FEMTOSMDC005F

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Technical content

PolySwitchResettableDevices– Surface-mount Devices

• Smaller size saves board space and cost
• Many product choices give engineers more design flexibility
• Compatible with high-volume electronics assembly
• Assists in meeting regulatory requirements
• Higher voltage ratings allow use in new applications
• RoHS compliant
• Halogen free (refers to: Br/H11349900ppm, Cl/H11349900ppm, Br+Cl/H113491500ppm)
• Broadest range of resettable devices available in the industry
• Current ratings from 0.05 to 3A
• Voltage ratings from 6V computer and el ectronic applications to 60V telecom applications
• Agency recognition: UL, CSA, TÜV
• Small footprint
• Fast time-to-trip
• Low resistance
• Computer
• Portable electronics
• Multimedia Benefits Features

Applications

• Game machines
• Telephony and broadband
• Mobile phones
• Automotive
• Industrial controls
• Battery PolySwitch surface-mount devices are the preferred circuit protection method for computer, consumer, multimedia, portable, and automotive electronics applications. In an affort to reduce the size and cost of surface-mount devices, we introduced the miniSMD product series in 1995. Subsequently, we developed the microSMD, nanoSMD, picoSMD and femtoSMD family of p ro ducts. The femtoSMD series reduced the device size to a 1608mm (0603 mils) footprint, one twelfth the size of the popular miniSMD series. Recent additions to the PolySwitch surface-mount series include 3.0A miniSMD 4532mm (1812 mils), 2.0A nanoSMD 3216mm (1206 mils) and 0.16A femtoSMD 1608mm (0603 mils) devices. PolySwitchResettableDevices Surface-mount Devices

92 RoHS Compliant, ELV Compliant HF Halogen Free

ApplicationSelectionTableforSurface-mountDevices AC adapter input power use w/ Zener & triac SMD250F SMD250F SMD200F Battery pack protection nanoSMDC150F miniSMDC260F miniSMDE190F Charger protection nanoSMDC050F miniSMDC110F/16 nanoSMDC075F CPU/IC protection nanoSMDC110F nanoSMDC150F nanoSMDC075F Data acquisition/sensor microSMD005F - microSMD005F DC input/output power ≤6V nanoSMDC075F nanoSMDC150F nanoSMDC050F/13.2 ≤12V miniSMDC075F miniSMDC110F/16 miniSMDC075F DDC nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 Device bay system DB12, DB20 miniSMDC200F miniSMDC260F miniSMDC200F DB32 miniSMDC260F SMD300F miniSMDC200F Ethernet/LAN nanoSMDC050F/13.2 miniSMDC110F/16 nanoSMDC075F Fan microSMD035F microSMD050F microSMD035F HDMI picoSMDC035S picoSMDC035S picoSMDC035S IEEE 802.3af VOIP decaSMDC050F/60 decaSMDC050F/60 decaSMDC050F/60 IEEE-1394 power provider SMD100F/33 SMD185F SMD100F/33 alt. power provider SMD185F SMD185F SMD150F/33 self-powered SMD185F SMD185F SMD150F/33 LCD inverter nanoSMDC050F/13.2 miniSMDC110F/16 nanoSMDC075F LCD screen power nanoSMDC050F/13.2 nanoSMDC050F/13.2 microSMD035F LNB (Low Noise Block) SMD075F SMD075F SMD050F Motor ≤6V nanoSMDC110F nanoSMDC150F microSMD075F ≤13.2V miniSMDC075F miniSMDC110F/16 miniSMDC075F PS/2 mouse/keyboard nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 Signal - data communication ≤6V nanoSMDC075F nanoSMDC075F nanoSMDC075F ≤13.2V miniSMDC050F miniSMDC075F miniSMDC020F ≤30V SMD030F-2018 SMD075F SMD050F SCSI nanoSMDC110F nanoSMDC150F nanoSMDC075F SIM/Smart card reader femtoSMDC010F femtoSMDC010F femtoSMDC005F Telecom - modem Digital line OC miniSMDC014F miniSMDC014F miniSMDC014F Telecom - PBX Subscriber OC miniSMDC014F miniSMDC014F miniSMDC014F Temperature sensor CPU nanoSMDC050F/13.2 nanoSMDC075F nanoSMDC050F/13.2 USB Individual Port nanoSMDC075F nanoSMDC110F nanoSMDC050F/13.2 2 port ganged nanoSMDC150F miniSMDC150F miniSMDC125F 3 port ganged miniSMDC200F miniSMDC200F miniSMDC200F Note :This list is not exhaustive. Tyco Electronics welcomes our customers’ input for additional application ideas for PolySwitch resettable devices. Protection Application Additional Comments PolySwitch Resettable Devices - Key Selection Criteria FastTime-to-trip Small Size Low Resistance (Temperature Protection)

