FEMTOSMDC012F

SMD250F_V01 LITTELFUSE | Alldatasheet

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Technical content

PolySwitch Resettable Devices– Surface-mount Devices 115

• Smaller size saves board space and cost
• Many product choices give engineers more design flexibility
• Compatible with high-volume electronics assembly
• Assists in meeting regulatory requirements
• Higher voltage ratings allow use in new applications
• RoHS compliant
• Halogen free (refers to: Br/H11349900ppm, Cl/H11349900ppm, Br+Cl/H113491500ppm)
• Broadest range of resettable devices available in the industry
• Current ratings from 0.05 to 3A
• Voltage ratings from 6V computer and electronic applications to 60V telecom applications
• Agency recognition: UL, CSA, TÜV
• Small footprint
• Fast time-to-trip
• Low resistance
• Computer
• Portable electronics
• Multimedia Benefits Features

Applications

• Game machines
• Telephony and broadband
• Mobile phones
• Automotive
• Industrial controls
• Battery PolySwitch surface-mount devices are the preferred circuit protection method for computer, consumer, multimedia, portable, and automotive electronics applications. In an affort to reduce the size and cost of surface-mount devices, we introduced the miniSMD product series in 1995. Subsequently, we developed the microSMD, nanoSMD, picoSMD and femtoSMD family of products. The femtoSMD series reduced the device size to a 1608mm (0603 mils) footprint, one twelfth the size of the popular miniSMD series. Recent additions to the PolySwitch surface-mount series include 0.5A picoSMD 1210mm (0805 mils) and 0.35A femtoSMD 1608mm (0603 mils) devices. PolySwitch Resettable Devices Surface-mount Devices

116 RoHS Compliant, ELV Compliant HF Halogen Free

Application Selection Table for Surface-mount Devices AC adapter input power use w/ Zener & triac SMD250F SMD250F SMD200F Battery pack protection nanoSMDC150F miniSMDC260F miniSMDE190F Charger protection nanoSMDC050F miniSMDC110F/16 nanoSMDC075F CPU/IC protection nanoSMDC110F nanoSMDC150F nanoSMDC075F Data acquisition/sensor microSMD005F - microSMD005F DC input/output power ≤6V nanoSMDC075F nanoSMDC150F nanoSMDC050F/13.2 ≤12V miniSMDC075F miniSMDC110F/16 miniSMDC075F DDC nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 Device bay system DB12, DB20 miniSMDC200F miniSMDC260F miniSMDC200F DB32 miniSMDC260F SMD300F miniSMDC200F Ethernet/LAN nanoSMDC050F/13.2 miniSMDC110F/16 nanoSMDC075F Fan microSMD035F microSMD050F microSMD035F HDMI picoSMDC035S picoSMDC035S picoSMDC035S IEEE 802.3af VOIP decaSMDC050F/60 decaSMDC050F/60 decaSMDC050F/60 IEEE-1394 power provider SMD100F/33 SMD185F SMD100F/33 alt. power provider SMD185F SMD185F SMD150F/33 self-powered SMD185F SMD185F SMD150F/33 LCD inverter nanoSMDC050F/13.2 miniSMDC110F/16 nanoSMDC075F LCD screen power nanoSMDC050F/13.2 nanoSMDC050F/13.2 microSMD035F LNB (Low Noise Block) SMD075F SMD075F SMD050F Motor ≤6V nanoSMDC110F nanoSMDC150F microSMD075F ≤13.2V miniSMDC075F miniSMDC110F/16 miniSMDC075F PS/2 mouse/keyboard nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 Signal - data communication≤6V nanoSMDC075F nanoSMDC075F nanoSMDC075F ≤13.2V miniSMDC050F miniSMDC075F miniSMDC020F ≤30V SMD030F-2018 SMD075F SMD050F SCSI nanoSMDC110F nanoSMDC150F nanoSMDC075F SIM/Smart card reader femtoSMDC010F femtoSMDC010F femtoSMDC005F Telecom - modem Digital line OC miniSMDC014F miniSMDC014F miniSMDC014F Telecom - PBX Subscriber OC miniSMDC014F miniSMDC014F miniSMDC014F Temperature sensor CPU nanoSMDC050F/13.2 nanoSMDC075F nanoSMDC050F/13.2 USB Individual Port nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 2 port ganged nanoSMDC150F miniSMDC150F miniSMDC125F 3 port ganged miniSMDC200F miniSMDC200F miniSMDC200F Note :This list is not exhaustive. TE Circuit Protection welcomes our customers’ input for additional application ideas for PolySwitch resettable devices. Protection Application Additional Comments PolySwitch Resettable Devices - Key Selection Criteria FastTime-to-trip Small Size Low Resistance (T emperature Protection)

