FEDL9042-01

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Issue Date: Nov. 19, 2003 ML9042-xx DOT MATRIX LCD CONTROLLER DRIVER GENERAL DESCRIPTION The ML9042 used in combination with an 8-bit or 4-bit microcontroller controls the operation of a character type dot matrix LCD.

FEATURES

 Easy interfacing with an 8-bit or 4-bit microcontroller  Switchable between serial and parallel interfaces  Dot-matrix LCD controller driver for a 5  8 dot font  Built-in circuit allowing automatic resetting at power-on  Built-in 17 common signal drivers and 100 segment signal drivers  Two built-in character generator ROMs each capable of generating 240 characters (5  8 dots)  The character generator ROM can be selected by bank switching (ROM1S) pin.  Creation of character patterns by programming: up to 8 character patterns (5  8 dots)  Built-in RC oscillation circuit using external or internal resistors  Program-selectable duties When ABE bit is “L”: 1/8 duty (1 line: 5  8 dots), or 1/16 duty (2 lines: 5  8 dots) When ABE bit is “H”: 1/9 duty (1 line: 5  8 dots + arbitrator), or 1/17 duty (2 lines: 5  8 dots + arbitrator)  Cursor display  Built-in bias dividing resistors to drive the LCD  Bi-directional transfer of segment outputs  Bi-directional transfer of common outputs  100-dot arbitrator display  Line display shifting  Built-in voltage multiplier circuit  Gold Bump Chip ML9042-xx CVWA/DVWA *xx indicates a character generator ROM code number. *01, 11 and 21 indicate general character generator ROM code numbers. CVWA indicates a bump chip with high hardness, and DVWA indicates a bump chip with low hardness.

LAPIS Semiconductor ML9042-xx BLOCK DIAGRAM VDD GND OSC1 OSCR3 OSC2 RS1 RS0/CSB RW/SI E/SHTB SP DB0(SO) to DB3 DB4 to DB7 V3B V3A VOUT Timing generator I/O Buffer

8 Instruction

(ID) Parallel- serial converter

8 Data

(DR) COM1 SEG1 COM17 Test circuit LCD bias voltage dividing circuit

8 Busy flag

(BF) Expansion instruction register (ER) Voltage multiplier circuit Address counter (ADC) Expansion instruction register (ED) Character generator RAM (CG RAM) Display data RAM (DD RAM) Arbitrator RAM (AB RAM) Cursor blink controller 17-bit bi-directional shift register Common signal driver 100-bit bi-directional shift register 100-bit latch Segment Signal driver SEG100 BE VCC VC VIN Character generator ROM (CG ROM) Instruction register (IR) OSCR5 ROM1S

LAPIS Semiconductor ML9042-xx I/O CIRCUITS VDD P N Applied to pins T1, T2, and T3 VDD P N VDD Applied to pins RW/SI, RS1, and RS0/CSB Applied to pins E/SHTB, SP, ROM1S, and BE VDD P VDD P N VDD P N Applied to pins DB0(SO) to DB7 Output Enable signal

LAPIS Semiconductor ML9042-xx PIN DESCRIPTIONS Symbol Description RW/SI The input pin with a pull-up resistor to select Read (“H”) or Write (“L”) in the Parallel I/F Mode. The pin to input data in the Serial l/F Mode. Each instruction code and each data are read in by the rising edge of the E/SHTB signal. RS0/CSB, RS1 The input pins with a pull-up resistor to select a register in the Parallel l/F Mode. The RSo/CSB pin is configured as a chip enable input in the Serial I/F Mode. Setting the RSo/CSB pin to “L” allows the I/F to be provided. E/SHTB The input pin for data input/output between the CPU and the ML9042 and for activating instructions in the Parallel l/F Mode. This pin is configured as a shift clock input in the Serial I/F Mode. The data input to the PW/SI pin is synchronized to the rising edge of the clock, and the data output from the DB0(SO) pin is synchronized to the falling edge of the shift clock. DB0(SO) to DB3 The input/output pins to transfer data of lower-order 4 bits between the CPU and the ML9042 in the Parallel l/F Mode. The pins are not used for the 4-bit interface. Only the DB0(SO) pin is configured as a data output in the Serial I/F Mode. Busy flag & address and data are output synchronized to the falling edge of the E/SHTB signal. These pins remain pulled up when data is not output. Each pin is equipped with a pull-up resistor, so this pin should be open when not used. DB4 to DB7 The input/output pins to transfer data of upper 4 bits between the CPU and the ML9042 in the Parallel l/F Mode. The pins are not used for the serial interface. Each pin is equipped with a pull-up resistor, so this pin should be open in the Serial I/F Mode when not used. OSC1 OSC2 OSCR3 OSCR5 The clock oscillation pins required for LCD drive signals and the operation of the ML9042 by instructions sent from the CPU. To input external clock, the OSC1 pin should be used. The OSCR3, OSCR5, and OSC2 pins should be open. To start oscillation with an external resistor, the resistor should be connected between the OSC1 and OSC2 pins. The OSCR3 and OSCR5 pins should be open. To start oscillation at 5 V using an internal resistor, the OSC2 and OSCR5 pins should be short-circuited outside the ML9042. The OSC1 and OSCR3 pins should be open. To start oscillation at 3 V using an internal resistor, the OSC2 and OSCR3 pins should be short-circuited outside the ML9042. The OSC1 and OSCR5 pins should be open. (The OSC2, OSCR3, and OSCR5 pins can also be short-circuited outside the ML9042, and the OSC1 pin can be open.) COM1 to COM17 The LCD common signal output pins. For 1/8 duty, non-selectable voltage waveforms are output via COM9 to COM17. For 1/9 duty, non-selectable voltage waveforms are output via COM10 to COM17. For 1/16 duty, a non-selectable voltage waveform is output via COM17. SEG1 to SEG100 The LCD segment signal output pins. RS1 RS 0/CSB Name of register H H Data register H L Instruction register L L Expansion Instruction register

LAPIS Semiconductor ML9042-xx Symbol Description ROM1S The input pin to switch the ROM bank. “H” selects ROM1 and “L” selects ROM0. Switching after power-on is prohibited. V1 , V2, V3A, V3B, V4 The pins to output bias voltages to the LCD. For 1/4 bias : The V 2 and V3B pins are shorted. For 1/5 bias : The V3A and V3B pins are shorted. BE The input pin to enable or disable the voltage multiplier circuit. "L" disables the voltage multiplier circuit. "H" enables the voltage multiplier circuit. The voltage multiplier circuit doubles the input voltage between the V IN pin and the GND pin, and the multiplied voltage referenced to the GND is output to the V OUT pin. The voltage multiplier circuit can be used only when generating a level higher than the VDD. TESTIN The input pin for test circuits. Normally connect this pin to V DD. TESTOUT The output pin for the test circuits. Normally leave this pin open. VIN The pin to input voltage to the voltage multiplier. V0, VOUT The pins to supply the LCD drive voltage. The same potential as the V DD potential is supplied to the V OUT and V0 pins when the voltage multiplier is not used (BE = “0” or BE = “1”, and the capacitor is not connected to the VC and VCC pins) When the voltage multiplier is used (BE = “1”), the multiplied voltage is output to the VOUT pin, so that the VOUT pin and V0 pin should be connected. Capacitors for the voltage multiplier should be connected between the GND and the VOUT pin. VC The pin to connect the negative pin of the capacitor for the voltage multiplier. Leave the pin open when the voltage multiplier circuit is not used. VCC The pin to connect the positive pin of the capacitor used for the voltage multiplier. Leave the pin open when the voltage multiplier circuit is not used. T1, T2, T3 The input pins for test circuits (normally open). Each of these pins is equipped with a pull-down resistor, so this pin should be left open. VDD The power supply pin. GND The ground level input pin. SP The input pin to select the serial or parallel interface. “L” selects the parallel interface. “H” selects the serial interface. DUMMYVDD The output pin to fix the adjacent input pin to the VDD level. Use this pin only for this purpose. DUMMYGND The output pin to fix the adjacent input pin to the GND level. Use this pin only for this purpose. DUMMY NC (No Connection) pin.

LAPIS Semiconductor ML9042-xx ABSOLUTE MAXIMUM RATINGS (GND = 0 V) Parameter Symbol Condition Rating Unit Applicable pins Supply Voltage VDD Ta = 25 C –0.3 to +6.5 V VDD LCD Driving Voltage V0, V1, V2, V3, V4, Ta = 25C –0.3 to +6.5 V VOUT, V0, V1, V2, V3A, V3B, V4, GND Input Voltage VI Ta = 25 C –0.3 to V DD+0.3 V RW/SI, E/SHTB, SP, RS0/CSB, RS1, BE, ROM1S, T1 to T3, DB0(SO) to DB7, VIN Storage Temperature T STG — –55 to +150 C — RECOMMENDED OPERATING CONDITIONS (GND = 0 V) Parameter Symbol Condition Range Unit Applicable pins Supply Voltage VDD — 2.7 to 5.5 V V DD LCD Driving Voltage V0 (See Note) — 2.7 to 5.5 V V OUT, V0 Voltage Multipler Input Voltage VMUL BE = “1” 1.8 to 2.75 V VIN Operating Temperature T op — –40 to +85 C — Note: This voltage should be applied across V 0 and GND. The following voltages are output to the V1, V2, V3A (V3B) and V4 pins:  1/4 bias (V2 and V3B are short-circuited) V 1 =3 V0/4 0.15 V V 2 = V3B = V0/2 0.15 V V 4 = V0/4 0.15 V  1/5 bias (V 3A and V3B are short-circuited) V 1 = 4 V0/5 0.15 V V 2 = 3 V0/5 0.15 V V 3A = V3B = 2 V0/5 0.15 V V 4 = V0/5 0.15 V The voltages at the V 0, V1, V2, V3A (V3B), V4 and GND pins should satisfy V 0 > V1 > V2 > V3A (V3B) > V4 > GND (Higher   Lower) * If the chip is attached on a substrate using COG technology, the chip tends to be susceptible to electrical characteristics of the chip due to trace resistance on the glass substrate. It is recommended to use the chip by confirming that it operates on the glass substrate properly. Trace resistance, especially, V DD and V SS trace resistance, between the chip on the LCD panel and the flexible cable should be designed as low as possible. Trace resistance that cannot be very well decreased, larger size of the LCD panel, or greater trace capacitance between the microcontroller and the ML9042 device can cause device malfunction. In order to avoid the device malfunction, power noise should be reduced by serial interfacing of the microcontroller and the ML9042 device. * Do not apply short-circuiting across output pins and across an output pin and an input/output pin or the power supply pin in the output mode.

