FCX555

Document overview

  • Manufacturer or author: Diodes Inc
  • PDF pages: 7

Technical content

Features

  • BV CEO > -150V
  • BV CEV > -180V
  • I C = -700mA high Continuous Collector Current
  • Low saturation voltage VCE(sat) < -300mV @ -100mA
  • Complementary NPN type: FCX495
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Qualified to AEC-Q101 Standards for High Reliability Mechanical Data
  • Case: SOT89
  • Case material: molded plastic. “Green” molding compound.
  • UL Flammability Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208
  • Weight: 0.052 grams (Approximate) Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel FCX555TA 555 7 12 1,000 Notes: 1 . EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Marking Information 555 = Product Type Marking Code Top View Device Symbol Top View Pin Out SOT89 C E C B C E B P58555 Green

Datasheet Number: DS33058 Rev. 2 - 2 2 of 7 www.diodes.com June 2013 © Diodes Incorporated FCX555 A Product Line of Diodes Incorporated Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Limit Unit Collector-Base Voltage VCBO -180 V Collector-Emitter Voltage VCEV -180 V Collector-Emitter Voltage VCEO -150 V Emitter-Base Voltage VEBO -7 V Continuous Collector Current IC -0.7 A Peak Pulse Current ICM -2 A Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Power Dissipation (Note 5) PD W (Note 6) 1.5 (Note 7) 2.1 Thermal Resistance, Junction to Ambient Air (Note 5) RΘJA 125 °C/W (Note 6) 83 (Note 7) 60 Thermal Resistance, Junction to Lead (Note 8) RΘJL 10.01 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM  4,000 V 3A Electrostatic Discharge - Machine Model ESD MM  400 V C Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

Datasheet Number: DS33058 Rev. 2 - 2 3 of 7 www.diodes.com June 2013 © Diodes Incorporated FCX555 A Product Line of Diodes Incorporated Thermal Characteristics and Derating Information 0 25 50 75 100 125 1500.0 0.2 0.4 0.6 0.8 1.0 Derating Curve Temperature (°C) Max Power Dissipation (W) 100µ 1m 10m 100m 1 10 100 1k0 100 120 Transient Thermal Impedance D=0.5 D=0.2 D=0.1 Single Pulse D=0.05 Thermal Resistance (°C/W)Pulse Width (s) 100µ 1m 10m 100m 1 10 100 1k 100 Single Pulse. Tamb=25°C Pulse Power Dissipation Pulse Width (s) Max Power Dissipation (W)

Datasheet Number: DS33058 Rev. 2 - 2 4 of 7 www.diodes.com June 2013 © Diodes Incorporated FCX555 A Product Line of Diodes Incorporated Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition Collector-Base Breakdown Voltage BVCBO -180 — — V IC = -100µA Collector-Emitter Breakdown Voltage BVCEV -180 — — V IC = -1µA, -0.3V < VBE < 1V Collector-Emitter Breakdown Voltage BVCER -180 — — V IC = -1µA, RB ≤ 1kΩ Collector-Emitter Breakdown Voltage (Note 10) BVCEO -150 — — V IC = -1mA Emitter-Base Breakdown Voltage BVEBO -7 -8.1 — V IE = -100µA Collector Cutoff Current ICBO — -20 -10 nA µA VCB = -144V VCB = -144V, TA = +100°C Emitter Cutoff Current IEBO — <1 -20 nA VEB = -6V DC current transfer Static ratio (Note 10) hFE 100 100 — — 300 — I C = -10mA, VCE = -5V IC = -100mA, VCE = -5V Collector-Emitter Saturation Voltage (Note 10) VCE(sat) — -300 -400 mV I C = -100mA, IB = -10mA IC = -250mA, IB = -25mA Base-Emitter Saturation Voltage (Note 10) VBE(sat) — — -1000 mV IC = -250mA, IB = -25mA Base-Emitter Turn-on Voltage (Note 10) VBE(on) — — -950 mV IC = -250mA, VCE = -5V Transitional Frequency fT — 100 — MHz IE = -50mA, VCE = -10V f = 100MHz Output capacitance Cobo — — 10 pF VCB = -10V, f = 1MHz, Note: 10. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.

Datasheet Number: DS33058 Rev. 2 - 2 5 of 7 www.diodes.com June 2013 © Diodes Incorporated FCX555 A Product Line of Diodes Incorporated Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Datasheet Number: DS33058 Rev. 2 - 2 6 of 7 www.diodes.com June 2013 © Diodes Incorporated FCX555 A Product Line of Diodes Incorporated Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to voltage spacing between t erminals. SOT89 Dim Min Max A 1.40 1.60 B 0.44 0.62 B1 0.35 0.54 C 0.35 0.44 D 4.40 4.60 D1 1.62 1.83 E 2.29 2.60 e 1.50 Typ H 3.94 4.25 H1 2.63 2.93 L 0.89 1.20 All Dimensions in mm Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500 Y2Y C X (3x) Y3 Y4 X2 (2x) E H B1 B e C L A D 8° (4X) R0.200

Datasheet Number: DS33058 Rev. 2 - 2 7 of 7 www.diodes.com June 2013 © Diodes Incorporated FCX555 A Product Line of Diodes Incorporated IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other c hanges without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com