FAN2001 ONSEMI | Alldatasheet

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FAN2001/FAN2002 Rev. 1.0.2 www.fairchildsemi.com April 2005 ©2005 Fairchild Semiconductor Corporation FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter

Features

96% Efficiency, Synchronous Operation Adjustable Output Voltage Options from 0.8V to V IN 2.5V to 5.5V Input Voltage Range Up to 1A Output Current Fixed Frequency 1.3MHz PWM Operation High Efficiency Power Save Mode 100% Duty Cycle Low Dropout Operation Soft Start Output Over-Voltage Protection Dynamic Output Voltage Positioning µ A Quiescent Current Thermal Shutdown and Short Circuit Protection Pb-Free 3x3mm 6-Lead MLP Package

Applications

Pocket PCs, PDAs Cell Phones Battery-Powered Portable Devices Digital Cameras Hard Disk Drives Set-Top-Boxes Point-of-Load Power Notebook Computers Communications Equipment

Description

Designed for use in battery-powered applications, the FAN2001/ FAN2002 is a high-efficiency, low-noise synchronous PWM cur- rent mode and Pulse Skip (Power Save) mode DC-DC con- verter. It can provide up to 1A of output current over a wide input range from 2.5V to 5.5V. The output voltage can be externally adjusted over a wide range of 0.8V to 5.5V by means of an external voltage divider. At moderate and light loads, pulse skipping modulation is used. Dynamic voltage positioning is applied, and the output voltage is shifted 0.8% above nominal value for increased headroom dur- ing load transients. At higher loads the system automatically switches over to current mode PWM control, operating at 1.3 MHz. A current mode control loop with fast transient response ensures excellent line and load regulation. To achieve high effi- ciency and ensure long battery life, the quiescent current is reduced to 25µA in Power Save mode, and the supply current drops below 1µA in shut-down mode. The FAN2001/FAN2002 is available in a 3x3mm 6-lead MLP package. Typical Application Figure 1. Typical Application

Figure 2. Pin Assignment P1 must be soldered to the PCB ground. externally connected to AGND. current to less than 1µA. Do not float this pin. Adjustable voltage option, connect this pin to the resistor divider. This pin is connected to the internal MOSFET switches. P1 must be soldered to the PCB ground. Adjustable voltage option, connect this pin to the resistor divider. This pin is connected to the internal MOSFET switches. This pin is connected to the internal MOSFET switches. current to less than 1µA. Do not float this pin.

www.fairchildsemi.com FAN2001/FAN2002 Rev. 1.0.2 FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter Absolute Maximum Ratings (Note1) Recommended Operating Conditions Notes: 1. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply indivi dually only, not in combination. Unless otherwise specified, all other voltages are referenced to AGND. 2. Junction to ambient thermal resistance, θ JA , is a strong function of PCB material, board thickness, thickness and number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics. 3. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model). 4. Refer to the applications section for further details. Parameter Min Max Unit V IN , PV IN -0.3 7 V Voltage On Any Other Pin -0.3 V IN V Lead Soldering Temperature (10 seconds) 260 °C Junction Temperature 150 °C Storage Temperature -65 150 °C Thermal Resistance-Junction to Tab θ JC 3x3mm 6-lead MLP (Note 2) 8 °C/W Electrostatic Discharge Protection (ESD) Level (Note 3) HBM 4 kV CDM 1 Parameter Min Typ Max Unit Supply Voltage Range 2.5 5.5 V Output Voltage Range, Adjustable Version 0.8 V IN V Output Current 1A Inductor (Note 4) 3.3 µ H Input Capacitor (Note 4) 10 µF Output Capacitor (Note 4) 2 x 10 µF Operating Ambient Temperature Range -40 +85 °C Operating Junction Temperature Range -40 +125 °C

www.fairchildsemi.com FAN2001/FAN2002 Rev. 1.0.2 FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter

Electrical Characteristics

Notes: 5. Refer to the application section for further details. 6. For output voltages 1.2V a 40 µ F output capacitor value is required to achieve a maximum output accuracy of 3% while operating in power save mode (PFM mode). V IN = V OUT + 0.6V(min. 2.5V) to 5.5V, I OUT = 350mA, V OUT =1.2V, EN = V IN , T A = -40°C to +85°C, Unless otherwise noted. Typical values are at T A = 25°C. Symbol Parameter Conditions Min. Typ. Max. Units V IN Input Voltage 0 mA I OUT 600 mA 2.5 5.5 V 0 mA I OUT 1000 mA 2.7 5.5 V I Q Quiescent Current I OUT = 0mA, Device is not switching 20 35 µ A I OUT = 0mA, Device is switching (Note 5) R2 =10K Ω µ A R2 =100K Ω µ A Shutdown Supply Current EN = GND 0.1 1 µ A Undervoltage Lockout Threshold V IN Rising 1.9 2.1 2.3 V Hysteresis 150 mV V ENH Enable High Input Voltage 1.3 V V ENL Enable Low Input Voltage 0.4 V I EN EN input bias current EN = V IN or GND 0.01 0.1 µ A R DS-ON PMOS On Resistance V IN = V GS = 5.5V 250 350 m Ω V IN = V GS = 2.5V 300 400 NMOS On Resistance V IN = V GS = 5.5V 200 300 m Ω V IN = V GS = 2.5V 250 350 I LIM P-channel current limit 2.5V < V IN < 5.5V 1300 1500 2000 mA Oscillator frequency 1000 1300 1500 KHz I lkg_(N) N-channel leakage current V DS = 5.5V 0.1 1 µ A I lkg_(P) P-channel leakage current V DS = 5.5V 0.1 1 µ A Line regulation I OUT 10 mA 0.16 %/V Load regulation 350 mA I OUT 1000 mA 0.15 % Vref Reference Voltage 0.8 V Output DC Voltage Accuracy (Note 6) 0 mA I OUT 1000 mA -3 +3 % Over-Temperature Protection PWM Mode Only 350 mA I OUT 1000 mA Rising Temperature 150 °C Hysteresis 20 °C Start-Up Time I OUT = 1000 mA, C OUT = 20 µF 800 µS

