DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 16

Technical content

Features

 Class-G Headphone Amplifier Uses Multiple Rails for High Efficiency  Integrated Inductive Buck Converter for Direct Battery Connection  Differential Analog Inputs  Capable of Driving 16Ω to 600Ω Loads and Line Level Inputs  Ground-Referenced Output  Ground-Sense Input Eliminates Ground-Loop Noise  I2C Controls  32-Step Volume Control  Channel-Independent Shutdown Control and Short-Circuit Protection  16-Bump, 0.4mm Pitch, 1.56mm x 1.56mm

Applications

 Cellular Handsets  MP3 and Portable Media Players  Personal Navigation Devices

Description

The FAB1200 is a stereo class-G headphone amplifier. A charge pump generates a negative supply voltage that allows its out put to be ground centered. An integrated buck regulator adjusts the voltage supplies between two different levels based on the output signal level to reduce power consumption. Figure 1. Typical Application Circuit

Ordering Information

Temperature Range Package Packing Method FAB1200UCX -40 to +85°C 16-Bump, 0.4mm Pitch, 1,56mm x 1.56mm, Wafer-Level Chip-Scale Package (WLCSP)

4000 Units on

Tape & Reel

Figure 2. 16-Bump, 0.4mm Pitch WLCSP Package (Top View)

© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAB1200 • Rev 1.2.6 3 FAB1200 — Ground-Referenced Class-G Headphone Amplifier with Integrated Buck Converter Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may dam age the device. The device may not function or be operable above the recommended operating conditions and st ressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit AVDD Supply Voltage -0.3 6.0 V HPVDD_AMP Amplifier Supply Voltage, HPV DD Pin -0.3 2.5 V VIA INL+, INL-, INR+, INR- Voltage HPV SS - 0.3 HPV DD + 0.3 V VI2C I 2C Voltage -0.3 AV DD + 0.3 V VOUT OUTL, OUTR Voltage -HPV SS - 0.3 HPV DD + 0.3 V IBKD Output Protection Diodes Breakd own Continuous Current 200 mA Reliability Information Symbol Parameter Min. Typ. Max. Unit TJ Junction Temperature +150 °C TSTG Storage Temperature Range -65 +85 °C Storage Relative Humidity Range 15 70 % TL Peak Reflow Temperature +260 °C JA Thermal Resistance, JEDEC Standard, Multilayer Test Boards, Still Air 75 °C/W Electrostatic Discharge Capability Symbol Parameter Condition Level Unit ESD Human Body Model, JESD22-A114 According to JESD22-A114-B Level 2, Compatible with IEC61340-3-1: 2002 Level 2 or ESD-STM5.1- 2001 Level 2 or MIL-STD-883E 3015.7 Level 2 ±4000 V Charged Device Model, JESD22-C101 According to JESD22-C101-C Level III, Compatible with IEC61340-3-3 Level C4 or ESD-STM5.3.1-1999 Level C4 ±1500 Recommended Operating Conditions The Recommended Operating Conditions table defines th e conditions for actual device operation. Recommended operating conditions are specified to en sure optimal performance to the datash eet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Max. Unit TA Operating Temperature Range -40 +85 °C AVDD Supply Voltage Range 2.5 5.5 V tSLEW Power Supply Slew Rate 1 V/µs

© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAB1200 • Rev 1.2.6 4 FAB1200 — Ground-Referenced Class-G Headphone Amplifier with Integrated Buck Converter

