FE0502A-0.4PF FUTUREWAFER | Alldatasheet

Document overview

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Technical content

Applications

  • Lan equipment
  • Video
  • DVI
  • High Speed Data Line
  • Ethernet
  • USB 3.0 Power and Data line Protection Feature
  • With TVS Diode
  • ESD Protection: Level 4
  • Low clamping voltage
  • 60 Watts peak pulse power per line (tp=8/20µS)
  • Ultra low capacitance:0.5 pF max.
  • Protection one line I/O port DFN1006 IEC Compatibility
  • EN61000-4
  • 61000-4-2(ESD):Level 4,Contact:±8kv,Air:±15kv
  • 61000-4-5(Surge):3A-8/20us Mechanical Characteristics
  • Molded JEDEC DFN1006 package
  • Packing: Tape and Reel
  • Flammability rating UL 94V-0
  • Halogen Free Device Characteristics Maximum Ratings@25 unless otherwise specified Parameter Symbol Value Units Peak pulse power (tp=8/20us) PPP 60 Watts Operating Temperature TJ -55~150 °C Storage Temperature TSTG -55~150 °C Bi-directional, Extra Low Capacitance ESD Protection Futurewafer Technology Co., Ltd E1606F2A-FW-STD-001

Parameter Symbol Condition min max Units typ Reverse Stand-off Voltage VRWM Pin 2-1/Pin 1-2 5 V Reverse Breakdown Voltage VBR It=1mA 6 9 V Reverse Leakage Current IR (max) VRWM=5V, T=25°C 1 uA Clamping Voltage VC IPP=1A tp=8/20us IPP=3A tp=8/20us V Peak Pulse Current IPP tp=8/20us 3 A Junction Capacitance C I/O Pin capacitance Pin to Pin. Vdc=0V,f=1MHZ 0.5 pf 0.4 Bi-directional, Extra Low Capacitance ESD Protection

Electrical Characteristics

Futurewafer Technology Co., Ltd E1606F2A-FW-STD-001

Ordering information

Part No. Marking FE0502A F5 Quantity 10,000pcs / 2mm Pitch Reel Bi-directional, Extra Low Capacitance ESD Protection

Package information

Unit ：mm SYMBOL MILLIMETER MIN NOM MAX A 0.45 0.50 0.55 A1 - 0.02 0.05 b 0.45 0.50 0.55 c 0.12 0.15 0.18 D 0.95 1.00 1.05 e 0.65BSC E 0.55 0.60 0.65 L 0.20 0.25 0.30 L1 0.05REF h 0.07 0.12 0.17 Futurewafer Technology Co., Ltd E1606F2A-FW-STD-001

FutureWafer Technology co., Ltd 台灣未來芯航電股份有限公司 Tel ：+886-3-3573583/Tel ：+886-3-3574065 Futurewafer.com.tw 桃園市桃園區中正路 987 巷 50 弄 2 號 Bi-directional, Extra Low Capacitance ESD Protection Futurewafer Technology Co., Ltd Tape Information E1606F2A-FW-STD-001 FE0502A Pad Layout Dimension DIM Millimeters E 1.75±0.10 F 3.50±0.05 P2 2.00±0.05 D 1.55±0.05 D1 0.40±0.05 P0 4.00±0.10 10P0 40.00±1.00 Dimension DIM Millimeters W 8.00±0.10 P 2.00±0.10 A0 0.70±0.05 B0 1.15±0.05 K0 0.57±0.03 t 0.20±0.05 θ 3°typ