LAPIS Semiconductor ML9042-xx

ELECTRICAL CHARACTERISTICS

(GND = 0 V, VDD = 2.7 to 5.5 V, Ta = –40 to +85C) Parameter Symbol Condition Min. Typ. Max. Unit Applicable pin “H” Input Voltage V IH 0.8V DD — V DD “L” Input Voltage V IL 0 — 0.2V DD V RW/SI, RS0/CSB, RS1, E/SHTB, DB0(SO) to DB7, SP, OSC1, BE, ROM1S “H” Output Voltage 1 V OH1 I OH = –0.1 mA 0.9VDD — — “L” Output Voltage 1 V OL1 I OL = +0.1 mA — — 0.1V DD V DB0(SO) to DB7 “H” Output Voltage 2 V OH2 I OH = –13 A 0.9V DD — — “L” Output Voltage 2 V OL2 I OL = +13 A — — 0.1V DD V OSC 2 VCH l OCH = –4 A V 0–0.3 V0– 0.012 V0 VCMH l OCMH = 4 AV 1–0.3 V1 0.012 V1+0.3 VCML l OCML = 4 AV 4–0.3 V4 0.012 V4+0.3 COM Voltage Drop VCL l OCL = +4 A V0 –GND = 5 V Note 1 GND GND+ 0.012 GND+0.3 V COM1 to COM17 VSH l OSH = –4 A V 0–0.3 V0– 0.012 V0 VSMH l OSMH = 4 AV 2–0.3 V2 0.012 V2+0.3 VSML l OSML = 4 AV 3–0.3 V3 0.012 V3+0.3 SEG Voltage Drop VSL l OSL = +4 A V0 –GND = 5 V Note 1 GND GND+ 0.012 GND+0.3 V SEG1 to SEG100 Input Leakage Current | IIL | V DD = 5 V, VI = 5 V or 0 V — — 1.0 A E/SHTB, BE, SP, V IN VDD = 5 V, VI = GND 10 25 61 Input Current 1 | II1 | VDD = 5 V, VI = VDD, Excluding current flowing through the pull-up resistor and the output driving MOS — — 2.0 A RW/SI, RS0/CSB, RS1, DB0(SO) to DB7 VDD = 5 V, VI = VDD 15 45 105 Input Current 2 | II2 | VDD = 5 V, VI = GND Excluding current flowing through the pull-down resistor Supply Current lDD V DD = 5 V Note 2 — — 1.2 mA V DD–GND Oscillation Frequency of External Resistor Rf f osc1 Rf = 85 k 2% Note 3 175 270 400 kHz OSC 1, OSC2

LAPIS Semiconductor ML9042-xx VDD = 4.0 to 5.5 V Ta = -20 to 75C OSC1 and OSCR3: Open OSC2 and OSCR5: Short-circuited Note 4 200 270 351 kHz OSC1, OSC2, OSCR5 Oscillation Frequency of Internal Resistor Rf fosc2 VDD = 2.7 to 3.6 V Ta = -20 to 75C OSC1 and OSCR5: Open OSC2 and OSCR3: Short-circuited Note 4 200 280 364 kHz OSC1, OSC2, OSCR3 Clock Input Frequency fin OSC2, OSCR: Open Input from OSC1 175 — 400 kHz Input Clock Duty f duty Note 5 45 50 55 % Input Clock Rise Time f rf Note 6 — — 0.2 s External Clock Input Clock Fall Time f ff Note 6 — — 0.2 s OSC1 -0x code 1.4 2.0 2.6 k  V0, V1, V2, V3A, V3B, V4, GND -1x code 2.8 4.0 5.2 k  V0, V1, V2, V3A, V3B, V4, GND LCD Bias Resistor R LB -2x code 7.0 10.0 13.0 k  V0, V1, V2, V3A, V3B, V4, GND

LAPIS Semiconductor ML9042-xx (GND = 0 V, VDD = 2.7 to 5.5 V, Ta = –40 to +85C) Parameter Symbol Condition Min. Typ. Max. Unit Applicable pins Voltage Multiplier Input Voltage VMUL Note 7 1.8 — 2.75 V V IN bias 4.3 — (VDD–VIN)  2 Voltage Multiplier Output Voltage V OUT VDD = 2.7 V, VIN = 2.25 V f = 175 kHz A capacitor for the voltage multiplier = 1 to 4.7 F VOUT load current = 54 A BE = “H” Applied to LCD bias resistance of 10 k (TYP) only bias 4.3 — (VDD–VIN)  2 V V OUT VLCD1 bias 2.7 — 5.5 Bias Voltage for Driving LCD V LCD2 V0–GND Note 8 bias 2.7 — 5.5 V V 0 Note 1: Applied to the voltage drop occurring between any of the V 0, V1, V4 and GND pins and any of the common pins (COM 1 to COM 17) when the current of 4 A flows in or flows out at one common pin. Also applied to the voltage drop occurring between any of the V 0, V2, V3A (V3B) and GND pins and any of the segment pins (SEG1 to SEG100) when the current of 4 A flows in or flows out at one segment pin. The current of 4  A flows out when the output level is VDD or flows in when the output level is V5. Note 2: Applied to the current flowing into the V DD pin when the external clock (fOSC2 = fin = 270 kHz) is fed to the internal Rf oscillation or OSC1 under the following conditions: V DD = V0 = 5 V GND = 0 V, V 1, V2, V3A (V3B) and V4: Open E/SHTB and BE: “L” (fixed) Other input pins: “L” or “H” (fixed) Other output pins: No load

LAPIS Semiconductor ML9042-xx Note 3: Note 4: The wire between OSCR3 and OSC2, or between OSCR5 and OSC2 should be as short as possible. Keep open between OSC1 and OSCR3, or between OSC1 and OSCR5. The wire between OSC1 and Rf and the wire between OSC2 and Rf should be as short as possible. Keep OSCR3 and OSCR5 open. OSC1 OSCR3 OSC2 OSC1 OSCR5 OSC2 OSCR3 OSCR5 OSC1 OSCR5 OSC2 Rf = 85 k2% OSCR3 Note 5: tHW tLW VDD fIN waveform VDD VDD Applied to the pulses entering from the OSC1 pin fduty = tHW/(tHW + tLW) ×100 (%) Note 6: 0.8VDD Applied to the pulses entering from the OSC1 pin 0.8VDD 0.2VDD 0.2V DD trf t ff Note 7: The maximum value of the voltage multiplier input voltage should be set at 2.75 V, and the minimum value of the voltage multiplier input voltage should be set by monitoring the voltage of V 0 in actual use so that the voltage multiplier output voltage meets the specification for the bias voltage for driving LCD after contrast adjustment. Note 8: For 1/4 bias, V 2 and V3B pins are short-circuited. V3A pin is open. For 1/5 bias, V 3A and V3B pins are short-circuited. V2 pin is open.

LAPIS Semiconductor ML9042-xx I/O Characteristics  Parallel Interface Mode T he timing for the input from the CPU and the timing for the output to the CPU are as shown below: 1) WRITE MODE (Timing for input from the CPU) (VDD = 2.7 to 4.5 V, Ta = –40 to +85C) Parameter Symbol Min. Typ. Max. Unit RW/SI, RS0/CSB, RS1 Setup Time tB 40 — — ns E/SHTB Pulse Width tW 450 — — ns RW/SI, RS0/CSB, RS1 Hold Time tA 10 — — ns E/SHTB Rise Time tr — — 125 ns E/SHTB Fall Time tf — — 125 ns E/SHTB Pulse Width tL 430 — — ns E/SHTB Cycle Time tC 1000 — — ns DB0(SO) to DB7 Input Data Setup Time tI 195 — — ns DB0(SO) to DB7 Input Data Hold Time tH 10 — — ns (VDD = 4.5 to 5.5 V, Ta = –40 to +85C) Parameter Symbol Min. Typ. Max. Unit RW/SI, RS0/CSB, RS1 Setup Time tB 40 — — ns E/SHTB Pulse Width tW 220 — — ns RW/SI, RS0/CSB, RS1 Hold Time tA 10 — — ns E/SHTB Rise Time tr — — 125 ns E/SHTB Fall Time tf — — 125 ns E/SHTB Pulse Width tL 220 — — ns E/SHTB Cycle Time tC 500 — — ns DB0(SO) to DB7 Input Data Setup Time tI 60 — — ns DB0(SO) to DB7 Input Data Hold Time tH 10 — — ns RS1, RS0/CSB VIH VIL VIH VIL VIL VIL VIL VIL VIL VIHVIH VIH VIL VIH VIL RW/SI E/SHTB DB0(SO) to DB7 tL tB tW tr tf tA tH tI Input Data tC

