FLF3215T-4R7M TDK | Alldatasheet
Document overview
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Technical content
(1/2) 001-01 / 20090818 / e531_flf3215.fm
- All specifications are subject to change without notice. SMD Inductors(Coils) For Power Line(Wound, Magnetic Shielded) FLF Series FLF3215
FEATURES
Resin mold structure: stress and shock resistant. A magnetic shield structure using plastic magnet material for the exterior. The product uses metal terminals, which realize excellent connection reliability. From 0.47µH to 100µH, all of the products are available in the E-3 series. It is lead-free compatible.
APPLICATIONS
HDDs, wirelessLAN modules, digital cameras, flat-TVs SPECIFICATIONS RECOMMENDED SOLDERING CONDITIONS REFLOW SOLDERING FLOW SOLDERING IRON SOLDERING Based on the above conditions, use a maximum product temperature of 260°C and a maximum accumulated heating time of 10 seconds as a guideline. Please contact us for details. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions (3) Packaging style (4) Inductance value (5) Inductance tolerance PACKAGING STYLE AND QUANTITIES Conformity to RoHS Directive Operating temperature range –40 to +125°C [Including self-temperature rise] Storage temperature range –40 to +125°C 150˚C 180˚C 255˚C 230˚C Pre-heating 90 to 120s 40s max. 10s max. Natural cooling Time(s) 150˚C 170˚C 260˚C max. Pre-heating 60 to 120s 10s max. Natural cooling Time(s) Tip temperature 300 to 350°C Heating time 3 seconds/soldering Soldering rod specifications Output: 30W Tip diameter: 1mm FLF 3215 T - 1R0 N T Taping (reel) 1R0 1µH 100 10µH 101 100µH M± 2 0 % N ±30% Packaging style Quantity Taping 2000 pieces/reel Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(2/2) 001-01 / 20090818 / e531_flf3215.fm All specifications are subject to change without notice. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
ELECTRICAL CHARACTERISTICS
∗ Rated current:The rated current is the smaller of the values given based on the rate of inductance change (30% decrease from the initial value) or the temperature rise (temperature rise of 40°C caused by the heat generated by the product itself). Test equipment L, Q: Agilent 4294A PRECISION IMPEDANCE ANAL YZER SRF: HP8753C NETWORK ANAL YZER or equivalent Rdc: ADEX AX-114N DIGITAL OHM METER or equivalent TYPICAL ELECTRICAL CHARACTERISTICS IMPEDANCE vs. FREQUENCY CHARACTERISTICS INDUCTANCE CHANGE vs. DC SUPERPOSITION CHARACTERISTICS Inductance (µH) Inductance tolerance Q ref. Test frequency L,Q (MHz) Self-resonant frequency (MHz)min. DC resistance (Ω)±20% Rated current ∗(mA)max. Part No.Based on inductance change Based on temperature rise 0.47 ±30% 30 1 200 0.021 2800 2800 FLF3215T -R47N 1 ±30% 30 1 100 0.03 2000 2350 FLF3215T -1R0N 2.2 ±20% 20 1 60 0.05 1400 1800 FLF3215T -2R2M 4.7 ±20% 20 1 40 0.09 1000 1360 FLF3215T -4R7M 10 ±20% 25 1 25 0.20 700 900 FLF3215T -100M 22 ±20% 30 1 14 0.45 450 600 FLF3215T -220M 47 ±20% 35 1 9 0.90 280 430 FLF3215T -470M 100 ±20% 40 1 6 2.00 200 280 FLF3215T -101M 3.2±0.2 2.5±0.2 1.55±0.1 0.5 1.9±0.1 Inductor Solder land pattern
1.221.2 Dimensions in mm
1μH 4.7μH 2.2μH 0.47μH 10μH 47μH 22μH 100μH 100.1 1000 100 100 1000 10000 Inductance(μH) DC current(mA) 1μH 4.7μH 2.2μH 0.47μH 10μH 47μH 22μH 100μH 0.1 0.1 100000 1000 10000 100 1 10 100 Impedance(Ω) Frequency(MHz)