• The table below lists PolySwitch surface-mount devices typically used in these applications.
• Specifications for the suggested PolySwitch surface-mount device part numbers can be found in this section.
• Once a part has been selected, the user should evaluate and test each product for the intended application. Overcurrent Overvoltage

PolySwitchResettableDevices– Surface-mount Devices 93RoHS Compliant, ELV Compliant HF Halogen Free femtoSMD picoSMD nanoSMD microSMD miniSMD midSMD SMD SMD2 miniSMDE decaSMD Size mm 1608 2012 3216 3225 4532 5050 7555 8763 11550 5050 Hold Current (A) 0.100 12V DC /8.00 Ω* 15V DC /11.00Ω*— 30V DC /15Ω 60V DC /12.70Ω — — — —— 0.200 — 9V DC /3.20 Ω 24VDC /3.10Ω — 30V DC /3.30 Ω — — — —— 0.300 — ——— 30V DC /1.75Ω 60V DC /2.30 Ω 60V DC /4.80 Ω — —— 1.100 — — 6V DC /0.20 Ω 6VDC /0.21Ω 8V DC /0.21Ω — — — —— * Data is preliminary TableS1 ProductSeries:Size,CurrentRating,VoltageRating/MaximumResistancefor Surface-mountDevices

94 RoHS Compliant, ELV Compliant HF Halogen Free

Maximum AmbientTemperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C femtoSMDC Series Size 1608 mm/0603 mils picoSMDC Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils * Data is preliminary comingsoon TableS2 ThermalDeratingforSurface-mountDevices [HoldCurrent(A)atAmbientTemperature(°C)] comingsoon NEW comingsoon comingsoon NEW NEW comingsoon comingsoon NEW NEW NEW NEW

PolySwitchResettableDevices– Surface-mount Devices 95RoHS Compliant, ELV Compliant HF Halogen Free Maximum AmbientTemperature Part Number -40°C -20°C 0°C 20°C 25°C 40°C 50°C 60°C 70°C 80°C 85°C 125°C miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Series Size 8763 mm/3425 mils % of rated hold and trip current AmbientT emperature (˚C) 200 180 160 140 120 100 -40 -20 0 20 40 60 80 100 120 B A A B C C FigureS1A= femtoSMD / picoSMD / nanoSMD / microSMD / miniSMD / decaSMD and SMD B= miniSMDE190F C= SMDH120 and SMDH160 TableS2 ThermalDeratingforSurface-mountDevices [HoldCurrent(A)atAmbientTemperature(°C)] Cont’d FigureS1 ThermalDeratingCurveforSurface-mountDevices NEW

96 RoHS Compliant, ELV Compliant HF Halogen Free

• Data is preliminary Part Number IH (A) IT (A) VMAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-Trip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions TableS3 ElectricalCharacteristicsforSurface-mountDevicesatRoomTemperature comingsoon comingsoon NEW comingsoon comingsoon NEW NEW comingsoon comingsoon NEW NEW NEW NEW

