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Technical content

FM240-MH1 THRU FM2200-MH1 Formosa MS List Chip Schottky Barrier Rectifier http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. DS-12164D 2013/12/17 - A 7

Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Low power loss, high efficiency. High current capability, l Ultra high-speed switching. Silicon epitaxial planar chip, metal silicon junction. Lead-free parts meet environmental standards of MIL-STD-19500 /228

Features

  • Tiny plastic SMD package. ow forward voltage drop. High surge capability. Guardring for overvoltage protection.
  • Suffix "-H" indicates Halogen free parts, ex. FM240-ΜΗ1-H. Page 2 2.0A Surface Mount Schottky Barrier Rectifiers - 40V-200V http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FM240-MH1 THRU FM2200-MH1 Formosa MS Chip Schottky Barrier Rectifier Mechanical data Epoxy : UL94-V0 rated flame retardant Case : Molded plastic, Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by cathode band Mounting Position : Any SOD-123H1 Weight : Approximated 0.0103 gram UNITS Volts Volts Volts Volts Amps Amps °C W/ °C W/ mA pF FM2200-MH1 Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) 0.92 200 140 200 FM2150-MH1 150 105 150 0.90 FM2100-MH1 -+55 to 150 -+55 to 150 100 2 0. 0.5 160 100 0.85 FM260-MH1 0.70 FM240-MH1 -+55 to 125 0.50 Notes 1: Measured at 1 0 MHz and applied reverse voltage of 4.0 Volts. SYMBOLS TSTG IO VF IR CJ RθJA TJ VDC RθJC VRRM IFSM VRMS Peak forward surge current 8 3ms single half sine wave.- Maximum instantaneous forward voltage at I 2 0A=.F =100 =25TJ TJ Typical thermal resistance junction to ambient Maximum average forward rectified current Typical thermal resistance junction to case Maximum repetitive peak reverse voltage Operating junction temperature range Typical junction capacitance Note 1() Maximum DC reverse current Maximum DC blocking voltage at rated DC blocking voltage Storage temperature range PARAMETER Maximum RMS voltage ()JEDEC Method DS-12164D 2013/12/17 - A 7 Package outline Dimensions in inches and (millimeters) SOD-123H1 0.031(0.8) Typ. 0.146(3.7) 0.130(3.3) 0.004(0.1) Typ. 0.031(0.8) Typ. 0.012(0.3) Typ. 0.071(1.8) 0.056(1.4) 0.040(1.0) 0.024(0.6)

0.1 1.0 .01 Rating and characteristic curves (FM240-MH1 THRU FM2200-MH1) FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FOR WARD CURRENT ,(A) INSTANTANEOUS FOR WARD CURRENT ,(A) FORWARD VOLTAGE,(V) Pulse Width 300us 1% Duty Cycle 0.4 0.8 1.2 1.6 2.0 2.4 3.0 FM240-MH1 FM260-MH1~FM2200-MH1 60V 100V 40V T =25 CJLEAD TEMPERATURE,( C)° 0 20 40 60 80 100 120 140 160 180 200 FIG.2-TYPICAL FORWARD CHARACTERISTICS FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60Hz 11 0 5 50 100 T =25 CJ 8.3ms Single Half Sine Wave JEDEC method PEAK FOR WARD SURGE CURRENT ,(A) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. 150~200V FIG.4-TYPICAL JUNCTION CAPACITANCE REVERSE VOLTAGE,(V) JUNCTION CAP ACITANCE,(pF) 700 600 500 400 300 200 100 .01 .05 .1 .5 1 5 10 50 100 FIG.5 - TYPICAL REVERSE CHARACTERISTICS REVERSE LEAKAGE CURRENT , (mA) 0.001 0.01 0.1 1.0 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) 20 40 60 80 100 40V 60V~200V T2 5 CJ= ° T 100 CJ= ° DS-12164D 2013/12/17 - A 7

Pin Simplified outline Symbol Marking Type number Marking code FM240-MH1 24 FM260-MH1 26 FM2100-MH1 20 FM2150-MH1 215 FM2200-MH1 220 Suggested solder pad layout Dimensions in inches and (millimeters) A C B Page 4 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FM240-MH1 THRU FM2200-MH1 Formosa MS Chip Schottky Barrier Rectifier B 0.051 (1.30) A 0.071 (1.80) C 0.067 (1.70) PACKAGE SOD-123H1 DS-12164D 2013/12/17 - A 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FM240-MH1 THRU FM2200-MH1 Formosa MS Chip Schottky Barrier Rectifier Packing information E B d F W PA D D1D2 C T unit:mm Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Item Tolerance SOD-123H1 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width P E B C d F T W P A D D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 2.00 3.85 1.10 DS-12164D 2013/12/17 - A 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FM240-MH1 THRU FM2200-MH1 Formosa MS Chip Schottky Barrier Rectifier Reel packing SOD-123H1 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.5 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) Profile Feature Soldering Condition Average ramp-up rate(T to T ) <3 /sec Preheat -Temperature Min(Tsmin) 150 -Temperature Max(Tsmax) 200 -Time(min to max)(t ) 60~120sec Tsmax to T -Ramp-upRate <3 /sec Time maintained above: -Temperature(T ) 217 -Time(t ) 60~260sec Peak Temperature(T ) 255 0/ 5 Time within 5 of actual Peak Temperature(t ) Ramp-down Rate <6 /sec Time 25 to Peak Temperature <6minutes LP s L L L P P o o o o o oo o o o C C C C C C- + C C C C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55%±25% 2.Reflow soldering of surface-mount devices oo CC Suggested thermal profiles for soldering processes Critical Zone TL to TP Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat t25 C to Peak o Time TL TP Ramp-down Temperature DS-12164D 2013/12/17 - A 7

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. FM240-MH1 THRU FM2200-MH1 Formosa MS Chip Schottky Barrier Rectifier DS-12164D 2013/12/17 - A 7 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Forward Surge 9. Humidity 10. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. V =80% rate at T =125 for 168 hrs. Rated average rectifier current at T =25 for 500hrs. T = 25 C, I = I On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15P at T =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at T =85 , RH=85% for 1000hrs. at 175 for 1000 hrs. ±C ± C C C CC C C O O O O O OO O O RJ A AF O SIG A A O MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 JESD22-A102 Item Test Conditions Reference High reliability test capabilities