FM240-MHT

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Technical content

Formosa MSFM220-MHT THRU FM2200-MHT List Chip Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. DS-12163Z 2009/08/10 2014/11/05 C 7

2.0A Surface Mount Schottky Barrier Rectifiers - 20V-200V PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Diode junction capacitance Storage temperature See Fig.1 8.3ms single half sine-wave (JEDEC methode) f=1MHz and applied 4V DC reverse voltage Symbol MIN. TYP. MAX. UNIT IO IFSM IR CJ TSTG A A mA O C pF 2.0 0.2 +175-65 FM220-MHT FM230-MHT FM240-MHT -55 to +125 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I =2.0A F V = V T = 25 CR RRM J O V = V T = 100 CR RRM J O 160 VF (V) FM250-MHT FM260-MHT 0.70 0.50 -55 to +150FM280-MHT FM2100-MHT 0.85 100 100 Formosa MS Chip Schottky Barrier Rectifier (C ) O Operating temperature T,J http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, l Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228

Features

• Tiny plastic SMD package. ow forward voltage drop. High surge capability. Guardring for overvoltage protection. Suffix "-H" indicates Halogen-free part, ex.FM220-MHT-H. Mechanical data Epoxy : UL94-V0 rated flame retardant Case : Molded plastic, SOD-123HT Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by cathode band Mounting Position : Any Weight : Approximated 0.011 gram Document ID Issued Date Revised Date Revision Page. FM2150-MHT 150150 105 FM2200-MHT 200200 140 0.92 FM220-MHT THRU FM2200-MHT 0.90 Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) Thermal resistance RθJA O C/W72Junction to ambient RθJC O C/W36Junction to case Package outline Dimensions in inches and (millimeters) SOD-123HT 0.047(1.2) 0.039(1.0) 0.146(3.7) 0.130(3.3) 0.012(0.3) Typ. 0.071(1.8) 0.055(1.4) 0.039(1.0) 0.024(0.6) 0.031(0.8) Typ. 0.047(1.2) 0.039(1.0) 0.032(0.8) 0.024(0.6) 0.051(1.3) 0.043(1.1) 0.0335(0.85) 0.0296(0.75) 0.016(0.4)Typ. 0.075(1.9) 0.083(2.1) 0.004(0.10)Typ. DS-12163Z 2009/08/10 2014/11/05 C 7

Rating and characteristic curves (FM220-MHT THRU FM2200-MHT) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FOR WARD CURRENT ,(A) 0.4 0.8 1.2 1.6 2.0 2.4 FM220-MHT~FM240-MHT FM250-MHT~FM2200-MHT LEAD TEMPERATURE,( C)° 0 20 40 60 80 100 120 140 160 180 200 FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60Hz 11 0 5 50 100 T =25 CJ 8.3ms Single Half Sine Wave JEDEC method PEAK FOR WARD SURGE CURRENT ,(A) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FIG.4-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE,(V) JUNCTION CAP ACITANCE,(pF) 700 600 500 400 300 200 100 .01 .05 .1 .5 1 5 10 50 100 FIG.5 - TYPICAL REVERSE CHARACTERISTICS REVERSE LEAKAGE CURRENT , (mA) 0.001 0.01 0.1 1.0 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) 20 40 60 80 100 20V~40V 50V~200V T2 5 CJ= ° T 100 CJ= ° 0.1 1.0 .01 INSTANTANEOUS FOR WARD CURRENT ,(A) FORWARD VOLTAGE,(V) Pulse Width 300us 1% Duty Cycle 3.0 T =25 CJ FIG.2-TYPICAL FORWARD CHARACTERISTICS 20V ~ 40V 50V ~ 60V 80V ~ 100V 150V~200V DS-12163Z 2009/08/10 2014/11/05 C 7

Chip Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Pinning information 1 221 Pin1 cathode Pin2 anode Pin Simplified outline Symbol Suggested solder pad layout Dimensions in inches and (millimeters) SOD-123HT Document ID Issued Date Revised Date Revision Page. 0.028 (0.70) 0.075 (1.90) 0.044 (1.10) 0.036 (0.90) 0.036 (0.90) 0.048 (1.20) FM220-MHT THRU FM2200-MHT DS-12163Z 2009/08/10 2014/11/05 C 7

Chip Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Packing information E B d F W PA D D1D2 C T Item Tolerance SOD-123HT Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width P E B C d F T W P A D D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 2.00 3.85 1.10 FM220-MHT THRU FM2200-MHT DS-12163Z 2009/08/10 2014/11/05 C 7

Chip Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Reel packing SOD-123HT 7" 3,000 4.0 30,000 183*123*183 178 382*257*387 240,000 9.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) Profile Feature Soldering Condition Average ramp-up rate(T to T ) <3 /sec Preheat -Temperature Min(Tsmin) 150 -Temperature Max(Tsmax) 200 -Time(min to max)(t ) 60~120sec Tsmax to T -Ramp-upRate <3 /sec Time maintained above: -Temperature(T ) 217 -Time(t ) 60~260sec Peak Temperature(T ) 255 0/ 5 Time within 5 of actual Peak Temperature(t ) Ramp-down Rate <3 /sec Time 25 to Peak Temperature <6minutes LP s L L L P P o o o o o oo o o o C C C C C C- + C C C C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55% 25% 2.Reflow soldering of surface-mount devices oo CC Suggested thermal profiles for soldering processes Critical Zone TL to TP Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat t25 C to Peak o Time TL TP Ramp-down Temperature FM220-MHT THRU FM2200-MHT DS-12163Z 2009/08/10 2014/11/05 C 7

Chip Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FM220-MHT THRU FM2200-MHT 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Forward Surge 9. Humidity 10. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. V =80% rate at T =125 for 168 hrs. Rated average rectifier current at T =25 for 500hrs. T = 25 C, I = I On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15P at T =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at T =85 , RH=85% for 1000hrs. at 175 for 1000 hrs. ±C ± C C C CC C C O O O O O OO O O RJ A AF O SIG A A O MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 JESD22-A102 Item Test Conditions Reference High reliability test capabilities DS-12163Z 2009/08/10 2014/11/05 C 7