PolySwitchResettableDevices– Surface-mount Devices 97RoHS Compliant, ELV Compliant HF Halogen Free miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Devices Size 8763 mm/3425 mils Part Number IH (A) IT (A) VMAX (VDC ) IMAX (A) PD MAX (W) Max.Time-to-Trip (A) (S) RMIN (Ω) R1MAX (Ω) Figure for Dimensions C A B ED FigureS2 BH C F G A D E FigureS4 B F A D E C FigureS3 TableS3 ElectricalCharacteristicsforSurface-mountDevicesatRoomTemperature Cont’d FigureS2-S4 DimensionFiguresforSurface-mountDevices NEW

98 RoHS Compliant, ELV Compliant HF Halogen Free

• Data is preliminary Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. TableS4 DimensionsforSurface-mountDevicesinMillimeters(Inches) comingsoon comingsoon NEW comingsoon comingsoon NEW NEW comingsoon comingsoon NEW

PolySwitchResettableDevices– Surface-mount Devices 99RoHS Compliant, ELV Compliant HF Halogen Free miniSMDC Series Size 4532 mm/1812 mils miniSMDE Series Size 11550 mm/4420 mils TableS4 DimensionsforSurface-mountDevicesinMillimeters(Inches) Cont’d Part Number A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. NEW NEW NEW

100 RoHS Compliant, ELV Compliant HF Halogen Free

A Min. Max. H Min. Figure B Min. Max. C Min. Max. D Min. Max. E Min. Max. F Min. Max. G Min. Max. TableS4 DimensionsforSurface-mountDevicesinMillimeters(Inches) Cont’d NEW

PolySwitchResettableDevices– Surface-mount Devices 101RoHS Compliant, ELV Compliant HF Halogen Free Time-to-trip (s) Fault Current (A) 0.1 0.01 0.001 0.1 1 10010 A A B B C D D E E F F G G H H FigureS7nanoSMDCxxxF A= nanoSMDC012F B= nanoSMDC016F C= nanoSMDC020F D= nanoSMDC035F E= nanoSMDC050F/13.2 F= nanoSMDC075F G= nanoSMDC110F H= nanoSMDC150F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.01 0.1 101 A A BC B C FigureS5femtoSMDCxxxF A = femtoSMDC005F* B = femtoSMDC010F* C = femtoSMDC016F * Data is preliminary Time-to-trip (s) Fault Current (A) 0.1 0.01 0.001 0.0001 0.1 1 10010 A A B B C C D D E E FigureS6picoSMDCxxxS A = picoSMDC010S*, picoSMDC012S* B = picoSMDC020S C = picoSMDC035S D = picoSMDC075S* E = picoSMDC100S* * Data is preliminary FigureS5-S15 TypicalTime-to-tripCurvesat20°CforSurface-mountDevices

102 RoHS Compliant, ELV Compliant HF Halogen Free

Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10 100 A A B B C CD E F G H I D E F G H I FigureS9 microSMDxxxF A= microSMD005F B= microSMD010F C= microSMD035F D= microSMD050F E= microSMD075F F= microSMD110F G= microSMD150F H= microSMD175F I= microSMD200F Time-to-trip (s) Fault Current (A) 0.1 0.01 0.001 101 100 A A FigureS8 nanoSMDC200F A= nanoSMDC200F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 100.1 1 100 A A B C D E F G I J K B C D E FG H H I JK FigureS10 miniSMDCxxxF and miniSMDExxxF A= miniSMDC010F , miniSMDC014F B= miniSMDC020F C= miniSMDC050F D= miniSMDC075F , miniSMDC075F/24 E= miniSMDC100F , miniSMDC110F , miniSMDC110F/16, miniSMDC110F/24 F= miniSMDC125F , miniSMDC125F/16 G= miniSMDC150F , miniSMDC150F/12, miniSMDC150F/16, miniSMDC150F/24 H= miniSMDC160F I= miniSMDC200F J= miniSMDE190F K= miniSMDC260F , miniSMDC260F/12, miniSMDC260F/13.2, miniSMDC260F/16 FigureS5-S15 TypicalTime-to-tripCurvesat20°CforSurface-mountDevices Cont’d

