DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 12

Technical content

Features

  1. 03. 02 Applicaons The FC9516A / FC9517A series of power switches are designed for USB applicaons. The 62mΩ N-channel MOSFET power switch sasfies drop requirements of USB specificaon. The protecon features include current-limit protecon, short-circuit protecon, and over-temperature protecon.The device limits the output current at current limit threshold level. When VOUT drops below 1.5V, the devices limit the current to a lower and safe level. The over-temperature protecon limits the juncon temperature below 140℃ in case of short circuit or over load condions.Other features include a deglitched OCB output to indicate the fault condion and an enable input to enable or disable the device. USB Power-Distribuon Switch the voltage  72mΩ High S ide MOSFET  Wide Supply Voltage Range: 2.7V to 5.5V  Current-Limit and Short-Circuit Protecons  Over-Temperature Protecon  Fault Indicaon Output  Enable Input  Lead Free and Green Devices Available Pin Configuraon  Output Current FC9516A : 1.0A (Max) FC9517A : 2.4A (Max) DIM MILLIMETERS A B D G SOT-25 2.92± 0.1 1.6 ± 0.1 2.8 ± 0.15 0.4 ± 0.1 0.1MAX 1.1± 0.05 0.95 0.15± 0.05 H C T G B D A H T CC A 1 1.9 ± 0.1A1
  1. 03. 02 2/12 SEMICONDUCTOR TECH NICAL DATA FC9516A/FC9517A Revision No : 0 Pin Number Pin Name Description 1 VOUT Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the output voltage is discharged by an internal resistor. 2 GND Gro und. 3 OCB Fault I ndicaon P in. T his pin goes low when a current limit or an over-temperature condion is detected aer a 12ms deglitch me. EN Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN pin cannot be le floang.

5 VIN

Power Supply Input. Connect this pin to external DC supply. Pin Descripon Block Diagram Symbol Parameter Rang Unit VIN VIN Input Voltage (VIN to GND) -0.3 ~ 7 V VOUT VOUT to GND Voltage -0.3 ~ 7 V VENB, VEN EN, ENB to GND Voltage -0.3 ~ 7 V VOCB OCB to GND Voltage -0.3 ~ 7 V TJ Maximum Juncon Temperature 150 oC TSTG Storage Temperature -65 ~ 150 oC TSDR Maximum Soldering Temperature, 10 Seconds 260 oC Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Rangs

2017.03.02 3/12 FC9516A/FC9517A Revision No : 0 Symbol Parameter Range Unit VIN VIN Input Voltage 2.7~5.5 V VCC VCC Supply Voltage 4.5 ~ 5.5 V IOUT OUT Output Current (FC9156A) 0~1 A OUT Output Current (FC9157A) 0~ 2.4 A TA Ambient Temperature -40 ~ 85 oC TJ Juncon Temperature -40 ~ 125 oC Note: Refer to the typical application circuit. Symbol Parameter Typical Value Unit θJA Junction- to- Ambient Resistance in Free Air 235 °C/W Recommended Operang Condions Thermal Characteriscs Unless otherwise specified, these specifications apply over VIN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85℃ , Typical values are at TA=25℃ Symbol Parameter Test Conditions Unit Min. Typ. Max. SUPPLY CURRENT VIN Supply Current No load, VEN=0V or VENB=5V - - 1 µΑ No load, VEN=5V or VENB=0V 100 Leakage Current VOUT=GND, VEN=0V or VENB=5V - - 1 Reverse Leakage Current VIN=GND, VOUT=5V, VEN=0V or VENB=5V - - 1 POWER SWITCH RDS(ON) Power Switch On Resistance IOUT=1A, TA= 25℃ 72 90 mΩ UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN rising, TA= -40 ~ 85℃ 1.7 2.65 V VIN UVLO Hysteresis 0.2 V CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM Current Limit Threshold ISHORT Short-Circuit Output Current , VIN=2.7V to 5.5V 1.5 A , VIN=2.7V to 5.5V 0.8 A OCB OUTPUT PIN OCB Output Low Voltage IOCB=5mA 0.2 0.4 V OCB Leakage Current VOCB=5V 1 uA tD(OCB) OCB Deglitch Time OCB assertion, TA= -40 ~ 85℃ 5 12 20 mS EN OR ENB INPUT PIN VIH Input Logic HIGH VIN=2.7V to 5V 2 V VIL Input Logic LOW VIN=2.7V to 5V 0.8 V Input Current 1 uA VOUT Discharge Resistance VEN=0V or VENB=5V, VOUT=1V 40 Ω tD(ON) Turn On Delay Time 30 uS tD(OFF) Turn Off Delay Time 30 uS tSS Soft-Start Time No load, COUT=1µF, VIN=5V 400 uS OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold TJ rising 140 C Over-Temperature Hysteresis 20 C Electrical Characteriscs µΑ µΑ µΑ FC9516A FC9517A Ratings