• The table below lists PolySwitch surface-mount devices typically used in these applications.
• Specifications for the suggested PolySwitch surface-mount device part numbers can be found in this section.
• Once a part has been selected, the user should evaluate and test each product for the intended application. Overcurrent Overvoltage

PolySwitch Resettable Devices– Surface-mount Devices 117RoHS Compliant, ELV Compliant HF Halogen Free femtoSMD picoSMD nanoSMD microSMD miniSMD midSMD SMD SMD2 miniSMDE decaSMD Size mm 1608 2012 3216 3225 4532 5050 7555 8763 11550 5050 Hold Current (A) 0.100 12V DC /8.00 Ω 15V DC /11.00 Ω — 30V DC /15 Ω 60VDC /12.70Ω —— — — — 0.120 9V DC /5.80Ω 15V DC /9.00 Ω 48VDC /6.50Ω —— — — — — — 0.300 —— — — 30VDC /1.75 Ω 60VDC /2.30Ω 60VDC /4.80Ω —— — * Data is preliminary Table S1Product Series: Size, Current Rating, Voltage Rating/Maximum Resistance for Surface-mount Devices

118 RoHS Compliant, ELV Compliant HF Halogen Free

Maximum AmbientT emperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C femtoSMDC Series Size 1608 mm/0603 mils picoSMDC Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils * Data is preliminary Table S2Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)] NEW comingsoon NEW NEW NEW NEW NEW NEW NEW comingsoon NEW NEW

PolySwitch Resettable Devices– Surface-mount Devices 119RoHS Compliant, ELV Compliant HF Halogen Free Maximum AmbientT emperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Series Size 8763 mm/3425 mils Table S2Thermal Derating for Surface-mount Devices [Hold Current (A) at Ambient Temperature (°C)] Cont’d

120 RoHS Compliant, ELV Compliant HF Halogen Free

• Data is preliminary Part Number IH (A) IT (A) V MAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-T rip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions Table S3Electrical Characteristics for Surface-mount Devices at Room Temperature % of rated hold and trip current AmbientT emperature (˚C) 200 180 160 140 120 100 -40 -20 0 20 40 60 80 100 120 B A A B C C Figure S1A= femtoSMD / picoSMD / nanoSMD / microSMD / miniSMD / decaSMD and SMD B= miniSMDE190F C= SMDH120 and SMDH160 Figure S1Thermal Derating Curve for Surface-mount Devices NEW comingsoon NEW NEW NEW NEW NEW NEW NEW comingsoon NEW NEW

PolySwitch Resettable Devices– Surface-mount Devices 121RoHS Compliant, ELV Compliant HF Halogen Free microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils Part Number IH (A) IT (A) V MAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-T rip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions Table S3Electrical Characteristics for Surface-mount Devices at Room TemperatureCont’d

122 RoHS Compliant, ELV Compliant HF Halogen Free

(A) IT (A) V MAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-T rip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions Table S3Electrical Characteristics for Surface-mount Devices at Room TemperatureCont’d C A B ED Figure S2 BH C F G A D E Figure S4 B F A D E C Figure S3 Figure S2-S4 Dimension Figures for Surface-mount Devices femtoSMDC Series Size 1608 mm/0603 mils Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. Table S4Dimensions for Surface-mount Devices in Millimeters (Inches) NEW NEW NEW NEW NEW NEW

PolySwitch Resettable Devices– Surface-mount Devices 123RoHS Compliant, ELV Compliant HF Halogen Free Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. Table S4Dimensions for Surface-mount Devices in Millimeters (Inches) Cont’d picoSMDC Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils comingsoon NEW NEW NEW comingsoon NEW

124 RoHS Compliant, ELV Compliant HF Halogen Free

Table S4Dimensions for Surface-mount Devices in Millimeters (Inches) Cont’d Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max.

