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Document overview
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Technical content
Features
- R DS(on) = 460 mΩ (Typ.) @ VGS = 10 V, ID = 3.4 A
- Ultra Low Gate Charge (Typ.Q g = 17.8 nC)
- Low Effective Output Capacitance (Typ. C oss.eff = 91 pF)
- 100% Avalanche Tested
- RoHS Compliant Application
- LCD/LED TV and Monitor
- Lighting
- Solar Inverter
- AC-DC Power Supply
Description
The SupreMOS ® MOSFET is Fairchild Semiconductor ®’s next generation of high voltage su per-junction (SJ) technology employing a deep trench filling proc ess that differentiates it from the conventional SJ MOSFETs. This advanced technology and precise process control provi des lowest Rsp on-resistance, superior switching performance and ruggedness. SupreMOS MOSFET is suitable for high frequency switching power converter applications such as PFC, server/telecom power, FPD TV power, ATX power and industrial power applications. D G S TO-220F G S D TO-220 G D S MOSFET Maximum Ratings TC = 25oC unless otherwise noted Thermal Characteristics Symbol Parameter FCP7N60N FCPF7N60NT Unit VDSS Drain to Source Voltage 600 V VGSS Gate to Source Voltage ±30 V ID Drain Current -Continuous (TC = 25oC) 6.8 6.8* A-Continuous (TC = 100oC) 4.3 4.3* IDM Drain Current - Pulsed (Note 1) 20.4 20.4 A EAS Single Pulsed Avalanche Energy (Note 2) 79.4 mJ IAR Avalanche Current 6.8 A EAR Repetitive Avalanche Energy 0.6 mJ dv/dt MOSFET dv/dt Ruggedness 100 V/ns Peak Diode Recovery dv/dt (Note 3) 4.9 V/ns PD Power Dissipation (TC = 25oC) 64.1 30.5 W - Derate above 25oC 0.51 0.24 W/ oC TJ, TSTG Operating and Storage Temperature Range -55 to +150 oC TL Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds 300 oC Symbol Parameter FCP7N60N FCPF7N60NT Unit RθJC Thermal Resistance, Junction to Case 1.95 4.1 oC/WRθCS Thermal Resistance, Case to Heak Sink ( Typical) 0.5 0.5 RθJA Thermal Resistance, Junction to Ambient 62.5 62.5 *Drain current limited by maximum junction temperature
FCP7N60N / FCPF7N60NT N-Channel MOSFET ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com2 Package Marking and Ordering Information Electrical Characteristics TC = 25oC unless otherwise noted Off Characteristics On Characteristics Dynamic Characteristics Switching Characteristics Drain-Source Diode Characteristics Device Marking Device Package Reel Size Tape Width Quantity FCP7N60N FCP7N60N TO-220AB - - 50 FCPF7N60NT FCPF7N60NT TO-220F - - 50 Symbol Parameter Test Conditions Min. Typ. Max. Unit BVDSS Drain to Source Breakdown Voltage I D = 1 mA, VGS = 0 V, TC = 25oC 600 - - V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 1 mA, Referenced to 25oC- 0 . 6 - V / oC IDSS Zero Gate Voltage Drain Current VDS = 480 V, VGS = 0 V - - 10 μAVDS = 480 V, VGS = 0 V, TC = 125oC - - 100 IGSS Gate to Body Leakage Current V GS = ±30 V, VDS = 0 V - - ±100 nA VGS(th) Gate Threshold Voltage V GS = VDS, ID = 250 μA2 . 0 - 4 . 0 V RDS(on) Static Drain to Source On Resistance V GS = 10 V, ID = 3.4 A - 0.46 0.52 Ω gFS Forward Transconductance V DS = 20 V, ID = 3.4 A - 8.5 - S Ciss Input Capacitance VDS = 100 V, VGS = 0 V f = 1 MHz - 719 960 pF Coss Output Capacitance - 30 40 pF Crss Reverse Transfer Capacitance - 2.1 3.2 pF Coss Output Capacitance V DS = 380 V, VGS = 0 V, f = 1 MHz - 17 - pF Cosseff Effective Output Capacitance V DS = 0 V to 380 V, VGS = 0 V - 91 - pF Qg(tot) Total Gate Charge at 10V VDS = 380 V,ID = 3.4 A VGS = 10 V (Note 4) - 17.8 35.6 nC Qgs Gate to Source Gate Charge - 3.2 6.3 nC Qgd Gate to Drain “Miller” Charge - 6.0 11.9 nC ESR Equivalent Series Resistance (G-S) Drain Open - 2.5 - Ω td(on) Turn-On Delay Time VDD = 380 V, ID = 3.4 A RG = 4.7 Ω (Note 4) -1 2 2 4 n s tr Turn-On Rise Time - 6 22 ns td(off) Turn-Off Delay Time - 35 80 ns tf Turn-Off Fall Time - 12 24 ns IS Maximum Continuous Drain to Source Diode Forward Current - - 6.8 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 20.4 A VSD Drain to Source Diode Forward Voltage V GS = 0 V, ISD =3.4 A - - 1.2 V trr Reverse Recovery Time VGS = 0 V, ISD = 3.4 A dIF/dt = 100 A/μs -2 1 1- n s Qrr Reverse Recovery Charge - 1.8 - μC Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. IAS = 2.3 A, RG = 25 Ω, Starting TJ = 25°C 3. ISD ≤ 6.8 A, di/dt ≤ 200 A/μs, VDD ≤ 380 V, Starting TJ = 25°C 4. Essentially Independent of Operating Temperature Typical Characteristics
FCP7N60N / FCPF7N60NT N-Channel MOSFET ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com6 Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms
FCP7N60N / FCPF7N60NT N-Channel MOSFET ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com7 Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG
- ISD controlled by pulse period VDD L I SD 10V VGS ( Driver ) I SD ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop VSD IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG
- ISD controlled by pulse period VDD LL I SD 10V VGS ( Driver ) I SD ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop VSD IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width
FCP7N60N / FCPF7N60NT N-Channel MOSFET ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com8 Dimensions in Millimeters Mechanical Dimensions TO-220
FCP7N60N / FCPF7N60NT N-Channel MOSFET ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com9 Mechanical Dimensions Dimensions in Millimeters TO-220F
FCP7N60N / FCPF7N60NT N-Channel MOSFET ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com10 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITH OUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME AN Y LIABILITY ARISING OUT OF TH E APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WO RLDWIDE TERMS AND CONDITIONS , SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 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