www.fairchildsemi.com FAN2001/FAN2002 Rev. 1.0.2 FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter Typical Performance Characteristics T A = 25°C, CIN = 10µF , COUT = 20µF , L = 3.3µH, R2 = 10KΩ, unless otherwise noted. 11 0 1 0 0 1000 100 VIN = 5V VOUT = 3.3V VIN = 3.6V VOUT = 1.2V VIN = 3.6V VOUT = 3V 0.1 1 10 100 1000 100 VIN = 5.5V VOUT = 3 .3V VIN = 3.9V 0.1 1 10 100 1000 100 Load Current (mA) Load Current (mA) Load Current (mA) Load Current (mA) Efficiency (%) Efficiency (%) Efficiency (%) Efficiency vs. Load Current Efficiency vs. Load Current Efficiency vs. Load Current VOUT = 1.2V VIN = 5.5V VIN = 3.6V VIN = 2.5V 02 00 400 600 800 1000 1.192 1.194 1.196 1.198 1.200 1.202 1.204 1.206 1.208 1.210 1.212 1.214 Output Voltage (V) Quiescent Current (µA) Oscillator Frequency (kHz) VIN = 5V Output Voltage vs. Load Current Input Voltage (V) R2 = 100KΩ R2 = 10KΩ Quiescent Current vs. Input Voltage -40 -20 0 20 40 60 80 100 1200 1220 1240 1260 1280 1300 1320 1340 1360 1380 1400 Temperature (°C) Frequency vs. Temperature VIN = 2.5V VIN = 3.6V VIN = 5.5V VOUT = 1.2V R2 = 100KΩ R2 = 100KΩ

FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter Typical Performance Characteristics (Contd.) TA = 25°C, CIN = 10µF , COUT = 20µF , L = 3.3µH, R2 = 10KΩ, unless otherwise noted. PWM Mode Power Save Mode Time (1µs/div) SW Node (2V/div) Voltage Inductor (200mA/div) Current Output (5mV/div) Voltage Time (5µs/div) SW Node (2V/div) Voltage Output (20mV/div) Voltage Inductor (200mA/div) Current Time (10µs/div) Load Transient Response Output (50mV/div) Voltage Inductor (500mA/div) Current 600mA100mA Load Transient Response Time (10µs/div) Output (50mV/div) Voltage Inductor (500mA/div) Current Voltage at Enable Pin 600mA 100mA VOUT = 1.2V Start-Up Response Output (500mV/div) Voltage Inductor (200mA/div) Current Time (100µs/div) (5V/Div) Load Current Step Load Current Step Start-Up Response Time (200µs/div) Output (500mV/div) Voltage Inductor (500mA/div) Current Voltage at Enable Pin (5V/Div) VOUT = 1.2V VOUT = 1.2V IOUT = 10mA VOUT = 1.2V IOUT = 1000mA

Figure 3. Block Diagram inductor current is reached (typical 450mA).

Figure 6. Recommended PCB Layout (FAN2002) switching spikes, use an input bypass capacitor with low ESR. an electromagnetic shield to reduce EMI. Performance DC-DC Converters” (AN-42036).

FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter Mechanical Dimensions 3x3mm 6-Lead MLP

Ordering Information

Product Number Output Voltage Package Type Order Code FAN2001 Adjustable 3x3mm 6-Lead MLP FAN2001MPX FAN2002 Adjustable 3x3mm 6-Lead MLP FAN2002MPX

FAN2001/FAN2002 1A High-Efficiency Step-Down DC-DC Converter DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production IntelliMAX™ ISOPLANAR™ LittleFET™ MICROCOUPLER™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR™ PACMAN™ FAST FASTr™ FPS™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I 2C™ i-Lo™ ImpliedDisconnect™ Rev. I15 ACEx™ ActiveArray™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ EcoSPARK™ E 2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ POP™ Power247™ PowerEdge™ PowerSaver™ PowerTrench QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ µSerDes™ SILENT SWITCHER SMART START™ SPM™ Stealth™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic TINYOPTO™ TruTranslation™ UHC™ UltraFET UniFET™ VCX™ Across the board. Around the world.™ The Power Franchise Programmable Active Droop™

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