LAPIS Semiconductor ML9042-xx 2) READ MODE (Timing for output to the CPU) (VDD = 2.7 to 4.5 V, Ta = –40 to +85C) Parameter Symbol Min. Typ. Max. Unit RW/SI, RS1, RS0/CSB Setup Time tB 40 — — ns E/SHTB Pulse Width tW 450 — — ns RW/SI, RS1, RS0/CSB Hold Time tA 10 — — ns E/SHTB Rise Time tr — — 125 ns E/SHTB Fall Time tf — — 125 ns E/SHTB Pulse Width tL 430 — — ns E/SHTB Cycle Time tC 1000 — — ns DB0(SO) to DB7 Output Data Delay Time tD — — 350 ns DB0(SO) to DB7 Output Data Hold Time tO 20 — — ns Note: A load capacitance of each of DB0(SO) to DB7 must be 50 pF or less. (VDD = 4.5 to 5.5 V, Ta = –40 to +85C) Parameter Symbol Min. Typ. Max. Unit RW/SI, RS1, RS0/CSB Setup Time tB 40 — — ns E/SHTB Pulse Width tW 220 — — ns RW/SI, RS1, RS0/CSB Hold Time tA 10 — — ns E/SHTB Rise Time tr — — 125 ns E/SHTB Fall Time tf — — 125 ns E/SHTB Pulse Width tL 220 — — ns E/SHTB Cycle Time tC 500 — — ns DB0(SO) to DB7 Output Data Delay Time tD — — 250 ns DB0(SO) to DB7 Output Data Hold Time tO 20 — — ns Note: A load capacitance of each of DB0(SO) to DB7 must be 50 pF or less. RS1, RS0/CSB VIH VIL VIH VIL VIH VIH VIL VIL VIL VIHVIH 0.8VDD 0.2VDD 0.8VDD 0.2VDD RW/SI E/SHTB DB0(SO) to DB7 tL tB tW tr tf tA tO tD Output Data tC

LAPIS Semiconductor ML9042-xx  Serial Interface Mode (VDD = 2.7 to 5.5 V, Ta = –40 to +85C) Parameter Symbol Min. Typ. Max. Unit E/SHTB Cycle Time tSCY 500 — — ns RS0/CSB Setup Time tCSU 100 — — ns RS0/CSB Hold Time tCH 100 — — ns RS0/CSB “H” Pulse Width tCSWH 200 — — ns E/SHTB Setup Time tSSU 60 — — ns E/SHTB Hold Time tSH 200 — — ns E/SHTB “H” Pulse Width tSWH 200 — — ns E/SHTB “L” Pulse Width tSWL 200 — — ns E/SHTB Rise Time tSR — — 125 ns E/SHTB Fall Time tSF — — 125 ns RW/Sl Setup Time tDISU 100 — — ns RW/Sl Hold Time tDIH 100 — — ns DB0(SO) Output Data Delay Time tDOD — — 160 ns DB0(SO) Output Data Hold Time tCDH 0 — — ns VIH VIL VIH VILRW/SI VIL tSCY tDOD t DOD VOL VOH VOH tCDH RS0/CSB DB0(SO) E/SHTB tCSU tSSU tSWL tSR tSWH tSF tSH tCH VIH VIL VIH VIH VIHVIL tDISU tDIH VIH tCSWH VIH VIL VIH VIH

LAPIS Semiconductor ML9042-xx FUNCTIONAL DESCRIPTION Instruction Register (IR), Data Register (DR), a nd Expansion Instruction Register (ER) These registers are selected by setting the level of the Register Selection input pins RS0/CSB and RS1. The DR is selected when both RS0/CSB and RS1 are “H”. The IR is selected when RS0/CSB is “L” and RS1 is “H”. The ER is selected when both RS 0/CSB and RS 1 are “L”. (When RS 0/CSB is “H” and RS 1 is “L”, the ML9042 is not selected.) The IR stores an instruction code and sets the address code of the display data RAM (DDRAM) or the character generator RAM (CGRAM). The microcontroller (CPU) can write but cannot read the instruction code. The ER sets the display positions of the arbitrator and the address code of the arbitrator RAM (ABRAM). The CPU can write but cannot read the display positions of the arbitrator. The DR stores data to be written in the DDRAM, ABRAM and CGRAM and also stores data read from the DDRAM, ABRAM and CGRAM. The data written in the DR by the CPU is automatically written in the DDRAM, ABRAM or CGRAM. When an address code is written in the IR or ER, the data of the specified address is automatically transferred from the DDRAM, ABRAM or CGRAM to the DR. The data of the DDRAM, ABRAM and CGRAM can be checked by allowing the CPU to read the data stored in the DR. After the CPU writes data in the DR, the data of the next address in the DDRAM, ABRAM or CGRAM is selected to be ready for the next writing by the CPU. Similarly, after the CPU reads the data in the DR, the data of the next address in the DDRAM, ABRAM or CGRAM is set in the DR to be ready for the next reading by the CPU. Writing in or reading from these 3 registers is controlled by changing the status of the RW/SI pin. Table 1 RW/SI pin status and register operation RW/SI RS 0/CSB RS 1 Operation L L H Writing in the IR H L H Reading the Busy flag (BF) and the address counter (ADC) L H H Writing in the DR H H H Reading from the DR L L L Writing in the ER H L L Disabled (Not in a busy state, not performing the reads. Note that the data bus goes into a high impedance state.) L H L Disabled (Not in a busy state, not performing the writes) H H L Disabled (Not in a busy state, not performing the reads. Note that the data bus goes into a high impedance state.) Busy Flag (BF) Th e status “1” of the Busy Flag (BF) indicates that the ML9042 is carrying out internal operation. When the BF is “1”, any new instruction is ignored. When RW/SI = “H”, RS0/CSB = “L” and RS1 = “H”, the data in the BF is output to the DB7. New instructions should be input when the BF is “0”. When the BF is “1”, the output code of the address counter (ADC) is undefined.

LAPIS Semiconductor ML9042-xx Address Counter (ADC) Th e address counter provides a read/write address for the DDRAM, ABRAM or CGRAM and also provides a cursor display address. When an instruction code specifying DDRAM, ABRAM or CGRAM address setting is input to the pre-defined register, the register selects the specified DDRAM, ABRAM or CGRAM and transfers the address code to the ADC. The address data in the ADC is automatically incremented (or decremented) by 1 after the display data is written in or read from the DDRAM, ABRAM or CGRAM. The data in the ADC is output to DB 0(SO) to DB6 when RW/SI = “H”, RS0/CSB = “L”, RS1 = “H” and BF = “0”. Timing Generator Th e timing generator generates timing signals for the internal operation of the ML9042 activated by the instruction sent from the CPU or for the operation of the internal circuits of the ML9042 such as DDRAM, ABRAM, CGRAM and CGROM. Timing signals are generated so that the internal operation carried out for LCD displaying will not be interfered by the internal operation initiated by accessing from the CPU. For example, when the CPU writes data in the DDRAM, the display of the LCD not corresponding to the written data is not affected.

LAPIS Semiconductor ML9042-xx Display Data RAM (DDRAM) Th is RAM stores the 8-bit character codes (see Table 2). The DDRAM addresses correspond to the display positions (digits) of the LCD as shown below. The DDRAM addresses (to be set in the ADC) are represented in hexadecimal. MSB LSB DB6 DB5 DB4 DB3 DB2 DB1 DB0 Hexadecimal Hexadecimal 0ADC 0 1 0 0 1 0 ADC (Example) Representation of DDRAM address = 12 1) Relationship between DDRAM addresses and display positions (1-line display mode) 00 01 02 03 04 12 13 Digit 1 2 3 4 5 19 20 Left end Right end Display position DD RAM address (hexadecimal) In the 1-line display mode, the ML9042 can display up to 20 characters from digit 1 to digit 20. While the DDRAM has addresses “00” to “4F” for up to 80 character codes, the area not used for display can be used as a RAM area for general data. When the display is shifted by instruction, the relationship between the LCD display position and the DDRAM address changes as shown below: 4F 00 01 02 11 12 Digit 1 234 1 9 2 0 (Display shifted to the right) 01 02 03 04 13 14 Digit 1 234 5 19 20 (Display shifted to the left)

LAPIS Semiconductor ML9042-xx 2) Relationship between DDRAM addresses and display positions (2-line display mode) In the 2-line mode, the ML9042 can display up to 40 characters (20 characters per line) from digit 1 to digit 20. 00 01 02 03 04 Digit 1 2 3 4 5 12 13 19 20 40 41 42 43 44 52 53 Line 1 Line 2 Display position DD RAM address (hexadecimal) Note: The DDRAM address at digit 20 in the first line is not consecutive to the DDRAM address at digit 1 in the second line. When the display is shifted by instruction, the relationship between the LCD display position and the DDRAM address changes as shown below: 27 00 01 02 Digit 1 234 11 12 19 20 67 40 41 42 51 52 Line 1 Line 2 01 02 03 04 Digit 1 234 13 14 19 20 41 42 43 44 45 53 54 Line 1 Line 2 (Display shifted to the right) (Display shifted to the left)

LAPIS Semiconductor ML9042-xx Character Generator ROM (CGROM) Th e CGROM generates character patterns (5  8 dots, 240 patterns) from the 8-bit character code signals in the DDRAM. The bank switching pin (ROM1S) can switch to the other ROM that generates character patterns (5  8 dots, 240 patterns), allowing a total of 480 characters to be controlled. When the 8-bit character code corresponding to a character pattern in the CGROM is written in the DDRAM, the character pattern is displayed in the display position specified by the DDRAM address. Character codes 10 to FF are contained in the ROM area in the CG ROM. The general character generator ROM codes are 01/11/21. The relationship between character codes and general purpose character patterns in Bank0 (ROM0) and Bank1 (ROM1) are indicated in Table 2-1 and Table 2-2, respectively.

