FCL3310M FUTUREWAFER | Alldatasheet

Document overview

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Technical content

Maximum Ratings@25 unless otherwise specified Parameter Symbol Value Units Peak pulse power (tp=8/20us) see fig 1. PPP 600 Watts Operating Temperature TJ -55~150 °C Storage Temperature TSTG -55~150 °C Peak Pulse Current(tp=8/20us) IPP 24 A Electrostatic Discharge VESD >30(Contact) >30(Air) KV FCL3310M Low Capacitance TVS array

Applications

  • 10/100/1000 Ethernet
  • Wireless System
  • DVI
  • High Speed Data Line(HDMI)
  • NB
  • USB 2.0 Power and Data line Protection Feature
  • With TVS Diode
  • ESD Protection:Level 4
  • Low clamping voltage
  • 600 Watts peak pulse power per line(tp=8/20uS)
  • Ultra low capacitance:1.5pf typ.(any I/O to GND.)
  • Protection 4 lines I/O port and one VCC line IEC Compatibility
  • EN61000-4
  • 61000-4-2(ESD):LeveL 4,Contact:±30kv,Air::±30kv
  • 61000-4-5(Surge):24A,8/20us Mechanical Characteristics
  • Molded JEDEC MSOP-10L package
  • Packing: Tape and Reel
  • Flammability rating UL 94V-0
  • Halogen Free Device Characteristics Pin Identification 1,5,7,9 Input lines 2,4,6,10 N.C 3,8 Ground Futurewafer Technology co., Ltd., E1609F8B-FW-001 MSOP-10L

0.01 0.1 0.1 1 10 100 1000 Parameter Symbol Condition Min. Typ. Max. Units Reverse Stand-off Voltage VRWM 3.3 V Snap back Voltage VSB ISB=50mA 2.8 V Reverse Leakage Current IR VR=3.3V,I/O-GND 1 uA Clamping Voltage VC IPP=1A tp=8/20us 6 V IPP=24A tp=8/20us 15 V Junction Capacitance C I/O Pin capacitance to GND.Vdc=0V,f=1MHZ 1.5 pf

Electrical Characteristics

Rating and characteristic curve Futurewafer Technology co., Ltd., FIGURE 1 Non-repetitive Peak pulse power V.S pulse time tp-Pulse Width(µS) Peak Pulse Power(kw) 600W,8/20µS E1609F8B-FW-001 FCL3310M Low Capacitance TVS array

Ordering information

Package Quantity Packaging Option FCL3310M MSOP-10 500 Tape&reel-8mm tape/7”reel Pad Layout

Package information

Futurewafer Technology co., Ltd., Symbol Dimension in Millimeters Min Nom Max A 1.10 A1 0.05 0.10 0.15 b 0.17 0.20 0.27 c 0.08 0.17 0.26 D 2.90 3.00 3.10 E1 2.90 3.00 3.10 e 0.5BSC E 4.90 L 0.4 0.8 a 0° 8° Y Z X P Symbol Dimension Millimeters G 2.5 P 0.5 X 0.3 Y 1.6 Z 5.7 G E1609F8B-FW-001 FCL3310M Low Capacitance TVS array

Futurewafer Technology co., Ltd., Futurewafer Technology co.,Ltd 台灣未來芯航電股份有限公司 Tel ：+886-3-3573583/Tel ：+886-3-3574065 Futurewafer.com.tw 桃園市桃園區中正路 987 巷 50 弄 2 號 History Version Date Recording Basis File No. A 2016-09-29 New create E1609F8B-FW-001 E1609F8B-FW-001 FCL3310M Low Capacitance TVS array