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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
Features
- 650 V @T J = 150°C
- M a x . RDS(on) = 600 mΩ
- Ultra Low Gate Charge (Typ. Q g = 20 nC)
- Low Effective Output Capacitance (Typ. C oss.eff = 74 pF)
- 100% Avalanche Tested
- ESD Improved Capacity
Applications
- LCD / LED / PDP TV and Monitor Lighting
- Solar Inverter
- AC-DC Power Supply
Description
SuperFET®II MOSFET is Fairchild Semiconductor ®’s first gen- eration of high voltage super-junction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low on-resis- tance and lower gate charge performance.This advanced tech- nology is tailored to minimize conduction loss, provide superior switching performance, and withstand extreme dv/dt rate and higher avalanche energy. Consequently, SuperFETII MOSFET is suitable for various AC/DC power conversion for system minia- turization and higher efficiency. TO-220FG SD TO-220 G D S G S D G S D
FCP600N60Z / FCPF600N60Z N-Channel MOSFET www.fairchildsemi.com2©2012 Fairchild Semiconductor Corporation FCP600N60Z / FCPF600N60Z Rev. C2 Package Marking and Ordering Information Electrical Characteristics TC = 25oC unless otherwise noted Off Characteristics On Characteristics Dynamic Characteristics Switching Characteristics Drain-Source Diode Characteristics Device Marking Device Package Reel Size Tape Width Quantity FCP600N60Z FCP600N60Z TO-220 - - 50 FCPF600N60Z FCPF600N60Z TO-220F - - 50 Symbol Parameter Test Conditions Min. Typ. Max. Unit BVDSS Drain to Source Breakdown Voltage VGS = 0 V, ID = 10 mA, TJ = 25°C 600 - - V VGS = 0 V, ID = 10 mA, TJ = 150°C 650 - - V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 10 mA, Referenced to 25oC - 0.67 - V/ oC BVDS Drain-Source Avalanche Breakdown Voltage VGS = 0 V, ID = 7.4 A - 700 - V IDSS Zero Gate Voltage Drain Current VDS = 480 V, VGS = 0 V - - 1 μAVDS = 480 V, TC = 125oC- - 1 0 IGSS Gate to Body Leakage Current V GS = ±20 V, VDS = 0 V - - ±10 uA VGS(th) Gate Threshold Voltage V GS = VDS, ID = 250 μA2 . 5 - 3 . 5 V RDS(on) Static Drain to Source On Resistance V GS = 10 V, ID = 3.7 A - 0.51 0.6 Ω gFS Forward Transconductance VDS = 20 V, ID = 3.7 A -6 . 7-S Ciss Input Capacitance VDS = 25 V, VGS = 0 V f = 1 MHz - 840 1120 pF Coss Output Capacitance - 630 840 pF Crss Reverse Transfer Capacitance - 30 45 pF Coss Output Capacitance V DS = 380 V, VGS = 0 V, f = 1.0 MHz - 16.5 - pF Coss eff. Effective Output Capacitance V DS = 0 V to 480 V, VGS = 0 V - 74 - pF Qg(tot) Total Gate Charge at 10V VDS = 380 V, ID = 3.7 A VGS = 10 V (Note 4) -2 0 2 6 n C Qgs Gate to Source Gate Charge - 3.4 - nC Qgd Gate to Drain “Miller” Charge - 7.5 - nC ESR Equivalent Series Resistance Drain open -2 . 8 9- Ω td(on) Turn-On Delay Time VDD = 380 V, ID = 3.7 A VGS = 10 V, RG = 4.7 Ω (Note 4) -1 3 3 6 n s tr Turn-On Rise Time - 7 24 ns td(off) Turn-Off Delay Time - 39 88 ns tf Turn-Off Fall Time - 9 28 ns IS Maximum Continuous Drain to Source Diode Forward Current - - 7.4 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 22.2 A VSD Drain to Source Diode Forward Voltage V GS = 0 V, ISD = 3.7 A - - 1.2 V trr Reverse Recovery Time VGS = 0 V, ISD = 3.7 A dIF/dt = 100 A/μs - 200 - ns Qrr Reverse Recovery Charge - 2.3 - μC Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. IAS = 1.5 A, VDD = 50 V, RG = 25 Ω, Starting TJ = 25°C 3. ISD ≤ 3.7 A, di/dt ≤ 200 A/μs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Essentially Independent of Operating Temperature Typical Characteristics
FCP600N60Z / FCPF600N60Z N-Channel MOSFET www.fairchildsemi.com6©2012 Fairchild Semiconductor Corporation FCP600N60Z / FCPF600N60Z Rev. C2 Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms
FCP600N60Z / FCPF600N60Z N-Channel MOSFET www.fairchildsemi.com7©2012 Fairchild Semiconductor Corporation FCP600N60Z / FCPF600N60Z Rev. C2 Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG
- ISD controlled by pulse period VDD L I SD 10V VGS ( Driver ) I SD ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop VSD IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG
- ISD controlled by pulse period VDD LL I SD 10V VGS ( Driver ) I SD ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop VSD IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width
FCP600N60Z / FCPF600N60Z N-Channel MOSFET www.fairchildsemi.com8©2012 Fairchild Semiconductor Corporation FCP600N60Z / FCPF600N60Z Rev. C2 Mechanical Dimensions TO-220AB
FCP600N60Z / FCPF600N60Z N-Channel MOSFET www.fairchildsemi.com9©2012 Fairchild Semiconductor Corporation FCP600N60Z / FCPF600N60Z Rev. C2 Package Dimensions Dimensions in Millimeters TO-220F (Retractable) * Front/Back Side Isolation Voltage : AC 2500V
FCP600N60Z / FCPF600N60Z N-Channel MOSFET www.fairchildsemi.com10©2012 Fairchild Semiconductor Corporation FCP600N60Z / FCPF600N60Z Rev. C2 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITH OUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME AN Y LIABILITY ARISING OUT OF TH E APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WO RLDWIDE TERMS AND CONDITIONS , SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 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PRODUCT STATUS DEFINITIONS Definition of Terms 2Cool™ AccuPower™ AX-CAP®* BitSiC™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ DEUXPEED Dual Cool™ EcoSPARK® EfficentMax™ ESBC™ Fairchild Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FETBench™ FPS™ F-PFS™ FRFET Global Power ResourceSM Green Bridge™ Green FPS™ Green FPS™ e-Series™ G max™ GTO™ IntelliMAX™ ISOPLANAR™ Marking Small Speakers Sound Louder and Better™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MicroPak2™ MillerDrive™ MotionMax™ mWSaver™ OptoHiT™ OPTOLOGIC OPTOPLANAR® PowerTrench® PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™ Saving our world, 1mW/W/kW at a time™ SignalWise™ SmartMax™ SMART START™ Solutions for Your Success™ SPM STEALTH™ SuperFET® SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS SyncFET™ Sync-Lock™ TinyBoost™ TinyBuck™ TinyCalc™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TranSiC TriFault Detect™ TRUECURRENT®* μSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ VoltagePlus™ XS™ Datasheet Identification Product Status Definition Advance Information For mative / In Design Datasheet contains the design specifications for product development. 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