FAN3111 ONSEMI | Alldatasheet
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© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3111 • Rev. 1.6 2 FAN3111 — Single 1A High-Speed, Low-Side Gate Driver
Ordering Information
Threshold Package Packing Method Quantity per Reel FAN3111CSX CMOS 5-Pin SOT23 Tape & Reel 3,000 FAN3111ESX External 5-Pin SOT23 Tape & Reel 3,000 Thermal Characteristics(1) Package JL (2) JT (3) JA (4) JB (5) JT (6) Units 5-Pin SOT23 58 102 161 53 6 °C/W Notes: 1. Estimates derived from thermal simulation; actual values depend on the application. 2. Theta_JL ( JL): Thermal resistance between the semiconductor junction and the bott om surface of all the leads (including any thermal pad) that are typically soldered to a PCB. 3. Theta_JT ( JT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top-side heatsink. 4. Theta_JA ( ΘJA): Thermal resistance between junction and ambient, dependent on th e PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink using a 2S2P board,, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB ( JB): Thermal characterization parameter providing correlation between semi conductor junction temperature and an application circuit board reference point for the therm al environment defined in Note 4. For the MLP-8 package, the board reference is defined as the PCB copper con nected to the thermal pad and protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6. 6. Psi_JT ( JT): Thermal characterization parameter providing correlation between the s emiconductor junction temperature and the center of the top of the package for the thermal enviro nment defined in Note 4. Pin Definitions Pin # Name Description 1 VDD Supply Voltage. Provides power to the IC. 2 GND Ground. Common ground reference for input and output circuits. 3 IN+ Non-Inverting Input. Connect to VDD to enable output. 4 IN– FAN3111C Inverting Input. Connect to GND to enable output. XREF FAN3111E External Reference Voltage. Reference for input thresholds, 2 V to 5 V. 5 OUT Gate Drive Output. Held low unless required inputs are present. Output Logic with Dual-Input Configuration IN+ IN− OUT 0(7) 0 0 0(7) 1(7) 0 1 0 1 1 1(7) 0 Note: 7. Default input signal if no external connection is made.
1 VDD
5 OUT
2 GND
Figure 3. FAN3111C Simplified Block Diagram Figure 4. FAN3111E Simplified Block Diagram
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3111 • Rev. 1.6 4 FAN3111 — Single 1A High-Speed, Low-Side Gate Driver Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and s tressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommen ded operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VDD VDD to GND -0.3 20.0 V VIN Voltage on IN to GND FAN3111C -0.3 VDD + 0.3 V FAN3111E -0.3 VXREF+0.3 V VXREF Voltage on XREF to GND FAN3111E -0.3 5.5 V VOUT Voltage on OUT to GND -0.3 VDD+0.3 V TL Lead Soldering Temperature (10 Seconds) +260 ºC TJ Junction Temperature +150 ºC TSTG Storage Temperature -65 +150 ºC Recommended Operating Conditions The Recommended Operating Conditions table defines the conditi ons for actual device operation. Recommended operating conditions are specified to ensure optimal performan ce to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings . Symbol Parameter Min. Max. Unit VDD Supply Voltage Range 4.5 18.0 V VIN Input Voltage IN FAN3111C 0 VDD V FAN3111E 0 VXREF V VXREF External Reference Voltage XREF FAN3111E 2.0 5.0 V TA Operating Ambient Temperature -40 +125 ºC
© 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN3111 • Rev. 1.6 5 FAN3111 — Single 1A High-Speed, Low-Side Gate Driver
Electrical Characteristics
Unless otherwise noted, V DD = 12 V, VXREF = 3.3 V, T J = -40°C to + 125°C. Currents are defined as positive into the device and negative out of the device. Symbol Parameter Conditions Min. Typ. Max. Unit Supply VDD Operating Range 4.5 18.0 V IDD Static Supply Current Inputs Not Connected 5 10 µA Inputs (FAN3111C) VIL_C IN Logic, Low-Voltage Threshold 30 38 %VDD VIH_C IN Logic, High-Voltage Threshold 55 70 %VDD IINL IN Current, Low IN from 0 to VDD -1 175 µA IINH IN Current, High IN from 0 to VDD -175 1 µA VHYS_C Input Hysteresis Voltage 17 %VDD Inputs (FAN3111E) VIL_E IN Logic, Low-Voltage Threshold 25 30 %VXREF VIH_E IN Logic, High-Voltage Threshold 50 60 %VXREF IINL IN Current, Low IN from 0 to VXREF -1 50 µA IINH IN Current, High IN from 0 to VXREF -50 1 µA VHYS_E Input Hysteresis Voltage 20 %VXREF Output ISINK OUT Current, Mid-Voltage, Sinking(8) OUT at VDD/2, CLOAD = 47nF, f = 1KHz 1.1 A ISOURCE OUT Current, Mid-Voltage, Sourcing(8) OUT at VDD/2, CLOAD = 47nF, f = 1KHz -0.9 A IPK_SINK OUT Current, Peak, Sinking(8) CLOAD = 47nF, f = 1KHz 1.4 A IPK_SOURCE OUT Current, Peak, Sourcing(8) CLOAD = 47nF, f = 1KHz -1.4 A tRISE Output Rise Time(9) CLOAD = 470pF 9 18 ns tFALL Output Fall Time(9) CLOAD = 470pF 8 17 ns tD1, tD2 Output Prop. Delay(9) FAN3111C: 0 - 12VIN, 1V/ns Slew Rate 15 30 ns FAN3111E: 0 - 3.3VIN, 1V/ns Slew Rate IRVS Output Reverse Current Withstand(8) 250 mA Notes: 8. Not tested in production. 9. See Timing diagrams.
Figure 5. Non-Inverting Waveforms Figure 6. Inverting Waveforms
Table 2. Related Products
- Typical currents with OUT at 6V and V DD = 12V.
- Thresholds proportional to an externally supplied reference voltage .
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