LAPIS Semiconductor ML9042-xx Character Generator RAM (CGRAM) Th e CGRAM is used to generate user-specific character patterns that are not in the CGROM. CGRAM (64 bytes = 512 bits) can store up to 8 character patterns (5  8 dots) . When displaying a character pattern stored in the CGRAM, write an 8-bit character code (00 to 07 or 08 to 0F; hex.) to the DDRAM. This enables outputting the character pattern to the LCD display position corresponding to the DDRAM address. The cursor or blink is also displayed even when a CGRAM or ABRAM address is set in the ADC. Therefore, the cursor or blink display should be inhibited while the ADC is holding a CGRAM or ABRAM address. The following describes how character patterns are written in and read from the CGRAM. (See Tables 2-1 and 2-2.) (1) A method of writing character patterns to the CGRAM from the CPU The three CGRAM address bit weights 0 to 2 select one of the lines constituting a character pattern. First, set the mode to increment or decrement from the CPU, and then input the CGRAM address. Write each line of the character pattern in the CGRAM through DB 0(SO) to DB7. The data lines DB 0(SO) to DB7 correspond to the CGRAM data bit weights 0 to 7, respectively (see Table 3-1). Input data “1” represents the ON status of an LCD dot and “0” represents the OFF status. Since the ADC is automatically incremented or decremented by 1 after the data is written to the CGRAM, it is not necessary to set the CGRAM address again. The bottom line of a character pattern (the CGRAM address bit weights 0 to 2 are all “1”, which means 7 in hexadecimal) is the cursor line. The ON/OFF pattern of this line is ORed with the cursor pattern for displaying on the LCD. Therefore, the pattern data for the cursor position should be all zeros to display the cursor. Whereas the data given by the CGRAM data bit weights 0 to 4 is output to the LCD as display data, the data given by the CGRAM data bit weights 5 to 7 is not. Therefore, the CGRAM data bit weights 5 to 7 can be used as a RAM area. (2) A method of displaying CGRAM character patterns on the LCD The CGRAM is selected when the higher-order 4 bits of a character code are all zeros. Since bit weight 3 of a character code is not used, the character pattern “0” in Table 3-1 can be selected using the character code “00” or “08” in hexadecimal. When the 8-bit character code corresponding to a character pattern in the CGRAM is written to the DDRAM, the character pattern is displayed in the display position specified by the DDRAM address. (The DDRAM data bit weights 0 to 2 correspond to the CGRAM address bit weights 3 to 5, respectively.)

LAPIS Semiconductor ML9042-xx Arbitrator RAM (ABRAM) Th e arbitrator RAM (ABRAM) stores arbitrator display data. 100 dots can be displayed in both 1-line and 2-line display modes. The arbitrator RAM has the addresses (hexadecimal) from “00” to “1F” and the valid display address area is from 00 to 19 (0H to 13H). The area of 20 to 31 (14H to 1FH) not used for display can be used as a data RAM area for general data. Even if the display is shifted by instruction, the arbitrator display is not shifted. A capacity of 8 bits by 32 addresses (= 256 bits) is available for data write. First set the mode to increment or decrement from the CPU, and then input the ABRAM address. Write Display-ON data in the ABRAM through DB 0(SO) to DB7. DB0(SO) to DB7 correspond to the ABRAM data bit weights 0 to 7 respectively. Input data “1” represents the ON status of an LCD dot and “0” represents the OFF status. Since ADC is automatically incremented or decremented by 1 after the data is written to the ABRAM, it is not necessary to set the ABRAM address again. Whereas ABRAM data bit weights 0 to 4 are output as display data to the LCD, the ABRAM data bit weights 5 to 7 are not. These bits can be used as a RAM area. The cursor or blink is also displayed even when a CGRAM or ABRAM address is set in the ADC. Therefore, the cursor or blink display should be inhibited while the ADC is holding a CGRAM or ABRAM address. MSB LSB DB6 DB5 DB4 DB3 DB2 DB1 DB0 Hexadecimal Hexadecimal ADC The arbitrator RAM can store a maximum of 100 dots of the arbitrator Display-ON data in units of 5 dots. The relationship with the LCD display positions is shown below. * * E4 E3 E2 E1 E0 DB6 DB7 DB 5 DB4 DB3 DB2 DB1 DB0 * Don’t Care Display - ON data E4 E0 5XSn+1 5XSn+5 Configuration of input display data Input data Relationship between display-ON data and segment pins Sn = ABRAM address (0 to 19)

LAPIS Semiconductor ML9042-xx

LAPIS Semiconductor ML9042-xx Note: The same CGRAM character patterns are displayed in Bank0 and Bank1.

LAPIS Semiconductor ML9042-xx Table 3-1 Relationship between CGRAM address bits, CGRAM data bits (character pattern) and DDRAM data bits (character code) in 5  7 dot character mode. (Examples) CG RAM data (Character pattern) (Character code) DD RAM data 01110 10001 10001 10001 10001 10001 01110 00000 76543210 76543210 LSB MSB LSB MSB LSB 0000 000  10001 10010 10100 11000 10100 10010 10001 00000 0000 001  01110 00100 00100 00100 00100 00100 01110 00000 0000 111  CG RAM address 543210 MSB 000000 001 010 011 100 101 110 111 001000 001 010 011 100 101 110 111 111000 001 010 011 100 101 110 111 : Don’t Care

LAPIS Semiconductor ML9042-xx Cursor/Blink Control Circuit Th is circuit generates the cursor and blink of the LCD. The operation of this circuit is controlled by the program of the CPU. The cursor/blink display is carried out in the position corresponding to the DDRAM address set in the ADC (Address Counter). For example, when the ADC stores a value of “07” (hexadecimal), the cursor or blink is displayed as follows: DB6 DB0 000111 00 01 02 03 04 07 08 Digit 1 2345 89 Cursor/blink position 12 13 19 20 67 05 06 00 01 02 03 04 07 08 Digit 1 2345 89 Cursor/blink position 12 13 19 20 67 05 06 40 41 42 43 44 47 48 52 53 45 46 First line ADC In 1-line display mode In 2-line display mode Second line Note: The cursor or blink is also displayed even when a CGRAM or ABRAM address is set in the ADC. Therefore, the cursor or blink display should be inhibited while the ADC is holding a CGRAM or ABRAM address.

LAPIS Semiconductor ML9042-xx LCD Display Circuit (COM1 to COM17, SEG1 to SEG100, SSR and CSR) Th e ML9042 has 17 common signal outputs and 100 segment signal outputs to display 20 characters (in the 1-line display mode) or 40 characters (in the 2-line display mode). The character pattern is converted into serial data and transferred in series through the shift register. The transfer direction of serial data is determined by the SSR bit. The shift direction of common signals is determined by the CSR bit. The following tables show the transfer and shift directions: SSR bit Transfer direction L SEG 1  SEG100 H SEG 100  SEG1 ABE bit CSR bit duty AS bit Shift Direction Arbitrator’s common pin L L 1/8 L COM1COM8 None L L 1/8 H COM1COM8 None L L 1/16 L COM1COM16 None L L 1/16 H COM1COM16 None L H 1/8 L COM8COM1 None L H 1/8 H COM8COM1 None L H 1/16 L COM16 COM1 None L H 1/16 H COM16COM1 None H L 1/9 L COM1COM9 COM9 H L 1/9 H COM1COM9 COM1 H L 1/17 L COM1COM17 COM17 H L 1/17 H COM1COM17 COM1 H H 1/9 L COM9COM1 COM1 H H 1/9 H COM9 COM1 COM9 H H 1/17 L COM17COM1 COM1 H H 1/17 H COM17 COM1 COM17 * Refer to the Expansion Instruction Codes section about the ABE bit, SSR bit, CSR bit, and AS bit. Signals to be input to the SSR bit, CSR bit, ABE bit, and AS bit should be initially determined at power-on and be kept unchanged.

LAPIS Semiconductor ML9042-xx Built-in Reset Circuit Th e ML9042 is automatically initialized when the power is turned on. During initialization, the Busy Flag (BF) is “1” and the ML9042 does not accept any instruction from the CPU (other than the Read BF instruction). The Busy Flag is “1” for about 15 ms after the VDD becomes 2.7 V or higher. During this initialization, the ML9042 performs the following instructions: 1) Display clearing 2) CPU interface data length = 8 bits (DL = “1”) 3) 1-line LCD display (N = “0”) 4) ADC counting = Increment (I/D = “1”) 5) Display shifting = None (S = “0”) 6) Display = Off (D = “0”) 7) Cursor = Off (C = “0”) 8) Blinking = Off (B = “0”) 9) Arbitrator = Displayed in the lower line (AS = “0”) 10) Arbitrator = Not displayed (ABE = “0”) 11) Segment shift direction = SEG 1  SEG100 (SSR = “0”) 12) Common shift direction = COM 1  COM17 (CSR = “0”) To use the built-in reset circuit, the power supply conditions shown below should be satisfied. Otherwise, the built-in reset circuit may not work properly. In such a case, initialize the ML9042 with the instructions from the CPU. The use of a battery always requires such initialization from the CPU. (See “Initial Setting of Instructions”) tON 2.7 V 0.2 V 0.2 V 0.2 V tOFF 0.1 ms  tON 100 ms 1 ms  tOFF Figure 1 Power-on and Power-off Waveform

LAPIS Semiconductor ML9042-xx I/F with CPU Parallel in terface mode The ML9042 can transfer either 8 bits once or 4 bits twice on the data bus for interfacing with any 8-bit or 4-bit microcontroller (CPU). 1) 8-bit interface data length The ML9042 uses all of the 8 data bus lines DB 0(SO) to DB7 at a time to transfer data to and from the CPU. 2) 4-bit interface data length The ML9042 uses only the higher-order 4 data bus lines DB 4 to DB7 twice to transfer 8-bit data to and from the CPU. The ML9042 first transfers the higher-order 4 bits of 8-bit data (DB 4 to DB7 in the case of 8-bit interface data length) and then the lower-order 4 bits of the data (DB0(SO) to DB3 in the case of 8-bit interface data length). The lower-order 4 bits of data should always be transferred even when only the transfer of the higher-order 4 bits of data is required. (Example: Reading the Busy Flag) Two transfers of 4 bits of data complete the transfer of a set of 8-bit data. Therefore, when only one access is made, the following data transfer cannot be completed properly.