PolySwitchResettableDevices– Surface-mount Devices 103RoHS Compliant, ELV Compliant HF Halogen Free Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10010 B B A A C C D D E E FigureS13 midSMD A= SMD030F-2018 B= decaSMDC050F/60 C= SMD100F-2018 D= SMD150F-2018 E= SMD200F-2018 Time-to-trip (s) Fault Current (A) 0.1 101 100 A A FigureS12 miniSMDC300F A= miniSMDC300F Time-to-trip (s) Fault Current (A) 0.1 0.01 0.001 0.1 1 10010 A A FigureS11miniSMDC030F A= miniSMDC030F FigureS5-S15 TypicalTime-to-tripCurvesat20°CforSurface-mountDevices Cont’d

104 RoHS Compliant, ELV Compliant HF Halogen Free

Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 100.1 1 100 A A B C D E BCDE FigureS15 SMD2xxxF A= SMD150F , SMD150F/33 B= SMDH160 C= SMD185F D= SMD200F E= SMD250F Time-to-trip (s) Fault Current (A) 100 0.1 0.01 0.001 0.1 1 10 100 B B A A C C D D E E F G H FGH FigureS14 SMDxxxF A= SMD030F B= SMD050F C= SMD075F , SMD075F/60 D= SMDH120 E= SMD100F , SMD100F/33 F= SMD125F G= SMD260F H= SMD300F , SMD300F/15 PhysicalCharacteristics Terminal pad material 100% matte tin with nickel underplate Soldering characteristics ANSI/J-STD-002 Category 3 for femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series ANSI/J-STD-002 Category 1 for SMD series Solder heat withstand per IEC-STD 68-2-20, Test Tb, Section 5, Method 1A Flammability resistance per IEC 695-2-2 Needle Flame Test for 20 sec. Recommended storage conditions 40°C max, 70% R.H. max; devices may not meet specified ratings if storage conditions are exceeded. EnvironmentalSpecifications Test Test Method Conditions Resistance Change Storage life Raychem PS300, Section 5.3.2 60°C, 1000 hours ±3% typical 85°C, 1000 hours ±5% typical Humidity aging Raychem PS300, Section 5.3.1 85°C, 85% RH, 100 hours ±1.2% typical Thermal shock MIL-STD-202, Method 107G 85°C, -40°C (20 times) -33% typical 125°C, -55°C (10 times) -33% typical Vibration MIL-STD-883C per MIL-STD-883C No change Solvent resistance Raychem PS300, Section 5.2.2 Freon No change Trichloroethane No change Hydrocarbons No change FigureS5-S15 TypicalTime-to-tripCurvesat20°CforSurface-mountDevices Cont’d TableS5 PhysicalCharacteristicsandEnvironmentalSpecificationsforSurface-mountDevices Operating temperature range -40°C to 85°C, -40°C to 125°C for SMDH120 and SMDH160

PolySwitchResettableDevices– Surface-mount Devices 105RoHS Compliant, ELV Compliant HF Halogen Free femtoSMDC Series Size 1608 mm/0603 mils picoSMDC Series Size 2012 mm/0805 mils nanoSMDC Series Size 3216 mm/1206 mils microSMD Series Size 3225 mm/1210 mils miniSMDC Series Size 4532 mm/1812 mils * Data is preliminary Part Number Tape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] TableS6 PackagingandMarkingInformationforSurface-mountDevices comingsoon comingsoon NEW comingsoon comingsoon NEW NEW comingsoon comingsoon NEW NEW NEW NEW

106 RoHS Compliant, ELV Compliant HF Halogen Free

A B CB AgencyRecognitionforSurface-mountDevices UL File # E74889 for all surface-mount devices CSA File # CA78165 for all surface-mount devices TÜV Certificate number available upon request (certified to IEC 60730-1) miniSMDE Series Size 11550 mm/4420 mils midSMD Series Size 5050 mm/2018 mils SMD Series Size 7555 mm/2920 mils SMD2 Devices Size 8763 mm/3425 mils Part Number Tape & Reel Quantity Standard Package Part Marking Dimension A (Nom.) Dimension B (Nom.) Dimension C (Nom.) Agency Recognition Recommended Pad Layout Figures [mm(In.)] TableS6 PackagingandMarkingInformationforSurface-mountDevices Cont’d FigureS16 RecommendedPadLayoutforSurface-mountDevices NEW