PolySwitch Resettable Devices– Surface-mount Devices 125RoHS Compliant, ELV Compliant HF Halogen Free midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Devices Size 8763 mm/3425 mils Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. Table S4Dimensions for Surface-mount Devices in Millimeters (Inches) Cont’d

126 RoHS Compliant, ELV Compliant HF Halogen Free

Time-to-trip (s) Fault Current (A) 0.1 0.01 0.001 0.1 1 10010 A A B B D D E E F F G G H H I I J J C C Figure S7nanoSMDCxxxF A= nanoSMDC012F B= nanoSMDC016F C= nanoSMDC020F D= nanoSMDC025F E= nanoSMDC035F F= nanoSMDC050F/13.2 G= nanoSMDC075F H= nanoSMDC110F I= nanoSMDC150F J= nanoSMDC200F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.01 0.1 101 A A B B C C D D E E G F GF Figure S5femtoSMDCxxxF A = femtoSMDC005F B = femtoSMDC008F C = femtoSMDC010F D= femtoSMDC012F E= femtoSMDC016F F= femtoSMDC020F G= femtoSMDC035F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.0001 0.1 1 10010 A A B B C CD D E F G E F G Figure S6picoSMDCxxxS A= picoSMDC010S B= picoSMDC012S C= picoSMDC020S D= picoSMDC035S E= picoSMDC050S F= picoSMDC075S* G= picoSMDC110S* * Data is preliminary Figure S5-S12Typical Time-to-trip Curves at 20°C for Surface-mount Devices

PolySwitch Resettable Devices– Surface-mount Devices 127RoHS Compliant, ELV Compliant HF Halogen Free Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 100.1 1 100 A A B B C C D D E E F F G G H H I I J J K K M M L L N N O O Q Q R R S S T T P P Figure S9 miniSMDCxxxF and miniSMDExxxF A= miniSMDC010F , miniSMDC014F B= miniSMDC020F C= miniSMDC030F D= miniSMDC050F E= miniSMDC075F F= miniSMDC075F/24 G= miniSMDC100F , miniSMDC110F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10 100 A A B B C C D E F G H I D E F G H I Figure S8 microSMDxxxF A= microSMD005F B= microSMD010F C= microSMD035F D= microSMD050F E= microSMD075F F= microSMD110F G= microSMD150F H= microSMD175F I= microSMD200F Figure S5-S12Typical Time-to-trip Curves at 20°C for Surface-mount Devices Cont’d H= miniSMDC110F/16 I= miniSMDC110F/24 J= miniSMDC125F K= miniSMDC125F/16 L= miniSMDC150F , miniSMDC150F/12 M= miniSMDC150F/16 N= miniSMDC150F/24 O= miniSMDC160F P= miniSMDE190F Q= miniSMDC200F R= miniSMDC260F S= miniSMDC260F/12, miniSMDC260F/13.2, miniSMDC260F/16 T= miniSMDC300F

128 RoHS Compliant, ELV Compliant HF Halogen Free

Figure S5-S12Typical Time-to-trip Curves at 20°C for Surface-mount Devices Cont’d Time-to-trip (s) Fault Current (A) 1 10 100 B B A A C C E E D D 100 0.1 0.01 Figure S12SMD2xxxF A= SMD150F , SMD150F/33 B= SMDH160 C= SMD185F D= SMD200F E= SMD250F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.1 1 10010 B B A A C C D D E E Figure S10midSMD A= SMD030F-2018 B= decaSMDC050F/60 C= SMD100F-2018 D= SMD150F-2018 E= SMD200F-2018 Time-to-trip (s) Fault Current (A) 0.1 1 10 100 B B A A C C E E D D F F G G H H 100 0.1 0.01 Figure S11SMDxxxF A= SMD030F B= SMD050F C= SMD075F , SMD075F/60 D= SMD100F , SMD100F/33 E= SMDH120 F= SMD125F G= SMD260F H= SMD300F , SMD300F/15

PolySwitch Resettable Devices– Surface-mount Devices 129RoHS Compliant, ELV Compliant HF Halogen Free Physical Characteristics Terminal pad material 100% matte tin with nickel underplate Soldering characteristics ANSI/J-STD-002 Category 3 for femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series ANSI/J-STD-002 Category 1 for SMD series Solder heat withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A Flammability resistance per IEC 695-2-2 Needle Flame Test for 20 sec. Recommended storage conditions 40°C max, 70% R.H. max; devices may not meet specified ratings if storage conditions are exceeded. Environmental Specifications T est T est Method Conditions Resistance Change Storage life Raychem PS300, Section 5.3.2 60°C, 1000 hours ±3% typical 85°C, 1000 hours ±5% typical Humidity aging Raychem PS300, Section 5.3.1 85°C, 85% RH, 100 hours ±1.2% typical Thermal shock MIL-STD-202, Method 107G 85°C, -40°C (20 times) -33% typical 125°C, -55°C (10 times) -33% typical Vibration MIL-STD-883C per MIL-STD-883C No change Solvent resistance Raychem PS300, Section 5.2.2 Freon No change Trichloroethane No change Hydrocarbons No change Table S5Physical Characteristics and Environmental Specifications for Surface-mount Devices Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH120 and SMDH160 femtoSMDC Series Size 1608 mm/0603 mils picoSMDC Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils * Data is preliminary Part Number T ape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] Table S6Packaging and Marking Information for Surface-mount Devices NEW comingsoon NEW NEW NEW NEW NEW NEW NEW comingsoon NEW NEW