LAPIS Semiconductor ML9042-xx Serial Interface Mode In th e Serial I/F Mode, the ML9042 interfaces with the CPU via the RS 0/CSB, E/SHTB, RW/SI, and DB 0(SO) pins. Writing and reading operations are executed in units of 16 bits after the RS0/CSB signal falls down. If the RS0/CSB signal rises up before the completion of 16-bit unit access, this access is ignored. When the BF bit is “1”, the ML9042 cannot accept any other instructions. Before inputting a new instruction, check that the BF bit is “0”. Any access when the BF bit is “1” is ignored. Data format is LSB-first. Examples of Access in the Serial I/F Mode Note 1: Higher 5 bits of each instruction must be input at a “H” level. Note 2: Lower 8 bits are “don’t care” when the instructions in the READ MODE are set. Note 3: After one instruction is input, the next instruction must be input after the RS 0/CSB pin is pulled at a “H” level. 1) WRITE MODE RS0/CSB E/SHTB BUSY RWB/SI DB(SO) 2) READ MODE RS0/CSB E/SHTB BUSY RWB/SI DB(SO) (Internal operation) (Internal operation) 345678 113 14 15 169 1 01 11 2

11111 R/W RS0 RS1 D0 D1 D2 D3 D4 D5 D6 D7 1

3 4 5 6 7 8 9 1 01 11 21 31 41 51 6 1

11111 R/W RS0 RS1 1

LAPIS Semiconductor ML9042-xx Instruction Codes Ta ble of Instruction Codes Code Instruction RS1 RS0/ CSB RW/ SI DB7 DB 6 DB 5 DB 4 DB3 DB2 DB1 DB0 (SO) Function Execution Time f = 270 kHz Display Clear 1 0 0 0 0 0 0 0 0 0 1 Clears all the displayed digits of the LCD and sets the DDRAM address 00 in the address counter. The arbitrator data is cleared. 1.52 ms Cursor Home 1 0 0 0 0 0 0 0 0 1 X Sets the DDRAM address 00 in the address counter and shifts the display back to the original. The content of the DDRAM remains unchanged. 1.52 ms Entry Mode Setting 1 0 0 0 0 0 0 0 1 I/D S Determines the direction of movement of the cursor and whether or not to shift the display. This instruction is executed when data is written or read. 37 s Display ON/OFF Control 1 0 0 0 0 0 0 1 D C B Sets LCD display ON/OFF (D), cursor ON/OFF (C) or cursor-position character blinking ON/OFF (B). 37 s Cursor/Display Shift 1 0 0 0 0 0 1 S/C R/L X X Moves the cursor or shifts the display without changing the content of the DDRAM. 37 s Function Setting 1 0 0 0 0 1 DL N ABE SSR CSR Sets the interface data length (DL), the number of display lines (N), the arbitrator display (ABE), the segment data shift direction (SSR), or the common data shift direction (CSR). 37 s CGRAM Address Setting 1 0 0 0 1 ACG Sets on CGRAM address. After that, CGRAM data is transferred to and from the CPU. 37 s DDRAM Address Setting 1 0 0 1 ADD Sets a DDRAM address. After that, DDRAM data is transferred to and from the CPU. 37 s Busy Flag/ Address Read 1 0 1 BF ADC Reads the Busy Flag (indicating that the ML9042 is operating) and the content of the address counter. 0 s RAM Data Write 1 1 0 WRITE DATA Writes data in DDRAM, ABRAM or CGRAM. 37 s RAM Data Read 1 1 1 READ DATA Reads data from DDRAM, ABRAM or CGRAM. 37 s Arbitrator Display Line Set 0 0 0 0 0 0 0 0 0 1 AS Sets the arbitrator display line. 37 s ABRAM Address Setting 0 0 0 0 1 1 AAB Sets an ABRAM address. After that, ABRAM data is transferred to and from the CPU. 37 s

LAPIS Semiconductor ML9042-xx I/D = “1” (Increment) I/D = “0” (Decrement) S = “1” (Shifts the display.) S/C = “1” (Shifts display.) S/C = “0” (Moves the cursor.) R/L = “1” (Right shift) R/L = “0” (Left shift) D/L = “1” (8-bit data) DL = “0” (4-bit data) N = “1” (2 lines) N = “0” (1 line) ABE = “1” (Arbitrator displayed) ABE = “0” (Arbitrator not displayed) SSR = “1” (Transfer direction: SEG 100  SEG1) SSR = “0” (Transfer direction: SEG1  SEG100) CSR = “1” (Transfer direction: COMn  COM1) CSR = “0” (Transfer direction: COM1  COMn) BF = “1” (Busy) BF = “0” (Ready to accept an instruction) B = “1” (Enables blinking) C = “1” (Displays the cursor.) D = “1” (Displays a character pattern.) AS = “1” (Arbitrator Displays AS = “0” (Arbitrator Displays arbitrator on the arbitrator on the upper line) lower line) DD RAM: Display data RAM CG RAM: Character generator RAM ABRAM: Arbitrator data RAM ACG: CGRAM address ADD: DDRAM address (Corresponds to the cursor address) AAB: ABRAM address ADC: Address counter (Used by DDRAM, ABRAM and CGRAM) The execution time is dependent upon frequen- cies. : Don't Care

LAPIS Semiconductor ML9042-xx Instruction Codes An ins truction code is a signal sent from the CPU to access the ML9042. The ML9042 starts operation as instructed by the code received. The busy status of the ML9042 is rather longer than the cycle time of the CPU, since the internal processing of the ML9042 starts at a timing which does not affect the display on the LCD. In the busy status (Busy Flag is “1”), the ML9042 cannot input the Busy Flag Read instruction only. Therefore, the CPU should ensure that the Busy Flag is “0” before sending an instruction code to the ML9042. 1) Display Clear RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 1Instruction Code: When this instruction is executed, the LCD display including arbitrator display is cleared and the I/D entry mode is set to “Increment”. The value of “S” (Display shifting) remains unchanged. The position of the cursor or blink being displayed moves to the left end of the LCD (or the left end of the line 1 in the 2-line display mode). Note: All DDRAM and ABRAM data turn to “20” and “00” in hexadecimal, respectively. The value of the address counter (ADC) turns to the one corresponding to the address “00” (hexadecimal) of the DDRAM. The execution time of this instruction is 1.52 ms (maximum) at an oscillation frequency of 270 kHz. 2) Cursor Home RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0  Instruction code: : Don’t Care When this instruction is executed, the cursor or blink position moves to the left end of the LCD (or the left end of line 1 in the 2-line display mode). If the display has been shifted, the display returns to the original display position before shifting. Note: The value of the address counter (ADC) goes to the one corresponding to the address “00” (hexadecimal) of the DDRAM). The execution time of this instruction is 1.52 ms (maximum) at an oscillation frequency of 270 kHz.

LAPIS Semiconductor ML9042-xx 3) Entry Mode Setting RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 I/D DB0 S Instruction code: (1) When the I/D is set, the cursor or blink shifts to the right by 1 character position (ID= “1”; increment) or to the left by 1 character position (I/D= “0”; decrement) af ter an 8-bit character code is written to or read from the DDRAM. At the same time, the address counter (ADC) is also incremented by 1 (when I/D = “1”; increment) or decremented by 1 (when I/D = “0”; decrement). After a character pattern is written to or read from the CGRAM, the address counter (ADC) is incremented by 1 (when I/D = “1”; increment) or decremented by 1 (when I/D = “0”; decrement). Also after data is written to or read from the ABRAM, the address counter (ADC) is incremented by 1 (when I/D = “1”; increment) or decremented by 1 (when I/D = “0”; decrement). (2) When S = “1”, the cursor or blink stops and the entire display shifts to the left (I/D = “1”) or to the right (I/D = “0”) by 1 character position after a character code is written to the DDRAM. In the case of S = “1”, when a character code is read from the DDRAM, when a character pattern is written to or read from the CGRAM or when data is written to or read from the ABRAM, normal read/write is carried out without shifting of the entir e display. (The entire display does not shift, but the cursor or blink shifts to the right (I/D = “1”) or to the left (I/D = “0”) by 1 character position.) When S = “0”, the display does not shift, but normal write/read is performed. Note: The execution time of this instruction is 37 s (maximum) at an oscillation frequency of 270 kHz. 4) Display ON/OFF Control RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 D DB1 C DB0 B Instruction code: (1) The “D” bit (DB2) of this instruction determines whether or not to display character patterns on the LCD. When the “D” bit is “1”, character patterns are displayed on the LCD. When the “D” bit is “0”, character patterns are not displayed on the LCD and the cursor/blinking also disappear. Note: Unlike the Display Clear instruction, this instruction does not change the character code in the DDRAM . (2) When the “C” bit (DB1) is “0”, the cursor turns off. When both the “C” and “D” bits are “1”, the cursor turns on. (3) When the “B” bit (DB0) is “0”, blinking is canceled . When both the “B” and “D” bits are “1”, blinking is performed. In the Blinking mode, all dots including those of the cursor, the character pattern and the cursor are alternately displayed. Note: The execution time of this instruction is 37 s (maximum) at an oscillation frequency of 270 kHz.

