FC4T OHMITE | Alldatasheet
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1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com12 FC4T Series Metal Foil Low Value Chip Resistance 0.005-0.100 Operating Temp. Range -55°C to +155°C Rated Power 0.5 watt Resistance Tolerance 0.5% and 1% standard Temperature Coefficient within ±50ppm, ±100ppm for 5mΩ Coating Material Epoxy resin Terminals Cu/Ni/Sn Max. Current √(Max. power÷ Resistance value) Res. of Electrodes <5mΩ SerieS SpeCiFiCa TionS CharaCTeriSTiCS 100Percent Rated Power Ambient Temperature, °C -55° 70° 155° 150175°50-75 -50 100 Alumina Substrate Electrode (Cu+Ni+Sn)Epoxy resin protection coat Epoxy resin marking Cu-alloy resistor Construction Derating 165°~180° F Peeling Strength of Seal Tape F = Peel-back force: 0.1 - 0.7N (10 - 71gf) Power Resistance Pkg. Rating Range TCR Series Size (W @70°C) (Ω) (ppm/°C) Tolerance FC4T 1206 0.5W 0.005-0.100 50ppm 0.5%, 1% The FC4T chip features four terminals, also known as a “Kelvin” configuration. This configuration enables current to be applied through two opposite terminals and a sensing voltage to be measured across the other two terminals, eliminating the resis- tance and temperature coefficient of the terminals for a more accurate current measurement. Ohmite’s proprietary Metal Foil technology offers an excellent Temperature Coefficient of Resistance (TCR) even for very low resistance values ( down to 50ppm). (continued)
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 13 perFormanCe CharaCTeriSTiCS Test Items Performance Test Methods High Temp. Exposure ±(1.0%+0.5mΩ) T=+170 ±2ºC; t=1000h; IEC60115-1 4.25 Low Temp. Storage ±(1.0%+0.5mΩ) T=-55 ±2ºC; t=1000h; IEC60115-1 4.25 Moisture Load Life ±(2.0%+0.5mΩ) Vtest=Vmax; T=60 ±2ºC; RH=95%; t= 90min ON, 30min OFF, 1000h; IEC60115-1 4.25 (60℃, 95%RH) Load Life at 70ºC ±(2%+0.5mΩ) Vtest=Vmax; T=70 ±2ºC; t=90min ON; IEC60115-1 4.25 Solderability The covered area >95% Dip into solder at T=245 ±5ºC, t=3 ±0.5sec.; IEC60115-1 4.17 Resistance to Solder Heat ±(1.0%+0.5mΩ) Through Reflow T=275 ±5ºC, t=20 ±1sec.; IEC60115-1 4.18 Mechanical Shock ±(1.0%+0.5mΩ) a=100G, t=11ms, 5 times shock; IEC60115-1 4.21 Substrate Bending ±(1.0%+0.5mΩ) Span between fulcrums 90mm; bend width 2mm; test board glass-epoxy; Thickness=1.6mm; IEC60115-1 4.33 FC4T Series Metal Foil Low Value Chip dimenSionS (mm ±0.2) AN A B P P2D0 E F W D1 P T K Direction of feed W a g b c d e L t f Tape and Reel Part L W a b c t d e f g Part W P P2 A B D0 F E T T1 K A 178 ±5 N 60 ±2 W1 9 ±1 orderinG inForma Tion FC4TR010DER Series Tolerance F= 1% D=0.5% Ohms Tape & Reel 5000/reel RoHS Compliant FC4TR005FER FC4TR010FER FC4TR015FER FC4TR050FER FC4TR100FER 0.5% FC4TR010DER FC4TR015DER FC4TR050DER FC4TR100DER Standard Part Numbers rev 1/18-3 V = sensing terminal (voltage) I = current terminal VV II Schematic Layout for illustration only, part can be rotated 180° without effect to the circuit.