DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Document ID Issued Date Revised Date Revision Page. DS-22161N 2008/02/10 2010/03/10 B 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Small Signal Schottky Diode

Surface Mount Small Signal

Features

Low current rectification and high speed switching. Batch process design offers good power dissipation. Extremely small surface mount type. Up to 200mA current capability. Low forward voltage drop (VF = 0.60V typ. @200mA) Silicon epitaxial planar chip, metal silicon junction. Lead-free parts for green partner, exceeds environmental standards of MIL-STD-19500 /228 Suffix "-H" indicates Halogen-free part,ex.FM723-NL-H. Forward voltage I = 200 mA F Reverse current V = 30 VR VF IR 0.60 V uA PARAMETER Repetitive peak reverse voltage Mean rectifying current Forward surge current Capacitance between terminals Storage temperature Operating temperature 60Hz for 1cycle f=1MHz and applied 10V DC reverse voltage CONDITIONS Symbol VRM IO IFSM CT TJ TSTG MIN. -55 -65 TYP. MAX. 200 1500 +125 +125 UNIT V mA mA pF o C o C http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FM723-NL Dimensions in inches and (millimeters) SOD-323F 0.039(1.00) 0.031(0.80) 0.071(1.80) 0.063(1.60) 0.053(1.35) 0.045(1.15) 0.016(0.40) 0.010(0.25) 0.106(2.70) 0.091(2.30) 0.003(0.08) 0.016(0.40) Mechanical data

  • Case : Molded plastic,
  • Terminals : Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity : Indicated by cathode band
  • Mounting Position : Any
  • Weight : Approximated 0.005 gram Epoxy:UL94-V0 rated flame retardant SOD-323F Document ID Issued Date Revised Date Revision Page. Small Signal Schottky Diode o Maximum ratings and (AT T =25 C unless otherwise noted)AElectrical Characteristics DS-22161N 2008/02/10 2010/03/10 B 7

Rating and characteristic curves (FM723-NL) Fig. 1 Forward characteristics REVERSE CURRENT : (A) REVERSE VOLTAGE : (V) 4010 20 0.1 10m 100 Fig. 2 Reverse characteristics 125 C 75 C 25 C 1000 FORWARD CURRENT : (mA) 100 FORWARD VOLTAGE : (V) 125C C75C C O O O O O O O 100 25 50 75 100 Io CURRENT (%) AMBIENT TEMPERATURE : TA Fig. 4 Derating curve (mounting on glass epoxy PCBs) 125 150 1 5 10 15 20 25 30 35 CAPACITANCE BETWEEN TERMINALS : (pF) REVERSE VOLTAGE : V FIG.3-TYPICAL TERMINALS CAPACITANCE 100 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. DS-22161N 2008/02/10 2010/03/10 B 7

Pin Simplified outline Symbol Marking Type number Marking code FM723-NL S4 Suggested solder pad layout Page 4 1 2 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FM723-NL Dimensions in inches and (millimeters) A C B B 0.039 (1.00) A 0.059 (1.50) C 0.051 (1.30) PACKAGE SOD-323F Document ID Issued Date Revised Date Revision Page. Small Signal Schottky Diode DS-22161N 2008/02/10 2010/03/10 B 7

E B d F W PA D D1D2 C T Page 5 Formosa MS http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FM723-NL unit:mm Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Item Tolerance SOD-323F Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width E B C d F T W P A D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 1.46 2.95 1.25 Document ID Issued Date Revised Date Revision Page. Small Signal Schottky Diode DS-22161N 2008/02/10 2010/03/10 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FM723-NL Document ID Issued Date Revised Date Revision Page. Small Signal Schottky Diode Reel packing SOD-323F 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3 /sec Preheat o -Temperature Min(Tsmin) 150 C o -Temperature Max(Tsmax) 200 C -Time(min to max)(ts) 60~120sec Tsmax to TL o -Ramp-upRate <3 C/sec Time maintained above: o -Temperature(TL) 217 C -Time(tL) 60~260sec o o Peak Temperature(TP) 255 C-0/+5 C o Time within 5 C of actual Peak Temperature(tP) o Ramp-down Rate <6 C/sec o Time 25 C to Peak Temperature <6minutes o C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices o o C C Suggested thermal profiles for soldering processes Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat o t25 C to Peak Time TL TP Ramp-down Temperature DS-22161N 2008/02/10 2010/03/10 B 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FM723-NL Document ID Issued Date Revised Date Revision Page. Small Signal Schottky Diode 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Thermal Shock 9. Forward Surge 10. Humidity 11. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16"±1/32" O at 245±5 C for 5 sec. O V =80% rate at T =125 C for 168 hrs.R J O Rated average rectifier current at T =25 C for 500hrs.A O T = 25 C, I = IA F O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. O 15P at T =121 C for 4 hrs.SIG A O O -55 C to +125 C dwelled for 30 min. and transferred for 5min. total 10 cycles. O O 0 C for 5 min. rise to 100 C for 5 min. total 10 cycles. 60Hz for1 cycle O at T =85 C, RH=85% for 1000hrs.A O at 175 C for 1000 hrs. O ± C ± MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 JESD22-A102 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-1056 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 Item Test Conditions Reference High reliability test capabilities DS-22161N 2008/02/10 2010/03/10 B 7