LAPIS Semiconductor ML9042-xx 5) Cursor/Display Shift RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 S/C DB2 R/L DB1 DB0  Instruction code: : Don’t Care S/C = “0”, R/L = “0” This instruction shifts left the cursor and blink positions by 1 (decrements the content of the ADC by 1). S/C = “0”, R/L = “1” This instruction shifts right the cursor and blink positions by 1 (increments the content of the ADC by 1). S/C = “1”, R/L = “0” This instruction shifts left the entire display by 1 character position. The cursor and blink positions move to the left together with the entire display. The Arbitrator display is not shifted. (The content of the ADC remains unchanged.) S/C = “1”, R/L = “1” This instruction shifts right the entire display by 1 character position. The cursor and blink positions move to the right together with the entire display. The Arbitrator display is not shifted. (The content of the ADC remains unchanged.) In the 2-line mode, the cursor or blink moves from the fi rst line to the second line when the cursor at digit 40 (27; hex) of the first line is shifted right. When the entire display is shifted, the character pattern, cursor or blink will not move between the lines (from line 1 to line 2 or vice versa). Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz. 6) Function Setting RS1 RS0 R/W DB7 DB6 DB5 DB4 DL DB3 N DB2 ABE DB1 SSR DB0 CSR : Don’t Care Instruction code: (1) When the “DL” bit (DB 4) of this instruction is “1”, the data transfer to and from the CPU is performed once by the use of 8 bits DB7 to DB0. When the “DL” bit (DB 4) of this instruction is “0”, the data transfer to and from the CPU is performed twice by the use of 4 bits DB7 to DB4. (2) The 2-line display mode is selected when the “N” bit (DB 3) of this instruction is “1”. The 1-line display mode is selected when the “N” bit is “0”. The arbitrator is displayed when the “ABE” bit (DB2) of this instruction is “1”. The arbitrator is not displayed when the “ABE” bit (DB 2) of this instruction is “0”. (3) The transfer direction of the segment signal output data is controlled. When the “SSR” bit (DB 1) of this instruction is “1”, the data is transferred from SEG100 to SEG1. When the “SSR” bit (DB1) of this instruction is “0”, the data is transferred from SEG1 to SEG100. The transfer direction of the common signal output data is controlled. At 1/n duty, When the “CSR” bit (DB 0) of this instruction is “1”, the data is transferred from COMn to COM1. When the “CSR” bit (DB 0) of this instruction is “0”, the data is transferred from COM1 to COMn. After the ML9042 is powered on, this function setting should be carried out before execution of any instruction except the Busy Flag Read. After this function setting, no instructions other than the DL Set instruction can be executed. In the Serial I/F Mode, DL setting is ignored.

LAPIS Semiconductor ML9042-xx N ABE Number of display lines Font size Duty Number of biases Number of common signals 0 0 1 5  8 1/8 4 8 0 1 1 5  8 1/9 4 9 1 0 2 5  8 1/16 5 16 1 1 2 5  8 1/17 5 17 Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz. 7) CGRAM Address Setting RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 C0Instruction code: This instruction sets the CGRAM address to the data represented by the bits C 5 to C0 (binary). The CGRAM addresses are valid until DDRAM or ABRAM addresses are set. The CPU writes or reads character patterns starting from the one represented by the CGRAM address bits C 5 to C0 set in the instruction code at that time. Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz. 8) DDRAM Address Setting RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 D0Instruction code: This instruction sets the DDRAM address to the data represented by the bits D 6 to D0 (binary). The DDRAM addresses are valid until CGRAM or ABRAM addresses are set. The CPU writes or reads character codes starting from the one represented by the DDRAM address bits D 6 to D0 set in the instruction code at that time. In the 1-line mode (the “N” bit is “0”), the DDRAM address represented by bits D 6 to D0 (binary) should be in the range “00” to “4F” in hexadecimal. In the 2-line mode (the “N” bit is “1”), the DDRAM address represented by bits D 6 to D0 (binary) should be in the range “00” to “27” or “40” to “67” in hexadecimal. If an address other than above is input, the ML9042 cannot properly write a character code in or read it from the DDRAM. Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz. 9) DDRAM/ABRAM/CGRAM Data Write RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 E0 Instruction code: A character code (E 7 to E0) is written to the DDRAM, Display-ON data (E7 to E0) to the ABRAM or a character pattern (E7 to E0) to the CGRAM. The DDRAM, ABRAM or CGRAM is selected at the preceding address setting. After data is written, the address counter (ADC) is incremented or decremented as set by the Entry Mode Setting instruction (see 3). Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz.

LAPIS Semiconductor ML9042-xx 10) Busy Flag/Address Counter Read (Execution time: 0 s) RS1 RS0 R/W DB7 BF DB6 DB5 DB4 DB3 DB2 DB1 DB0 O0 Instruction code: The “BF” bit (DB7) of this instruction tells whether the ML9042 is busy in internal operation (BF = “1”) or not (BF = “0”). When the “BF” bit is “1”, the ML9042 cannot accept any other instructions. Before inputting a new instruction, check that the “BF” bit is “0”. When the “BF” bit is “0”, the ML9042 outputs the correct value of the address counter. The value of the address counter is equal to the DDRAM, ABRAM or CGRAM address. Which of the DDRAM, ABRAM and CGRAM addresses is set in the counter is determined by the preceding address setting. When the “BF” bit is “1”, the value of the address counter is not always correct because it may have been incremented or decremented by 1 during internal operation. 11) DDRAM/ABRAM/CGRAM Data Read RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 P0 Instruction code: A character code (P 7 to P 0) is read from the DDRAM, Display-ON data (P 7 to P 0) from the ABRAM or a character pattern (P7 to P0) from the CGRAM. The DDRAM, ABRAM or CGRAM is selected at the preceding address setting. After data is read, the address counter (ADC) is incr emented or decremented as set by the Entry Mode Setting instruction (see 3). Note: Conditions for reading correct data (1) The DDRAM, ABRAM or CGRAM Setting instruction is input before this data read instruction is input. (2) When reading a character code from the DDRAM, th e Cursor/Display Shift instruction (see 5) is input before this Data Read instruction is input. (3) When two or more consecutive RAM Data Read in structions are executed, the following read data is correct. Correct data is not output under conditions other than the cases (1), (2) and (3) above. Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz.

LAPIS Semiconductor ML9042-xx Expansion Instruction Codes Th e busy status of the ML9042 is rather longer than the cycle time of the CPU, since the internal processing of the ML9042 starts at a timing which does not affect the display on the LCD. In the busy status (Busy Flag is “1”), the ML9042 executes the Busy Flag Read instruction only. Therefore, the CPU should ensure that the Busy Flag is “0” before sending an expansion instruction code to the ML9042. 1) Arbitrator Display Line Set RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 ASExpansion instruction code: This expansion instruction code sets the Arbitrator display line. The relationship between the status of this bit and the common outputs is as follows: For display examples, refer to LCD Drive Waveforms section. ABE bit CSR bit duty AS bit Shift direction Arbitrator’s common pin L L 1/8 L COM1COM8 None L L 1/8 H COM1COM8 None L L 1/16 L COM1COM16 None L L 1/16 H COM1COM16 None L H 1/8 L COM8COM1 None L H 1/8 H COM8COM1 None L H 1/16 L COM16 COM1 None L H 1/16 H COM16COM1 None H L 1/9 L COM1COM9 COM9 H L 1/9 H COM1COM9 COM1 H L 1/17 L COM1COM17 COM17 H L 1/17 H COM1COM17 COM1 H H 1/9 L COM9COM1 COM1 H H 1/9 H COM9 COM1 COM9 H H 1/17 L COM17COM1 COM1 H H 1/17 H COM17 COM1 COM17 Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz. 2) ABRAM Address Setting RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 H0Expansion instruction code: This instruction sets the ABRAM address to the data represented by the bits H 4 to H0 (binary). The ABRAM addresses are valid until CGRAM or DDRAM addresses are set. The CPU writes or reads the Display-ON data starting fr om the one represented by the ABRAM address bits H to H0 set in the instruction code at that time. When the ABRAM address represented by bits H 4 to H0 (binary) is in the range “00” to “13” in hexadecimal, data is output to the LCD as the arbitrator. Note: The execution time of this instruction is 37 s at an oscillation frequency (OSC) of 270 kHz.

LAPIS Semiconductor ML9042-xx Examples of Combinations of ML9042 and LCD Panel (1) Driving the LCD of one 20-character line under the conditions of the 1-line display mode and no arbitrator display (1/8 duty, ABE = “0”, AS = “0” or “1”, CSR = “0”, SSR = “1”) COM1 Character COM8 SEG100 SEG1 ML9042  COM 9 to COM17 output Display-OFF common signals. (1/8 duty, ABE = “0”, AS = “0” or “1”, CSR = “1”, SSR = “0”) COM8 Character COM1 SEG1 SEG100 ML9042  COM 9 to COM17 output Display-OFF common signals.

LAPIS Semiconductor ML9042-xx (2) Driving the LCD of one 20-character line under the cond itions of the 1-line display mode and the arbitrator display (1/9 duty, ABE = “1”, AS = “0”, CSR = “0”, SSH = “1”) COM1 COM8 COM9 SEG100 SEG1 ML9042 Character Arbitrator  COM 10 to COM17 output Display-OFF common signals. (1/9 duty, ABE = “1”, AS = “1”, CSR = “0”, SSR = “1”) COM1 COM2 COM9 SEG100 SEG1 ML9042 Character Arbitrator  COM 10 to COM17 output Display-OFF common signals.

LAPIS Semiconductor ML9042-xx (1/9 duty, ABE = “1”, AS = “0”, CSR = “1”, SSR = “0”) COM9 COM2 COM1 SEG1 SEG100 ML9042 Character Arbitrator  COM 10 to COM17 output Display-OFF common signals. (1/9 duty, ABE = “1”, AS = “1”, CSR = “1”, SSR = “0”) COM9 COM8 COM1 SEG1 SEG100 ML9042 Character Arbitrator  COM 10 to COM17 output Display-OFF common signals.

LAPIS Semiconductor ML9042-xx (3) Driving the LCD of two 20-character lines under the conditions of the 2-line display mode and no arbitrator display (1/16 duty, ABE = “0”, AS = “0” or “1”, CSR = “0”, SSR = “1”) COM1 COM8 SEG100 SEG 1 ML9042 COM9 COM16 Character Character  COM 17 outputs Display-OFF common signal. (1/16 duty, ABE = “0”, AS = “0” or “1”, CSR = “1”, SSR = “0”) COM16 COM9 SEG1 SEG 100 ML9042 COM8 COM1 Character Character  COM 17 outputs Display-OFF common signal.

