FCX558
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 7
Technical content
Features
BVCEO > -400V IC = -200mA High Continuous Current ICM = -500mA Peak Pulse Current Excellent hFE Characteristics up to -100mA Low Saturation Voltage VCE(sat) < -200mV @ -20mA Complementary NPN Type: FCX458 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Mechanical Data Case: SOT89 Case Material: Molded Plastic. “Green” Molding Compound. UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.05 grams (Approximate) Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel FCX558TA AEC-Q101 P58 7 12 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Marking Information P58 = Product Type Marking Code Top View Device Symbol Top View Pin Out SOT89 C E C B C E B P58
Datasheet Number: DS33059 Rev. 7 - 2 2 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Limit Unit Collector-Base Voltage VCBO -400 V Collector-Emitter Voltage VCEO -400 V Emitter-Base Voltage VEBO -7 V Continuous Collector Current IC -200 mA Peak Pulse Current ICM -500 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 0.7 W (Note 6) 1 (Note 7) 1.5 (Note 8) 2 Thermal Resistance, Junction to Ambient Air (Note 5) RθJA 178 °C/W (Note 6) 125 (Note 7) 83 (Note 8) 60 Thermal Resistance, Junction to Lead (Note 9) RθJL 22 Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single -sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady -state. 6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper. 7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. Thermal Characteristics and Derating Information 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 40.0 60.0 80.0 100.0 120.0 140.0 2oz copper 1oz copper TA=25°C Copper Area (sqmm) Maximum Power (W)2oz copper 1oz copper Copper Area (sqmm) Thermal Resistance (°C/W)
Datasheet Number: DS33059 Rev. 7 - 2 3 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Thermal Characteristics and Derating Information (cont.) 0 20 40 60 80 100 120 140 1600.0 0.2 0.4 0.6 0.8 1.0 1.2 15mm x 15mm 1oz FR4 PCB 0 20 40 60 80 100 120 140 1600.0 0.2 0.4 0.6 0.8 1.0 Max Power Dissipation (W) Temperature (°C) Derating Curve MRP 1oz FR4 PCB Derating Curve Temperature (°C) Max Power Dissipation (W) 100µ 1m 10m 100m 1 10 100 1k0 100 110 120 130 15mm x 15mm 1oz FR4 PCB Transient Thermal Impedance D=0.5 D=0.2 D=0.1 Single Pulse D=0.05 Thermal Resistance (°C/W)Pulse Width (s) 100µ 1m 10m 100m 1 10 100 1k 100 15mm x 15mm 1oz FR4 PCB Single Pulse TA=25°C Pulse Power Dissipation Pulse Width (s) Maximum Power (W) 100µ 1m 10m 100m 1 10 100 1k0 100 120 140 160 180 MRP 1oz FR4 PCB Transient Thermal Impedance D=0.5 D=0.2 D=0.1 Single Pulse D=0.05 Thermal Resistance (°C/W)Pulse Width (s) 100µ 1m 10m 100m 1 10 100 1k 100 MRP 1oz FR4 PCB Single Pulse TA=25°C Pulse Power Dissipation Pulse Width (s) Maximum Power (W)
Datasheet Number: DS33059 Rev. 7 - 2 4 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ. Max Unit Test Condition Collector-Base Breakdown Voltage BVCBO -400 -540 - V IC = -100µA Collector-Emitter Breakdown Voltage (Note 11) BVCEO -400 -510 - V IC = -1mA Collector-Emitter Breakdown Voltage BVCES -400 -540 V IC = -100µA Emitter-Base Breakdown Voltage BVEBO -7 -8.2 - V IE = -100µA Collector Cutoff Current ICBO - <-1 -100 nA VCB = -320V Emitter Cutoff Current ICES - <-1 -100 nA VCE = -320V Emitter Cutoff Current IEBO - <-1 -20 nA VEB = -6V DC Current Transfer Static Ratio (Note 11) hFE 100 100 300 IC = -1mA, VCE = -10V IC = -50mA, VCE = -10V IC = -100mA, VCE = -10V Collector-Emitter Saturation Voltage (Note 11) VCE(sat) - -0.2 -0.5 V IC = -20mA, IB = -2mA IC = -50mA, IB = -6mA Base-Emitter Saturation Voltage (Note 11) VBE(sat) - - -0.9 V IC = -50mA, IB = -5mA Base-Emitter Turn-on Voltage (Note 11) VBE(on) - - -0.9 V IC = -50mA, VCE = -10V Transitional Frequency fT 50 - - MHz IE = -10mA, VCE = -20V f = 20MHz Output Capacitance Cobo - - 5 pF VCB = -20V, f = 1MHz, Switching Times ton - 95 - nS IC = -50mA, VC = -100V IB1 = -5mA, IB2 = -10mA toff 1,600 Note: 11. Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤ 2%.
Datasheet Number: DS33059 Rev. 7 - 2 5 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Datasheet Number: DS33059 Rev. 7 - 2 6 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and c learance distances between device terminals and PCB tracking. E H B e c L A D 8° (4X) z R0.200 X Y Y2 G C SOT89 Dim Min Max Typ A 1.40 1.60 1.50 B 0.50 0.62 0.56 B1 0.42 0.54 0.48 c 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.62 1.83 1.733 D2 1.61 1.81 1.71 E 2.40 2.60 2.50 E2 2.05 2.35 2.20 e - - 1.50 H 3.95 4.25 4.10 H1 2.63 2.93 2.78 L 0.90 1.20 1.05 L1 0.327 0.527 0.427 z 0.20 0.40 0.30 All Dimensions in mm Dimensions Value (in mm) C 1.500 G 0.244 X 0.580 X1 0.760 X2 1.933 Y 1.730 Y1 3.030 Y2 1.500 Y3 0.770 Y4 4.530
Datasheet Number: DS33059 Rev. 7 - 2 7 of 7 www.diodes.com April 2017 © Diodes Incorporated FCX558 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other c hanges without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Cus tomers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2017, Diodes Incorporated www.diodes.com