  1. 03. 02 4/12 FC9516A/FC9517A Revision No : 0 Typical Operang Characteriscs

20 17.03.02 5/12 FC9516A/FC9517A Revision No : 0 FC9517A FC9516A FC9516A FC9516A FC9517A FC9517A

6/12Revision No : 0 FC9516A/FC9517A 2017. 03. 02 FC9517A FC9516A

  1. 03. 02 7/12 FC9516A/FC9517A Revision No : 0

2017.03.02 8/12 FC9516A/FC9517A Revision No : 0 FC9516A FC9517A

  1. 03. 02 9/12 FC9516A/FC9517A Revision No : 0 V N =5V, RLOAD =30Ω, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VENB, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 200µs/Div V N =5V, RLOAD =30Ω, C N =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VENB, 5V/Div, DC CH2: VOUT, 2V/Div, DC TIME: 100µs/Div V N =5V, RLOAD =30Ω, CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VIN, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME: 2ms/Div V N =5V, RLOAD =30Ω, C N =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: V N, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME: 2ms/Div
  1. 03. 02 10/12 FC9516A/FC9518A Revision No : 0 FC9516A, VIN =5V, OUT short to GND, CIN =COUT=33µF/Electrolytic CH1: VEN, 5V/Div, DC CH2: VOCB, 5V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 5ms/Div FC9516A, VIN =5V, CIN =COUT=33µF/Electrolytic CH1: VOCB, 5V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 1A/Div, DC TIME: 5ms/Div FC9516A, VIN =5V, OUT Short to GND, CIN =33µF/Electrolytic, No COUT CH1: VIN, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 5A/Div, DC TIME: 50µs/Div FC9517A, VIN =5V, RLOAD =1kΩ 㖤㖟㕐2.2Ω㕜 㕐 CIN =COUT=33µF/Electrolytic CH1: VOUT, 1V/Div, DC CH2: IOUT, 1A/Div, DC TIME: 1ms/Div
  1. 03. 02 11/12 FC9516A/FC9517A Revision No : 0 Typical Application Circuit Funcon Descripon VIN Under-Voltage Lockout (UVLO) The FC951X series of power switches have a built-in under-voltage lockout circuit to keep the output shung off unl internal circuitry is operang properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts a so-start to reduce the inrush current. Power Swit ch The power switch is an N-channel MOSFET with a low RDS(ON). The internal power MOSFET does not have the body diode. When IC is off, the MOSFET prevents a current flowing from the VOUT back to VIN and VIN to VOUT. Current-Limit Protection The FC951X series of power switches provide the current- limit protection function. During current-limit, the devices limit output current at current limit threshold. For reliable operation, the device should not be operated in current- limit for extended period. Short-Circuit Protection When the output voltage drops below 1.5V, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. The short-circuit current limit is used to reduce the power dissipation during short-circuit conditions. If the junction temperature reaches over-temperature threshold, the device will enter the thermal shutdown. OCB Output The FC951X series of power switches provide an open-drain ou tput to indicate that a fault has occurred. When any of current-limit or over-temperature protection occurs for a deglitch time of tD(OCB), the OCB goes low. Since the OCB pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the ENB above 2V or EN below 0.8V will disable the device, and pull ENB pin below 0.8V or EN above 2V will enable the device. When the IC is disabled, the supply current is reduced to less t han 1µA. The enable input is compatible with both TTL and CMOS logic levels. The EN/ENB pin cannot be left floating. Over-Temperature Protection When the junction temperature exceeds 14℃ , the internal thermal sense circuit turns off the power FET and allows the device to cool down. When the device’s junction temperature cools by 20℃, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protection is design ed to protect the IC in the event of over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125℃.

20 17.03.02 12/12 FC9516A/FC9517A Revision No : 0 Applicaon Informaon Input Capacitor A 1µF ceramic bypass capacitor from VIN to GND, located near the FC951X, is strongly recommended to suppress the ringing during short circuit fault event. Without the bypass capacitor, the out put short may cause su fficient r inging on the input (from s upply lead inductance) to damage internal control circuitry. Output Capacitor A low-ESR 10 µF aluminum electrolyc or tanta lum between VOUT and GND is strongly reco mmended to re duce the voltage drop during hot-aachment of down stream per ipheral. (Per USB 2.0, out put ports mu st have a m inimum 120 µF of low-ESR bulk capacitance per hub). Higher-value output capacitor is beer when the output load is hea vy. Addi onally, bypa ssing the out put with a 0.1 µF ceramic ca pacitor improves the i mmunity of the d evice to short-circuit transients. Layout Consideraon The PCB layout sho uld be caref ully performed to maximize thermal dissipaon and to minimize voltage drop, droop a nd EMI. The following guidelines must be considered: 1. Please place the input capacitors near the V IN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the lo ad as close as po ssible for deco upling highfrequency ripples. 3. Lo cate FC951X a nd out put capa citors near the load to reduce parasic resistance and inductance for exce llent load transient performance. 4. The nega ve pins of the input and output capacitors and the GND pin must be connected to the gro und plane of the load. 5. Keep VIN and VOUT traces as wide a nd short as possible.