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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Features
- R DS(on) = 81 mΩ (Typ.)@ VGS = 10 V, ID = 18 A
- Ultra low gate charge (Typ. Qg = 86 nC)
- Low effective output capacitance (Typ. C oss.eff = 361 pF)
- 100% avalanche tested
- RoHS compliant
Applications
- Solar Inverter
- AC-DC Power Supply
Description
The SupreMOS® MOSFET is Fairchild Semiconductor ®’s next- generation of high voltage super-junction (SJ) technology employing a deep trench filling proc ess that differentiate it from the conventional MOSFETs. This advanced technology and pre- cise process control provide lo west Rsp on-resistance, superior switching performance and ruggedness. SupreMOS MOSFET is suitable for high frequency switching power converter applica- tions such as PFC, server/telecom power, FPD TV power, ATX power and industrial power applications. D G S D SG MOSFET Maximum Ratings TC = 25oC unless otherwise noted* Thermal Characteristics Symbol Parameter FCB36N60N Unit VDSS Drain to Source Voltage 600 V VGSS Gate to Source Voltage ±30 V ID Drain Current -Continuous (TC = 25oC) 36 A-Continuous (TC = 100oC) 22.7 IDM Drain Current - Pulsed (Note 1) 108 A EAS Single Pulsed Avalanche Energy (Note 2) 1800 mJ IAR Avalanche Current 12 A EAR Repetitive Avalanche Energy 3.12 mJ dv/dt MOSFET dv/dt Ruggedness 100 V/ns Peak Diode Recovery dv/dt (Note 3) 20 V/ns PD Power Dissipation (TC = 25oC) 312 W - Derate above 25oC2 . 6 W / oC TJ, TSTG Operating and Storage Temperature Range -55 to +150 oC TL Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds 300 oC Symbol Parameter FCB36N60N Unit RθJC Thermal Resistance, Junction to Case 0.4 oC/WRθJA* Thermal Resistance, Junction to Ambient * 40 RθJA Thermal Resistance, Junction to Ambient 62.5 *Drain current limited by maximum junction temperature *When mounted on the minmium pad size recommended (PCB Mount)
FCB36N60N N-Channel MOSFET www.fairchildsemi.com2©2010 Fairchild Semiconductor Corporation FCB36N60N Rev. C0 Package Marking and Ordering Information Electrical Characteristics TC = 25oC unless otherwise noted Off Characteristics On Characteristics Dynamic Characteristics Switching Characteristics Drain-Source Diode Characteristics Device Marking Device Package Reel Size Tape Width Quantity FCB36N60N FCB36N60N D 2-PAK 330mm 24mm 800 Symbol Parameter Test Conditions Min. Typ. Max. Unit BVDSS Drain to Source Breakdown Voltage I D = 1 mA, VGS = 0 V, TC = 25oC 600 - - V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 1 mA, Referenced to 25oC- 0 . 7 - V / oC IDSS Zero Gate Voltage Drain Current VDS = 480 V, VGS = 0 V - - 10 μAVDS = 480 V, VGS = 0 V, TC = 125oC - - 100 IGSS Gate to Body Leakage Current V GS = ±30 V, VDS = 0 V - - ±100 nA VGS(th) Gate Threshold Voltage V GS = VDS, ID = 250 μA2 . 0 - 4 . 0 V RDS(on) Static Drain to Source On Resistance V GS = 10 V, ID = 18 A - 81 90 m Ω gFS Forward Transconductance V DS = 40 V, ID = 18 A - 41 - S Ciss Input Capacitance VDS = 100 V, VGS = 0 V f = 1 MHz - 3595 4785 pF Coss Output Capacitance - 149 200 pF Crss Reverse Transfer Capacitance - 4 6 pF Coss Output Capacitance V DS = 380 V, VGS = 0 V, f = 1 MHz - 80 - pF Cosseff. Effective Output Capacitance V DS = 0 V to 380 V, VGS = 0 V - 361 - pF Qg(tot) Total Gate Charge at 10V VDS = 380 V, ID = 18 A, VGS = 10 V (Note 4) - 86 112 nC Qgs Gate to Source Gate Charge - 15.4 - nC Qgd Gate to Drain “Miller” Charge - 26.4 - nC ESR Equivalent Series Resistance (G-S) Drain Open - 1 - Ω td(on) Turn-On Delay Time VDD = 380 V, ID = 18 A RG = 4.7 Ω (Note 4) -2 3 5 6 n s tr Turn-On Rise Time - 22 54 ns td(off) Turn-Off Delay Time - 94 198 ns tf Turn-Off Fall Time - 4 18 ns IS Maximum Continuous Drain to Source Diode Forward Current - - 36 A ISM Maximum Pulsed Drain to Source Diode Forward Current - - 108 A VSD Drain to Source Diode Forward Voltage V GS = 0 V, ISD = 18 A - - 1.2 V trr Reverse Recovery Time VGS = 0 V, ISD = 18 A dIF/dt = 100 A/μs - 574 - ns Qrr Reverse Recovery Charge 10 - μC Notes: 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. IAS = 12 A, RG = 25 Ω, Starting TJ = 25°C 3. ISD ≤ 36 A, di/dt ≤ 200 A/μs, VDD = 380 V, Starting TJ = 25°C 4. Essentially Independent of Operating Temperature Typical Characteristics
FCB36N60N N-Channel MOSFET www.fairchildsemi.com5©2010 Fairchild Semiconductor Corporation FCB36N60N Rev. C0 Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms
FCB36N60N N-Channel MOSFET www.fairchildsemi.com6©2010 Fairchild Semiconductor Corporation FCB36N60N Rev. C0 Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG
- ISD controlled by pulse period VDD L I SD 10V VGS ( Driver ) I SD ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop VSD IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG
- ISD controlled by pulse period VDD LL I SD 10V VGS ( Driver ) I SD ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop VSD IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width
FCB36N60N N-Channel MOSFET www.fairchildsemi.com7©2010 Fairchild Semiconductor Corporation FCB36N60N Rev. C0 Mechanical Dimensions D2PAK
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