130 RoHS Compliant, ELV Compliant HF Halogen Free

T ape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] Table S6Packaging and Marking Information for Surface-mount Devices Cont’d

PolySwitch Resettable Devices– Surface-mount Devices 131RoHS Compliant, ELV Compliant HF Halogen Free SMD Series Size 7555 mm/2920 mils SMD2 Devices Size 8763 mm/3425 mils Part Number T ape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] Table S6Packaging and Marking Information for Surface-mount Devices Cont’d A B CB Figure S13Recommended Pad Layout for Surface-mount Devices Agency Recognition for Surface-mount Devices UL File # E74889 for all surface-mount devices CSA File # CA78165 for all surface-mount devices TÜV Certificate number available upon request (certified to IEC 60730-1)

132 RoHS Compliant, ELV Compliant HF Halogen Free

Solder Reflow and Rework Recommendation for Surface-mount Devices Classification Reflow Profiles Solder Reflow

• Recommended reflow methods: - IR - Hot air - Nitrogen
• Recommended maximum paste thickness: 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Customer should validate that the solder paste amount and reflow recommendations meet its application.
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. Rework
• femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices. Please also avoid direct contact to the device.
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device. Profile Feature Pb-Free Assembly Average ramp up rate (TsMAX toTp) 3°C/second max. Preheat
• Temperature min. (TsMIN) 150°C
• Temperature max. (TsMAX ) 200°C
• Time (tsMIN to tsMAX ) 60-120 seconds Time maintained above:
• Temperature (T L) 217°C
• Time (tL) 60-150 seconds Peak/Classification temperature (Tp) 260°C Time within 5°C of actual peak temperature Time (tp) 30 seconds max. Ramp down rate 3°C/second max. Time 25°C to peak temperature 8 minutes max. Critical Zone TL to TpRamp up t 25˚C to Peak Reflow Profile Time Ramp down ts Preheat TsMAX TL Tp tp TsMIN tL T emperature Figure S14 Note:All temperatures refer to topside of the package, measured on the package body surface. Leader min. 390 390 390 390 390 400 400 400 400 T railer min. 160 160 160 160 160 160 160 160 160

Description

Table S7Tape and Reel Specifications for Surface-mount Devices (in Millimeters)

PolySwitch Resettable Devices– Surface-mount Devices 133RoHS Compliant, ELV Compliant HF Halogen Free A max. 185 185 330 330 330 330 N min. 50 50 60 50 50 50 femto/pico/nano/microSMD miniSMDC miniSMDE190 midSMD SMD SMD2 All microSMD series except microSMD200F nanoSMDC012F nanoSMDC016F nanoSMDC200F All nanoSMDC series except nanoSMDC012F nanoSMDC016F nanoSMDC200F picoSMDC010S picoSMDC050S picoSMDC075S picoSMDC110S miniSMDC014F~075F miniSMDC100F~110F/16 miniSMDC125F~150F/16 miniSMDC160F~260F miniSMDC075F/24 miniSMDC110F/24 miniSMDC260F/12 miniSMDC260F/13.2 miniSMDC260F/16 miniSMDC150F/24 decaSMDC050F/60microSMD200F picoSMDC012S picoSMDC020S picoSMDC035S femtoSMDC012F femtoSMDC016F femtoSMDC020F femtoSMDC005F femtoSMDC008F femtoSMDC010F femtoSMDC035F Table S8Tape and Reel Specifications for Surface-mount Devices (in Millimeters) Table S9Reel Dimensions for Surface-mount Devices (in Millimeters) F W P2D0 T Cover tape Embossment Center lines of cavity ACover tape Embossed cavity Carrier tape N (hub dia.) W2 (measured at hub) W1 (measured at hub) Figure S15EIA Referenced Taped Component Dimensions for Surface-mount Devices Figure S16EIA Referenced Reel Dimensions for Surface-mount Devices

Part Numbering System for Surface-mount Devices SMD 150 F /33 -RB -2 Packaging 2 = Tape and Reel Rx = Resistance Range (Limited part number availability) Alternative Voltage Rating (If applicable) Lead Free Hold Current Indicator Product Series Warning :

• Users should independently evaluate the suitability of and test each product selected for their own application.
• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
• These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
• Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
• PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited, for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.
• Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device. RoHS Compliant, ELV Compliant HF Halogen Free