LAPIS Semiconductor ML9042-xx (4) Driving the LCD of two 20-character lines under the conditions of the 2-line display mode and the arbitrator display (1/17 duty, ABE = “1”, AS = “0”, CSR = “0”, SSR = “1”) COM1 COM8 SEG100 SEG 1 ML9042 COM9 COM16 COM17 Character Character Arbitrator (1/17 duty, ABE = “1”, AS = “1”, CSR = “0”, SSR = “1”) COM2 COM1 COM9 SEG100 SEG 1 ML9042 COM10 COM17 Character Character Arbitrator

LAPIS Semiconductor ML9042-xx (1/17 duty, ABE = “1”, AS = “0”, CSR = “1”, SSR = “0”) COM17 COM10 SEG1 SEG100 ML9042 COM9 COM1 Character Character Arbitrator COM2 (1/17 duty, ABE = “1”, AS = “1”, CSR = “1”, SSR = “0”) COM16 COM17 COM9 SEG1 SEG 100 ML9042 COM8 COM1 Character Character Arbitrator

LAPIS Semiconductor ML9042-xx EXAMPLES OF VLCD GENERATION CIRCUITS  With 1/4 bias, a voltage multiplier ML9042 BE VIN VCC VC GND V3B V3A VDD Reference potential for voltage multiplier VOUT  With 1/4 bias, no voltage multiplier 1) Apply V DD to VOUT and V0. 2) Apply VDD to VOUT, and apply the V0 level to V0 externally. ML9042 BE VIN VCC VC GND V3B V3A VDD V0 level VOUT

LAPIS Semiconductor ML9042-xx  With 1/5 bias, a voltage multiplier ML9042 BE VIN VCC VC GND V3B V3A VDD Reference potential for voltage multiplier VOUT  With 1/5 bias, no voltage multiplier 1) Apply V DD to VOUT and V0. 2) Apply VDD to VOUT, and apply the V0 level to V0 externally. ML9042 BE VIN VCC VC GND V3B V3A VDD V0 level VOUT

LAPIS Semiconductor ML9042-xx LCD Drive Waveforms Th e COM and SEG waveforms (AC signal waveforms for display) vary according to the duty (1/9 and 1/17 duties). See 1) and 2) below. The relationship between the duty ratio and the frame frequency is as follows: Duty ratio Frame Frequency 1/8 84.4 Hz 1/9 75.0 Hz 1/16 84.4 Hz 1/17 79.4 Hz Note: At an oscillation frequency (OSC) of 270 kHz 1) COM and SEG Waveforms on 1/9 Duty (ABE = “1”) 1 frame V2, V3B V2, V3B V2, V3B V2, V3B COM1 (CSR = “L”, AS = “L”) COM2 (CSR = “L”, AS = “H”) COM9 (CSR = “H”, AS = “L”) COM8 (CSR = “H”, AS = “H”) (first character line) COM2 (CSR = “L”, AS = “L”) COM3 (CSR = “L”, AS = “H”) COM8 (CSR = “H”, AS = “L”) COM7 (CSR = “H”, AS = “H”) (second character line) COM8 (CSR = “L”, AS = “L”) COM9 (CSR = “L”, AS = “H”) COM2 (CSR = “H”, AS = “L”) COM1 (CSR = “H”, AS = “H”) (eighth character line) COM9 (CSR = “L”, AS = “L”) COM1 (CSR = “L”, AS = “H”) COM1 (CSR = “H”, AS = “L”) COM9 (CSR = “H”, AS = “H”) (arbitrator line) V2, V3B COM10 to COM17 V2, V3B SEG Display turning-off waveform Display turning-on waveform 8 9 1 2 3 4 ··· 7 8 9 1 2 3 4 ··· 7 8 9 1 2 2 1 9 8 7 6 ··· 3 2 1 9 8 7 6 ··· 3 2 1 9 8 CSR=“H” CSR=“L”

LAPIS Semiconductor ML9042-xx 2) COM and SEG Waveforms on 1/17 Duty (ABE = “1”) 1 frame V3A (V3B) Display turning-off waveform Display turning-on waveform V3A (V3B) V3A (V3B) V3A (V3B) SEG V3A (V3B) COM1 (CSR = “L”, AS = “L”) COM2 (CSR = “L”, AS = “H”) COM17 (CSR = “H”, AS = “L”) COM16 (CSR = “H”, AS = “H”) (first character line) COM2 (CSR = “L”, AS = “L”) COM3 (CSR = “L”, AS = “H”) COM16 (CSR = “H”, AS = “L”) COM15 (CSR = “H”, AS = “H”) (second character line) COM16 (CSR = “L”, AS = “L”) COM17 (CSR = “L”, AS = “H”) COM2 (CSR = “H”, AS = “L”) COM1 (CSR = “H”, AS = “H”) (sixteenth character line) COM17 (CSR = “L”, AS = “L”) COM1 (CSR = “L”, AS = “H”) COM1 (CSR = “H”, AS = “L”) COM17 (CSR = “H”, AS = “H”) (arbitrator line) 16 17 1 2 3 4 5 6 7 8 9 10 11 12 13 ··· 16 17 1 2 3 4 CSR=“L” 2 1 17 16 15 14 13 12 11 10 9 8 7 6 5 ··· 2 1 17 16 15 14 CSR=“H”

LAPIS Semiconductor ML9042-xx Initial Setting of Instructions (a) Data tran sfer from and to the CPU using 8 bits of DB0 to DB7 1) Turn on the power. 2) Wait for 15 ms or more after V DD has reached 2.7 V or higher. 3) Set “8 bits” with the Function Setting instruction. 4) Wait for 4.1 ms or more. 5) Set “8 bits” with the Function Setting instruction. 6) Wait for 100 s or more. 7) Set “8 bits” with the Function Setting instruction. 8) Check the Busy Flag for No Busy (or wait for 100 s or more). 9) Set “8 bits”, “Number of LCD lines” and “Font size” with the Function Setting instruction. (After this, the number of LCD lines and the font size cannot be changed.) 10) Check the Busy Flag for No Busy. 11) Execute the Display ON/OFF control Instruction, Display Clear Instruction, Entry Mode Setting instruction and Arbitrator Display Line Setting Instruction. 12) Check the Busy Flag for No Busy. 13) Initialization is completed. An example of instruction code for 3), 5) and 7) RS1 RS0 R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 : Don’t Care (b) Data transfer from and to the CPU using 4 bits of DB 4 to DB7 1) Turn on the power. 2) Wait for 15 ms or more after V DD has reached 2.7 V or higher. 3) Set “8 bits” with the Function Setting instruction. 4) Wait for 4.1 ms or more. 5) Set “8 bits” with the Function Setting instruction. 6) Wait for 100 s or more. 7) Set “8 bits” with the Function Setting instruction. 8) Check the Busy Flag for No Busy (or wait for 100 s or longer). 9) Set “4 bits” with the Function Setting instruction. 10) Wait for 100  s or longer. 11) Set “4 bits”, “Number of LCD lines” and “Font size” with the Function Setting instruction. (After this, the number of LCD lines and the font size cannot be changed.) 12) Check the Busy Flag for No Busy. 13) Execute the Display ON/OFF control Instruction, Display Clear Instruction, Entry Mode Setting instruction and Arbitrator Display Line Setting Instruction. 14) Check the Busy Flag for No Busy. 15) Initialization is completed. An example of instruction code for 3), 5) and 7) RS1 RS0 R/W DB7 DB6 DB5 DB4

LAPIS Semiconductor ML9042-xx An example of instruction code for 9) RS1 RS0 R/W DB7 DB6 DB5 DB4 *: From 11), input data twice by the use of 4-bit data. *: In 13), check the Busy Flag for No Busy before executing each instruction. (c) Data transfer from and to the CPU using the serial I/F 1) Turn on the power. 2) Wait for 15 ms or more after V DD has reached 2.7 V or higher. 3) Check the busy flag for No Busy. 4) Set “Number of LCD lines” and “Font size” with the Function Setting Instruction. (After this, the number of LCD lines and the font size cannot be changed.) 5) Check the busy flag for No Busy. 6) Execute the Display ON/OFF control Instruction, the Display Clear Instruction, the Entry Mode Instruction and the Arbitrator Display Line Setting Instruction. 7) Check the busy flag for No Busy. 8) Initialization is completed. *: In 6), check the Busy Flag for No Busy before executing each instruction.

LAPIS Semiconductor ML9042-xx ML9042-xx CVWA/DVWA PAD CONFIGURATION Pad Layout Chip Size: 7.8  1.8 mm Chip Thickness: 625 20 m Bump Size: 100  44 m Y X 220 221 114 233 101 115 100 Pad Coordinates Pad Symbol X ( m) Y ( m) Pad Symbol X ( m) Y ( m)

1 DUMMY -3750 –750 21 DUMMY -2250 –750

2 OSC2 -3675 –750 22 E/SHTB -2175 –750

3 OSCR5 -3600 –750 23 E/SHTB -2100 –750

4 OSCR3 -3525 –750 24 DUMMY -2025 –750

5 OSC1 -3450 –750 25 DUMMY -1950 –750

6 DUMMYGND -3375 –750 26 DB0/SO -1875 –750

7 T1 -3300 –750 27 DB0/SO -1800 –750

8 T2 -3225 –750 28 DUMMY -1725 –750

9 T3 -3150 –750 29 DUMMY -1650 –750

10 ROM1S -3075 –750 30 DB1 -1575 –750

11 DUMMYVDD -3000 –750 31 DB1 -1500 –750

12 RS1 -2925 –750 32 DUMMY -1425 –750

13 RS1 -2850 –750 33 DUMMY -1350 –750

14 RSO/CSB -2775 –750 34 DB2 -1275 –750

15 RSO/CSB -2700 –750 35 DB2 -1200 –750

16 DUMMY -2625 –750 36 DUMMY -1125 –750

17 DUMMY -2550 –750 37 DUMMY -1050 –750

18 RW/SI -2475 –750 38 DB3 -975 –750

19 RW/SI -2400 –750 39 DB3 -900 –750

20 DUMMY -2325 –750 40 DUMMY -825 –750

LAPIS Semiconductor ML9042-xx Pad Symbol X ( m) Y ( m) Pad Symbol X ( m) Y ( m)

