs.A O at 175 C for 1000 hrs. O ± C ± 60Hz for 1cycle MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference FM751V-NL DS-22160B 2008/02/10 2010/12/10 C 7 Small Signal Schottky Diode