PolySwitchResettableDevices– Surface-mount Devices 107RoHS Compliant, ELV Compliant HF Halogen Free SolderReflow

• Recommended reflow methods: - IR - Hot air - Nitrogen
• Recommended maximum paste thickness: 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Customer should valida te that the solder paste amount and reflow recommendations meet its application.
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. Rework
• femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices. Please also avoid direct contact to the device.
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device. SolderReflowandReworkRecommendationforSurface-mountDevices Critical Zone TL to TpRamp up t 25˚C to Peak Reflow Profile Time Ramp down ts Preheat TsMAX TL Tp tp TsMIN tL T emperature FigureS17 ClassificationReflowProfiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp up rate (TsMAX toTp) 3°C/second max. 3°C/second max. Preheat
• Temperature min. (TsMIN ) 100°C 150°C
• Temperature max. (TsMAX ) 150°C 200°C
• Time (tsMIN to tsMAX ) 60-120 seconds 60-120 seconds Time maintained above:
• Temperature (T L) 183°C 217°C
• Time (tL) 60-150 seconds 60-150 seconds Peak/Classification temperature (Tp) 235°C 260°C Time within 5°C of actual peak temperature Time (tp) 20 seconds max. 30 seconds max. Ramp down rate 3°C/second max. 3°C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. Note:All temperatures refer to topside of the package, measured on the package body surface.

108 RoHS Compliant, ELV Compliant HF Halogen Free

Leader min. 390 390 390 390 390 400 400 400 400 T railer min. 160 160 160 160 160 160 160 160 160

Description

A max. 185 185 330 330 330 330 N min. 50 50 60 50 50 50 femto/pico/nano/microSMD miniSMDC miniSMDE190 midSMD SMD SMD2 All microSMD series except microSMD200F nanoSMDC012F nanoSMDC016F All nanoSMDC series except nanoSMDC012F nanoSMDC016F picoSMDC075S picoSMDC100S picoSMDC EIA 481-1 femtoSMDC EIA 481-1 miniSMDC014F~075F miniSMDC100F~110F/16 miniSMDC125F~150F/16 miniSMDC160F~260F miniSMDC075F/24 miniSMDC110F/24 miniSMDC260F/12 miniSMDC260F/13.2 miniSMDC260F/16 miniSMDC150F/24 decaSMDC050F/60microSMD200F All picoSMDC series except picoSMDC075S picoSMDC100SfemtoSMDC016F femtoSMDC005F femtoSMDC010F TableS7 TapeandReelSpecificationsforSurface-mountDevices(inMillimeters) TableS8 TapeandReelSpecificationsforSurface-mountDevices(inMillimeters) TableS9ReelDimensionsforSurface-mountDevices(inMillimeters)

PolySwitchResettableDevices– Surface-mount Devices 109RoHS Compliant, ELV Compliant HF Halogen Free F W P2D0 T Cover tape Embossment Center lines of cavity PartNumberingSystemforSurface-mountDevices SMD 150 F /33 -RB -2 Packaging 2 = Tape and Reel Rx = Resistance Range (Limited part number availability) Alternative Voltage Rating (If applicable) Lead Free Hold Current Indicator Product Series ACover tape Embossed cavity Carrier tape N (hub dia.) W2 (measured at hub) W1 (measured at hub) Warning:

• Users should independently evaluate the suitability of and test each product selected for their own application.
• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
• These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.
• PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties a re inhibited, for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.
• Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device. FigureS18 EIAReferencedTapedComponentDimensionsforSurface-mountDevices FigureS19EIAReferencedReelDimensionsforSurface-mountDevices