41 DUMMY -750 –750 81 V0 2250 -750

42 DB4 -675 –750 82 V0 2325 -750

43 DB4 -600 –750 83 V0 2400 -750

44 DUMMY -525 –750 84 V0 2475 -750

45 DUMMY -450 –750 85 V1 2550 -750

46 DB5 -375 –750 86 V2 2625 -750

47 DB5 -300 –750 87 V2 2700 -750

48 DUMMY -225 –750 88 V3A 2775 -750

49 DUMMY -150 –750 89 V3A 2850 -750

50 DB6 -75 –750 90 V3B 2925 -750

51 DB6 0 –750 91 V3B 3000 -750

52 DUMMY 75 –750 92 V4 3075 -750

53 DUMMY 150 –750 93 VC 3150 -750

54 DB7 225 –750 94 VC 3225 -750

55 DB7 300 –750 95 VC 3300 -750

56 DUMMYVDD 375 –750 96 VC 3375 -750

57 SP 450 –750 97 VCC 3450 -750

58 GND 525 –750 98 VCC 3525 -750

59 GND 600 –750 99 VCC 3600 -750

60 GND 675 –750 100 DUMMY 3675 -750

61 GND 750 –750 101 DUMMY 3750 -462

62 GND 825 –750 102 COM17 3750 -392

63 GND 900 –750 103 COM16 3750 -322

64 BE 975 –750 104 COM15 3750 -252

65 VDD 1050 –750 105 COM14 3750 -182

66 VDD 1125 –750 106 COM13 3750 -112

67 VDD 1200 –750 107 COM12 3750 -42

68 VDD 1275 –750 108 COM11 3750 28

69 VDD 1350 –750 109 COM10 3750 98

70 VDD 1425 –750 110 COM9 3750 168

71 TESTIN 1500 –750 111 DUMMY 3750 238

72 TESTIN 1575 –750 112 DUMMY 3750 308

73 TESTOUT 1650 –750 113 DUMMY 3750 378

74 TESTOUT 1725 –750 114 DUMMY 3750 448

75 VIN 1800 –750 115 DUMMY 3675 750

76 VIN 1875 –750 116 DUMMY 3605 750

77 VOUT 1950 –750 117 DUMMY 3535 750

78 VOUT 2025 –750 118 SEG100 3465 750

79 V0 2100 –750 119 SEG99 3395 750

80 V0 2175 –750 120 SEG98 3325 750

LAPIS Semiconductor ML9042-xx Pad Symbol X ( m) Y ( m) Pad Symbol X ( m) Y ( m)

121 SEG97 3255 750 161 SEG57 455 750

122 SEG96 3185 750 162 SEG56 385 750

123 SEG95 3115 750 163 SEG55 315 750

124 SEG94 3045 750 164 SEG54 245 750

125 SEG93 2975 750 165 SEG53 175 750

126 SEG92 2905 750 166 SEG52 105 750

127 SEG91 2835 750 167 SEG51 35 750

128 SEG90 2765 750 168 SEG50 -35 750

129 SEG89 2695 750 169 SEG49 -105 750

130 SEG88 2625 750 170 SEG48 -175 750

131 SEG87 2555 750 171 SEG47 -245 750

132 SEG86 2485 750 172 SEG46 -315 750

133 SEG85 2415 750 173 SEG45 -385 750

134 SEG84 2345 750 174 SEG44 -455 750

135 SEG83 2275 750 175 SEG43 -525 750

136 SEG82 2205 750 176 SEG42 -595 750

137 SEG81 2135 750 177 SEG41 -665 750

138 SEG80 2065 750 178 SEG40 -735 750

139 SEG79 1995 750 179 SEG39 -805 750

140 SEG78 1925 750 180 SEG38 -875 750

141 SEG77 1855 750 181 SEG37 -945 750

142 SEG76 1785 750 182 SEG36 -1015 750

143 SEG75 1715 750 183 SEG35 -1085 750

144 SEG74 1645 750 184 SEG34 -1155 750

145 SEG73 1575 750 185 SEG33 -1225 750

146 SEG72 1505 750 186 SEG32 -1295 750

147 SEG71 1435 750 187 SEG31 -1365 750

148 SEG70 1365 750 188 SEG30 -1435 750

149 SEG69 1295 750 189 SEG29 -1505 750

150 SEG68 1225 750 190 SEG28 -1575 750

151 SEG67 1155 750 191 SEG27 -1645 750

152 SEG66 1085 750 192 SEG26 -1715 750

153 SEG65 1015 750 193 SEG25 -1785 750

154 SEG64 945 750 194 SEG24 -1855 750

155 SEG63 875 750 195 SEG23 -1925 750

156 SEG62 805 750 196 SEG22 -1995 750

157 SEG61 735 750 197 SEG21 -2065 750

158 SEG60 665 750 198 SEG20 -2135 750

159 SEG59 595 750 199 SEG19 -2205 750

160 SEG58 525 750 200 SEG18 -2275 750

LAPIS Semiconductor ML9042-xx Pad Symbol X ( m) Y ( m)

201 SEG17 -2345 750

202 SEG16 -2415 750

203 SEG15 -2485 750

204 SEG14 -2555 750

205 SEG13 -2625 750

206 SEG12 -2695 750

207 SEG11 -2765 750

208 SEG10 -2835 750

209 SEG9 -2905 750

210 SEG8 -2975 750

211 SEG7 -3045 750

212 SEG6 -3115 750

213 SEG5 -3185 750

214 SEG4 -3255 750

215 SEG3 -3325 750

216 SEG2 -3395 750

217 SEG1 -3465 750

218 DUMMY -3535 750

219 DUMMY -3605 750

220 DUMMY -3675 750

221 DUMMY -3750 448

222 DUMMY -3750 378

223 DUMMY -3750 308

224 DUMMY -3750 238

225 COM1 -3750 168

226 COM2 -3750 98

227 COM3 -3750 28

228 COM4 -3750 -42

229 COM5 -3750 -112

230 COM6 -3750 -182

231 COM7 -3750 -252

232 COM8 -3750 -322

233 DUMMY -3750 -392

LAPIS Semiconductor ML9042-xx ML9042-xx CVWA/DVWA ALIGNMENT MARK SPECIFICATION Alignment Mark Coordinates Alignment Mark X ( m) Y ( m) A –3770 770 B 3770 770 C 3770 –770 The coordinates (X, Y) indicate the distances to the center of an alignment mark (the center of the maximum outline of the L shape). Alignment Mark Layer Gol d bump Alignment Mark Gold Bump Specification Symbol Parameter Mark Size (m) a Alignment Mark Width A, B, C 30 b Alignment Mark Size A, B, C 80 A B C X Y (0, 0) a b + a b

LAPIS Semiconductor ML9042-xx ML9042-xx CVWA GOLD BUMP SPECIFICATION (HIGH HARDNESS) Gold Bump Specification (Unit: m) Symbol Parameter MIN TYP MAX A Bump Pitch (I/O Section: Pitch Direction) 70 — — B Bump Size (I/O Section: Pitch Direction) 40 44 48 C Bump Size (I/O Section: Depth Direction) 96 100 104 D Bump-to-Bump Distance (I/O Section: Pitch Direction) 22 26 30 E Bump Size (L-mark Section: Length) 76 80 84 F Bump Size (L-mark Section: Width) 26 30 34 G Sliding of Total Bump Pitches — — 2 Bump Height 10 15 20 H Bump Height Dispersion Inside Chip (Range) — — 4 I Bump Edge Height — — 5 J Shear Strength (g) 27 — — K Bump Hardness (Hv: 25 g load) 50 90 130 Wafer Thickness; 625 20 m Chip Size; 7.80 mm 1.80 mm Top View and Cross Section View B D E [Cross Section View][I/O Section] [L-Alignment Mark] A C F IH

LAPIS Semiconductor ML9042-xx ML9042-xx CVWA GOLD BUMP SPECIFICATION (LOW HARDNESS) Gold Bump Specification (Unit: m) Symbol Parameter MIN TYP MAX A Bump Pitch (I/O Section: Pitch Direction) 70 — — B Bump Size (I/O Section: Pitch Direction) 40 44 48 C Bump Size (I/O Section: Depth Direction) 96 100 104 D Bump-to-Bump Distance (I/O Section: Pitch Direction) 22 26 30 E Bump Size (L-mark Section: Length) 76 80 84 F Bump Size (L-mark Section: Width) 26 30 34 G Sliding of Total Bump Pitches — — 2 Bump Height 10 15 20 H Bump Height Dispersion Inside Chip (Range) — — 4 I Bump Edge Height — — 5 J Shear Strength (g) 27 — — K Bump Hardness (Hv: 25 g load) 30 — 80 Wafer Thickness; 625 20 m Chip Size; 7.80 mm 1.80 mm Top View and Cross Section View B D E [Cross Section View][I/O Section] [L-Alignment Mark] A C F IH

LAPIS Semiconductor ML9042-xx

REVISION HISTORY

No. Date Previous Edition Current Edition

Description

PEDL9042-01 Jun. 16, 2003 – – Preliminary first edition 5 5 Changed descriptions of Symbols V C and VCC 8 8 Changed DC Characteristics Condition VDD = 4.5 to 5.5VVDD = 4.0 to 5.5V Ta = 25CTa =- 20 to 75C Spec Min. 175 Typ. 270 Max. 365 Min. 200 Typ. 270 Max. 351 Min. 175 Typ. 270 Max. 365 Min. 200 Typ. 280 Max. 364 25 25 Added of table 44 44 Partially changed figure of generation circuits C+)(VCC+) and V2,V3A,V3B FEDL9042-01 Nov. 19, 2003 45 45 Partially changed figure of generation circuits C+)(VCC+)

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