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http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 FEGFM105 Chip Fast Efficient Rectifiers List Document ID Issued Date Revised Date Revision Page. DS-121539 2013/04/30 - A 7

1.0A Sufrace Mount Efficient Rectifiers-600VFast PARAMETER CONDITIONS Forward rectified current Forward surge current Reverse current Diode junction capacitance See Fig.2 8.3ms single half sine-wave (JEDEC methode) f=1MHz and applied 4V DC reverse voltage Symbol MIN. TYP. MAX. UNIT IO IFSM IR CJ A A μA pF 1.0 5.0V = V T = 25 CR RRM J O V = V T = 125 CR RRM J O 100 FEGFM105 600 420 SYMBOLS VRRM (V) VRMS VR (V) (V) *1 *2 *3 *1 Repetitive peak reverse voltage *2 RMS voltage *3 Continuous reverse voltage *4 Maximum forward voltage@I =1.0A *5 Reverse recovery time F Maximum , note 1 VF (V) -55 to +150600 1.30 Storage temperature TSTG O C+175-65 (C ) O Operating temperature T,J http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. High current & surge capability Lead-free parts meet environmental standards of MIL-STD-19500 /228

Features

Glass passivated chip junction.

  • Suffix "-H" indicates Halogen free parts, ex. FEGFM105-H. Low forward dropdown voltage Package outline Document ID Issued Date Revised Date Revision Page. 0.196(4.9) 0.106(2.7) 0.091(2.3) 0.068(1.7) 0.060(1.5) Dimensions in inches and (millimeters) SMA Mechanical data Epoxy:UL94-V0 rated flame retardant Case : Molded plastic, Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by cathode band Mounting Position : Any Weight : 0.05 gram DO-214AC / SMA Approximated Note 1. Reverse recovery time test condition, I =0.5A, I =1.0A, I =0.25AFRR R trr (ns) Maximum ratings and Electrical Characteristics (AT T =25A o C unless otherwise noted) FEGFM105 DS-121539 2013/04/30 - A 7 Chip Fast Efficient Rectifiers

Rating and characteristic curves (FEGFM105) FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT FIG.5-TYPICAL JUNCTION CAPACITANCE (+) (+) 25Vdc (approx.) ( ) ( ) PULSE GENERATOR (NOTE 2) OSCILLISCOPE (NOTE 1) NON- INDUCTIVE /c87 NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. 2. Rise Time= 10ns max., Source Impedance= 50 ohms. +0.5A -0.25A -1.0A 1cm SET TIME BASE FOR 10 / 20ns / cm trr D.U.T. FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS NONINDUCTIVE NONINDUCTIVE /c87 /c87 FIG.2-TYPICAL FORWARD CURRENT AVERAGE FOR WARD CURRENT ,(A) 0.2 0.4 0.6 0.8 1.0 1.2 DERATING CURVE REVERSE VOLTAGE,(V) JUNCTION CAP ACITANCE,(pF) .01 .05 .1 .5 1 5 10 50 100 LEAD TEMPERATURE ( C)° 0 25 50 75 100 125 150 175 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. T =25 C f=1.0MHZ J Vsig = 50mVp-p PEAK FOR WAARD SURGE CURRENT ,(A) NUMBER OF CYCLES AT 60Hz 11 0 5 50 100 T =25 CJ 8.3ms Single Half Sine Wave JEDEC method P.C.B. Mounted on 0.2 x 0.2 (5 mm x 5 mm) Copper Pad Areas DS-121539 2013/04/30 - A 7 FIG.1-TYPICAL FORWARD CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT A ,( ) 01. 10. 00 1. INSTANTANEOUS FORWARD VOLTAGE V,( ) TJ 25 C= ° PULSE WIDTH 300us=

1 DUTY CYCLE%

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Pinning information 1 221 Pin1 cathode Pin2 anode Pin Simplified outline Symbol Marking Type number Marking code FEGFM105 FE15 Suggested solder pad layout Document ID Issued Date Revised Date Revision Page. Dimensions in inches and (millimeters) A C B B 0.063 (1.60) A 0.110 (2.80) C 0.087 (2.20) PACKAGE SMA FEGFM105 DS-121539 2013/04/30 - A 7 Chip Fast Efficient Rectifiers

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Packing information E B d F W PA D D1D2 C T Document ID Issued Date Revised Date Revision Page. Item Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Reel width Overall tape thickness Tape width P E B C d F T W P A D D D Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.23 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 2.80 5.00 1.90 Formosa MSFEGFM105 DS-121539 2013/04/30 - A 7 Chip Fast Efficient Rectifiers

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Reel packing SMA 7" 2,000 4.0 20,000 183*155*183 178 382*356*392 160,000 16.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) SMA 13" 7,500 4.0 15,000 337*337*37 330 350*330*360 120,000 14.2 Profile Feature Soldering Condition Average ramp-up rate(T to T ) <3 /sec Preheat -Temperature Min(Tsmin) 150 -Temperature Max(Tsmax) 200 -Time(min to max)(t ) 60~120sec Tsmax to T -Ramp-upRate <3 /sec Time maintained above: -Temperature(T ) 217 -Time(t ) 60~260sec Peak Temperature(T ) 255 0/ 5 Time within 5 of actual Peak Temperature(t ) Ramp-down Rate <6 /sec Time 25 to Peak Temperature <6minutes LP s L L L P P o o o o o oo o o o C C C C C C- + C C C C 3.Reflow soldering 10~30sec 1.Storage environment: Temperature=5 ~40 Humidity=55% 25% 2.Reflow soldering of surface-mount devices oo CC Suggested thermal profiles for soldering processes Critical Zone TL to TP Critical Zone TL to TP TL Tsmax Tsmin Ramp-up Tp tS Preheat t25 C to Peak o Time TL TP Ramp-down Temperature Formosa MSFEGFM105 DS-121539 2013/04/30 - A 7 Chip Fast Efficient Rectifiers

http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Issued Date Revised Date Revision Page. Formosa MSFEGFM105 DS-121539 2013/04/30 - A 7 Chip Fast Efficient Rectifiers 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. Forward Surge 9. Humidity 10. High Temperature Storage Life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. V =80% rate at T =150 for 168 hrs. Rated average rectifier current at T =25 for 500hrs. T = 25 C, I = I On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. 15P at T =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 8.3ms single half sine-wave , one surge. at T =85 , RH=85% for 1000hrs. at 175 for 1000 hrs. ±C ± C C C CC C C O O O O O OO O O RJ A AF O SIG A A O MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 MIL-STD-750D METHOD-1036 MIL-STD-750D METHOD-1051 MIL-STD-750D METHOD-4066-2 MIL-STD-750D METHOD-1021 MIL-STD-750D METHOD-1031 JESD22-A102 Item Test Conditions Reference High reliability test capabilities