Electrical Characteristics

Unless otherwise noted, AVDD = 3.6V, Gain = 0dB, RL = 15Ω + 32Ω || 5nF with audio measurements across the 32Ω || 5nF load, f = 1KHz, TA = 25°C. Symbol Parameter Condition Min. Typ. Max. Unit IDD Quiescent Current Both Channels Enabled, No Audio Signal 1.2 2.2 mA IS Supply Current Output: 2 x 100µW at 3dB Crest Factor, RL = 32Only 2.6 3.5 mA Output: 2 x 500µW at 3dB Crest Factor, RL = 32 Only 4.4 5.5 Output: 2 x 1mW at 3dB Crest Factor, RL = 32Only 5.7 7.5 HIZL = HIZR = 1 1.0 2.3 ISD Shutdown Current SWSBY = 1, Inputs AC Grounded, SCL and SDA Pulled HIGH 1.8 6.0 µA tWK Wake-Up Time 1.5 5.0 ms PO Output Power Per Channel (Outputs In Phase) AVDD = 2.7V, THD < 1%, f = 1KHz, RL = 32Only 36 mW AVDD = 2.7V, THD < 10%, f = 1KHz, RL = 32Only 48 AVDD = 2.7V, THD < 1%, f = 1KHz, RL = 16Only 51 HPVDD HIGH Rail Voltages Buck and CP Output Outer Rail 1.70 1.80 1.90 V Inner Rail 1.20 1.25 1.30 HPVSS LOW Rail Voltages Outer Rail -1.9 0 -1.80 -1.70 Inner Rail -1.30 -1.25 -1.20 THD+N Total Harmonic Distortion + Noise 700mV RMS, 1KHz 0.01 0.02 % PSRR Power Supply Rejection Ratio (1) Gain 0dB, 200mV PP Ripple at 217Hz 80 100 dB VIN Input Voltage Range Input St age Does Not Clip ±1.4 Vp CMRR Common Mode Rejection Ratio 1VPP, f = 1KHz, Gain 0dB, RL = 32Only 65 dB SNR Signal-to-Noise Ratio 1VRMS, f = 1KHz, RL = 32Only 100 106 dB Channel Separation PO = 15mW, f = 1KHz 80 dB RL ≥ 16 75 dB Line Out >10K(1) 80 Vn Output Noise Gain 0dB, A-Weight, RL = 32Only 4.7 9.0 µV RMS DC-Out Output DC-Offset Both Chan nels Enabled -500 500 µV Gain Matching 1 % Mute Attenuation MUTEx = 1 -110 -80 dB HIZx = 1 -80 Continued on the following page…

© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAB1200 • Rev 1.2.6 5 FAB1200 — Ground-Referenced Class-G Headphone Amplifier with Integrated Buck Converter Electrical Characteristics (Continued) Unless otherwise noted, AVDD = 3.6V, Gain = 0dB, R L = 15 + 32 || 5nF with audio measurements across the 32  || 5nF load, f = 1KHz, TA = 25°C. Symbol Parameter Condition Min. Typ. Max. Unit ZIN Input Impedance Differential 20.0 k Differential Input Impedance Gain = 0dB, per Input Node 38 Single Ended Input Impedance Gain = 0dB, per Input Node 18 ZOUT Output Impedance HIZx = 1, SWSBY = 0 <40kHz 10.0 11.5 k Ω 6MHz 500 1200 Ω 13MHz 800 Ω 36MHz 75 380 Ω CLOAD Capacitive Load ESD Protection, External Capacitor 0.8 5.0 100.0 nF TSD Thermal Shutdown Threshold 150 °C THYS Thermal Shutdown Hysteresis 55 °C Note: 1. Guaranteed by Characterization.

Unless otherwise noted, AVDD = 2.5V to 5.5V and TA = 25°C. Unless otherwise noted, AVDD = 2.5V to 5.5V and TA = 25°C. I2C bus specification) before the SCL line is released.

  1. C b equals the total capacitance of one bus line in pf. If mixed with high-speed mode devices, faster fall times are

allowed according to the I2C specification. Figure 3. Definition of Timing for Full-Speed Mode Devices on the I 2C Bus All marks are the property of their respective owners.

Figure 4. Quiescent Supply Current vs. Figure 5. Shutdown Supply Current vs.

100 RL = 32ohm

Figure 6. Supply Current vs. Total Output Power 32Ω Figure 7. Supply Current vs. Total Output Power 16Ω Figure 8. Output Power vs. Supply Voltage at 32 Ω Figure 9. Output Powe r vs. Supply Voltage at 16Ω

© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAB1200 • Rev 1.2.6 10 FAB1200 — Ground-Referenced Class-G Headphone Amplifier with Integrated Buck Converter Functional Description Class G The FAB1200 uses a class-G headphone architecture for low power dissipation. An integrated converter creates the headphone amplifier positive supply voltage, HPVDD. A charge pump inverts HPV DD and creates an amplifier negative supply voltage, HPV SS. This allows the headphone amplifier out put to be centered at 0V and eliminates the need for DC blocking capacitors. When the output signal am plitude is low, the buck converter generates a low HPV DD voltage. When needed, the buck converter generates a higher HPV DD to accommodate higher amplitude output signals. This change occurs faster than audio signals so no distortion or clipping is introduced. Thermal and Current Protection If the junction temperature of the regulator or headphone amplifier exceeds limits ( see the Electrical Characteristics table ), the system is disabled for approximately one second and the THERM bit is set to one. After one second, the system is enabled. If the fault condition still exists, the system is disabled again. This cycle repeats until the fault condition is removed. The THERM bit stays set to 1 until the fault condition is removed and it is read. Output current is limited to prevent internal damage. A signal that would exceeds current limits is clipped so that it falls within limits. Shutdown Setting the SWSBY bit to 1 places the device in a low- current shutdown state. The I 2C port is still active and register values are not lost. During shutdown, HPV DD and HPV SS are powered down. Therefore, no signal should be present at the inputs during shutdown. During shutdown, junction temperature is not monitored. If junction temperature exceeds limits during shutdown, the THERM bit does not set to 1. Output Impedance The FAB1200 headphone outputs can be placed in high-impedance mode by setting the HIZx bits to 1. This can be useful if the system ’s headphone jack is shared with other devices. For proper high-impedance operation, the device must not be in a shutdown or protection mode and voltages on OUTL and OUTR must not exceed ±1.8V. Actual impedance values are shown in the Electrical Characteristics table. Applications Information Layout Considerations General layout and supply bypassing play a major role in analog performance and thermal characteristics. Fairchild offers a demonstration board to guide layout and aid device evaluation. Contact a Fairchild representative for demonstration board information. Following this layout configuration provides optimum performance for the device. For the best results, follow the steps and recommended routing rules listed below. Recommended Routing/Layout Rules  Do not run analog and digital signals in parallel.  Use separate analog and digital power planes to supply power.  Traces should always run on top of the ground plane.  No trace should run over ground/power splits.  Avoid routing at 90-degree angles.  Place bypass capacitors within 0.1 inches of the device power pin.  Minimize all trace lengths to reduce series inductance.

send and receive data on the bus. or not acknowledge (NACK) from the receiving device. stream of data and ACKs/NACKs during data transfers. line transitions from HIGH to LOW while SCL is HIGH. data transfer is about to begin. line transitions from LOW to HIGH while SCL is HIGH. acknowledge (ACK) after receiving every byte of data. leaving SDA HIGH during the clock after the last byte. operations are indicated when X=1. write new information into the Command register. sends an ACK after receiving the new pointer data. Figure 22. Any time a pointer set is performed, it must be immediately followed by a read or write operation. by responding with a NACK, followed by a STOP. must again send the device address and Read/Write bit.

Table 1. Register Map Table 2. Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

  1. Bits labeled “0” have no effect if writt en. When read, their value is always 0.
  2. Bits not mentioned in the register map are for testing only. These bits should never be written. When read, they

Table 3. Register 0x01

0 SWSBY R/W 1

still active. Register values are not lost during shutdown. 1 THERM R 0 1 = A thermal shutdown has occurred. This bit stays set until it is read. 5:2 0 R 0000 Value is always 0. No effect if written. 6 HPENR R/W 0 1 = Enable right headphone amplifier. 0 = Disable right headphone amplifier. 7 HPENL R/W 0 1 = Enable left headphone amplifier. 0 = Disable left headphone amplifier. Table 4. Register 0x02 0 0 R 0 Value is always 0. No effect if written. 6 MUTER R/W 1 1 = Mute right channel. 7 MUTEL R/W 1 1 = Mute left channel. Table 5. Register 0x03 0 HIZR R/W 0 1 = 3-state right channel. 1 HIZL R/W 0 1 = 3-state left channel. 7:2 0 R 000000 Value is always 0. No effect if written.

Table 6. Register 0x04 3:0 Revision[3:0] R 0101 Denotes silicon revision. 5:4 0 R 00 Value is always 0. No effect if written. 7:6 ID[1:0] R 00 Supp lier identification. Table 7. Volume Control

Figure 23. 16-Ball WLCSP, 4x4 Array, 0.4mm Pitch, 250µm Ball warranty therein, which covers Fairchild products. specifications http://www.fairchildsemi.com/packaging/.

0.005 CAB

0.05 C E

A. NO JEDEC REGISTRATION APPLIES. B. DIMENSIONS ARE IN MILLIMETERS. ±39 MICRONS (547-625 MICRONS). G. DRAWING FILNAME: MKT-UC016AArev2.

© 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAB1200 • Rev 1.2.6 16 FAB1200 — Ground-Referenced Class-G Headphone Amplifier with Integrated Buck Converter