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FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502 Multilayer Ferrite Chip Inductor (FL SERIES)

  • FEATURE 1. Monolithic structure for high reliability 2. Dimensions are unified for automatic mounting 3. Closed magnetic circuit avoids crosstalk and is suitable for high density printed circuit boards
  • Applications 1. Personal or notebook computers and peripheral equipment 2. Other various electronic appliances
  • Shape and Dimension
  • Specification D i m e n s i o n i n m / m ( i n i n c h e s ) TYPE A B C D Note1: Test equipment: HP 4291A Impedance analyzer Note2: Inductance tolerance: K: ±10%; M: ±20% B A C D Ferrite TERMINAL ELECTRODE

FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502

  • Electrical characteristics Part Number Inductance Q-value (Min) Test Frequency (MHz) Self-resonant Frequency(MHz) Min DC Resistance (Ω)Max Rated Current (mA) Max FL160808-47NM 0.047 10 50 260 0.30 50 FL160808-68NM 0.068 10 50 250 0.30 50 FL160808-82NM 0.082 10 50 245 0.30 50 FL160808-R10K 0.10 15 25 240 0.50 50 FL160808-R12K 0.12 15 25 205 0.50 50 FL160808-R15K 0.15 15 25 180 0.60 50 FL160808-R18K 0.18 15 25 165 0.60 50 FL160808-R22K 0.22 15 25 150 0.80 50 FL160808-R27K 0.27 15 25 136 0.80 50 FL160808-R33K 0.33 15 25 125 0.85 35 FL160808-R39K 0.39 15 25 110 1.00 35 FL160808-R47K 0.47 15 25 105 1.35 35 FL160808-R56K 0.56 15 25 95 1.55 35 FL160808-R68K 0.68 15 25 90 1.70 35 FL160808-R82K 0.82 15 25 85 2.10 35 FL160808-1R0K 1.0 35 10 75 0.60 25 FL160808-1R2K 1.2 35 10 65 0.80 25 FL160808-1R5K 1.5 35 10 60 0.80 25 FL160808-1R8K 1.8 35 10 55 0.95 25 FL160808-2R2K 2.2 35 10 50 1.15 15 FL160808-2R7K 2.7 35 10 45 1.35 15 FL160808-3R3K 3.3 35 10 40 1.55 15 FL160808-3R9K 3.9 35 10 35 1.70 15 FL160808-4R7K 4.7 35 10 33 2.10 15 FL160808-5R6K 5.6 35 4 22 1.55 5 FL160808-6R8K 6.8 35 4 20 1.70 5 FL160808-8R2K 8.2 35 4 18 2.10 5 FL160808-100K 10 30 2 17 1.85 3 FL160808-120K 12 30 2 15 2.10 3 FL201209-47NM 0.047 15 50 320 0.20 300 FL201209-68NM 0.068 15 50 280 0.20 300 FL201209-82NM 0.082 15 50 255 0.20 300 FL201209-R10K 0.10 20 25 235 0.30 250 FL201209-R12K 0.12 20 25 220 0.30 250

FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502 Part Number Inductance Q-value (Min) Test Frequency (MHz) Self-resonant Frequency(MHz) Min DC Resistance (Ω)Max Rated Current (mA) Max FL201209-R15K 0.15 20 25 200 0.40 250 FL201209-R18K 0.18 20 25 185 0.40 250 FL201209-R22K 0.22 20 25 170 0.50 250 FL201209-R27K 0.27 20 25 150 0.50 250 FL201209-R33K 0.33 20 25 145 0.55 250 FL201209-R39K 0.39 25 25 135 0.65 200 FL201209-R47K 0.47 25 25 125 0.65 200 FL201209-R56K 0.56 25 25 115 0.75 150 FL201209-R68K 0.68 25 25 105 0.80 150 FL201209-R82K 0.82 25 25 100 1.00 150 FL201209-1R0K 1.0 45 10 75 0.40 50 FL201209-1R2K 1.2 45 10 65 0.50 50 FL201209-1R5K 1.5 45 10 60 0.50 50 FL201209-1R8K 1.8 45 10 55 0.60 50 FL201209-2R2K 2.2 45 10 50 0.65 30 FL201212-2R7K 2.7 45 10 45 0.75 30 FL201212-3R3K 3.3 45 10 41 0.80 30 FL201212-3R9K 3.9 45 10 38 0.90 30 FL201212-4R7K 4.7 45 10 35 1.00 30 FL201212-5R6K 5.6 50 4 32 0.90 15 FL201212-6R8K 6.8 50 4 29 1.00 15 FL201212-8R2K 8.2 50 4 26 1.10 15 FL201212-100K 10 50 2 24 1.15 15 FL201212-120K 12 50 2 22 1.25 15 FL201212-150K 15 30 1 19 0.80 5 FL201212-180K 18 30 1 18 0.90 5 FL201212-220K 22 30 1 16 1.10 5

FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502

  • Reliability Test 1. Reflow soldering conditions Pre－heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150℃ max.Also cooling into solvent afte r soldering should be in such a way that the temperature difference is limited to 100℃ max. Unenough pre－heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode, When soldering isrepeated, allowable time is the accumulated time.

1.1 Reworking with soldering iron

˙Reworking should be limited to only one time. N o t e ：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock.

1.2 Solder V olume

Solder shall be used not to be exceed the upper limits as shown below. Accordingly increasing the solder volume, th e mechanical stress to product is also increased. Exceeding solder volume may ca use the failure of mechanical or electrical performance. 2. IMPEDANCE

2.1 Impedance shall be measured with HP－4291A impedance analyzer or equivalent system

FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502 1. MECHANICAL CHARACTERISTICS 4. RELIABILITY AND TEST CONDITIONS

4.1 HIGH TEMPERATURE RESISTANCE

a. Performance specification 1 . A p p e a r a n c e：no mechanical damage 2. Impedance shall be with ±30﹪of the initial value b. Test condition 1 . T e m p e r a t u r e 1 2 5℃±2℃ 2. Applied current ：Rated current 3 . T e s t i n g t i m e：1008±12hrs (maximum value) 4. Measurement ：After placing at room ambient temperature for 24 hours minimum

FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502

4.2 HUMIDITY RESISTANCE

a. Performance specification 1 . A p p e a r a n c e：no mechanical damage 2. Impedance shall be with ±30﹪ of the initial value b. Test condition 1 . H u m i d i t y：90 to 95﹪RH 2 . T e m p e r a t u r e：40±2℃ 3. Applied current ：Rated current (maximum value) 4. Testing tine ：1008±12hours 5. Measurement ：After placing at room ambient temperature for 24 hours minimum

4.3 TEMPERATURE CYCLE

a. Performance specification 1 . A p p e a r a n c e：no mechanical damage 2. Impedance shall be with ±30﹪of the initial value b. Test condition 1. Temperature -55 ℃,+125℃ kept stabilized fo r 30 minutes each 2 . C y c l e：100 cycles 3. Measurement ：After placing for 24hours minimum at room ambient temperature 4. step1. -55 ℃ temp ±3℃ 3 0 ±3 minutes step2. Room temperature 2to5 minutes s t e p 3 . + 1 2 5℃ temp ±2℃ 30 ±3 minutes step4. room temperature 2to5 minutes

4.4 LOW TEMPERATURE STORAGE LIFE TEST

a. Performance specification 1 . A p p e a r a n c e：no mechanical damage 2. Impedance shall be with ±30﹪of the initial value b. Test condition 1 . T e m p e r a t u r e - 5 5℃±2℃ 2 . T e s t i n g t i m e：1008±12hours 3 . M e a s u r e m e n t： After placing for 24 hours minimum at room ambient temperature 5. STORAGE

5.1 The solderability of the external electrode may be deteriorated if packages are stored where they

are exposed to high humidity. Packages must be stored at 40℃ or less and 70 ﹪RH or less.

5.2 The solderability of the external electrode may be deteriorated if packages are stored where they

are exposed to dust or harmful gas (hydrogen chloride,sulfurous acid gas or hydrogen sulfide).

5.3 Packaging material may be deformed if packages are stored where they are exposed to heat or

direct sun －light.

FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS Your Perfect Inductor Ver. 1502

5.4 Minimum packages, such as polyvinyl heat－seal packages shall not be opened until just

before they are used. If opened, use the reels as soon as possible. 5.5 Solderability specified in composite specification page.3 shall be for 6 months from the date of delivery on condition that they are stored at the environment specified clause 5-1 & 5-2. For those parts which passed more than 6 months shall be checked solderability before it is used.