F2910 IDT | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 19

Technical content

Features

0.58 dB at 2 GHz High Isolation 51 dB at 2 GHz High Linearity IIP3 of 65 dBm Wide Single Positive Supply Voltage Range 3.3 V and 1.8 V compatible control logic Operating temperature -55 °C to +105 °C 2 mm x 2 mm 8-pin DFN package Block Diagram Figure 1. Block Diagram

Figure 2. Pin Assignments for 2 mm x 2 mm x 0.9 mm 8-VFQFP-N – Top View Table 1. Pin Descriptions 1, 4 NC This pin may be connected to the paddle and can be grounded. coupling capacitor must be used. 7 V1 Logic control pin. See Table 6 for proper logic setting. 8 RF2 RF2 Port. Matched to 50 E. If this pin is not 0V DC, then an external coupling capacitor must be used. ground vias are also required to achieve the specified RF performance.

conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings

Table 3. Recommended Operating Conditions a. Items in min/max columns in bold italics are Guaranteed by Test. b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization. Figure 3. Maximum RF Input Operating Power vs. RF Frequency

© 2016 Integrated Device Technology, Inc 5 August 30, 2016

Electrical Characteristics

Table 4. Electrical Characteristics beyond 5 GHz based on application circuit (Figure 20) using best RF PCB design practices. See note c for details.

0.03 GHz 85

0.35 GHz 66 73

1.0 GHz 55 61

2.0 GHz 45 51

3.0 GHz 40 46

4.0 GHz 35 41

5.0 GHz 30 37

6.0 GHz 33 [c]

7.0 GHz 29 [c]

8.0 GHz 26 [c]

2.0 GHz 27

3.0 GHz 25

4.0 GHz 20

5.0 GHz 18

6.0 GHz 20 [c]

7.0 GHz 25 [c]

8.0 GHz 13 [c]

a. Items in min/max columns in bold italics are Guaranteed by Test. b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization.

© 2016 Integrated Device Technology, Inc 6 August 30, 2016 Electrical Characteristics (Cont.) Typical Application Circuit: V DD = 3.3 V, T CASE = +25 °C, F RF = 2 GHz, Driven Port = RF2, Input power = 0 dBm, Z S = Z L = 50 E. PCB board trace and connector losses are de-embedded unless oth erwise noted. IIP2 / IIP3: P IN = 13 dBm / tone, 50 MHz spacing. Performance beyond 5 GHz based on application circuit (Figure 20) using best RF PCB design practices. See note c for details. Parameter Symbol Condition Minimum Typical Maximum Units RF2 Return Loss (Isolation State) RF RLT

3.0 GHz 27

4.0 GHz 25

5.0 GHz 20

6.0 GHz 15 [c]

7.0 GHz 12 [c]

8.0 GHz 10 [c]

Input 1dB Compression [d] ICP 1dB

0.03 GHz 34

dBm 3.0 GHz 35

4.0 GHz 35

Input 0.1dB Compression [d] ICP 0.1dB

0.03 GHz 33

dBm 3.0 GHz 34

4.0 GHz 34

Input IP2 [e] IIP2 F1 = 0.35 GHz F2 = 0.40 GHz 123 dBm F1 = 0.95 GHz F2 = 1.00 GHz 124 F1 = 2.40 GHz F2 = 2.45 GHz 118 Input IP3 [e] IIP3

0.03 GHz 65

dBm 0.35 GHz 65 1.0 0 GHz 68 2.4 0 GHz 67 Non -RF Driven Spurious [f] Spur MAX Any port w hen externally terminated into 50 E -102 dBm Switching Time [g] T SW 50% control to 90% RF 265 500 ns 50% control to 10% RF 225 500 50% control to RF settled to within +/ - 0.1 dB of insertion loss value 280 Maximum Switching Rate SW RATE 25 kHz Maximum Video Feed-through on RF Ports VID FT Peak transients during switching. Measured with 20 ns risetime, 0 to 3.3 V control pulse Rise Time 25 mVpp Fall Time 45 a. Items in min/max columns in bold italics are Guaranteed by Test. b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization. c. To achieve performance beyond 5 GHz, the use of bypass capacitors (BOM C2, C3, and C5) installed close to the device as embodied in the evaluation board per the application circuit (Figure 20) is required. See the appropriate Typical Operating Conditions graphs. d. The input 0.1 and 1 dB compression point is a linearity figure of merit. Refer to Absolute Maximum Ratings section for the maximum RF input power. e. RF1 or RF2 driven IIP2 / IIP3 results when in insertion loss state. IP2 Frequency = F1 + F2. f. Spurious due to on-chip negative voltage generator. Spurious fundamental is approximately 5.7 MHz. g. FRF = 1 GHz.

Table 5. Package Thermal Characteristics Junction to Case Thermal Resistance. ZL = Z S = 50 Ohms Single Ended. PIN = 13 dBm / tone applied to RF2 port for two tone linearity tests. Two tone frequency spacing = 50 MHz. All temperatures are referenced to the exposed paddle. Evaluation Kit traces and connector losses are de-embedded. Figure 10 to Figure 13 when application circuit with bypass capacitors is not utilized. Unless otherwise noted, C2, C3 and C5 are installed in following plots.

Table 6. Switch Control Truth Table

0 Isolation RF1 port reflective, RF2 port terminated into 50 ohms

1 Insertion Loss RF1 and RF2 port matched to 50 ohm

Figure 20. Electrical Schematic evaluation board with best practices followed for PCB design.

Table 7. Bill of Material (BOM)

1 Printed Circuit Board F2910 EVKIT REV 01 IDT

Control pins include no internal pull-down resistors to logic LOW or pull-up resistors to logic HIGH. minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail. (± 0.3 V) while the supply voltage ramps or while it returns to zero. shown in Figure 21 is not necessary. Figure 21. Control Pin signal integrity improvement circuit

© 2016 Integrated Device Technology, Inc 15 August 30, 2016 External Supply Setup Set up a V CC power supply in the voltage range of 2.7 V to 5.5 V with the power supply output disabled. Logic Control Setup Using the EVKIT to manually set the control logic: On connector J5, connect a 2-pin shunt from V CC (pin 3) to V LOGIC (pin 4). This connection provides the V CC voltage supply to the Eval Board logic control pull-up network. Resistors R1 and R2 form a voltage divider to set the V IH level over the 2.7 V to 5.5 V V CC range for manual logic control. Connector J5 has one logic input pin: V1 (pin 5). See Ta ble 6 for Logic Truth Table. With the pull-up network ena bled (as noted above) this pin can be left open to provide a logic high through pull-up resistor R1. To set a logic low for V1, connect a 2-pin shunt on J5 from V CTL (pin 5) to GND (pin 6). Note that when using the on board R1/R2 voltage divider, the current draw from the V CC supply will be higher by approximately V CC / 33 kΩ. Using external control logic: Pins 3, 4, 6, 7, and 8 of J5 should have no external connections. External logic control is applied to J5 V1 (p in 5). See Table 5 for the Logic Truth Table. Turn On Procedure Setup the supplies and EVKIT as noted in the External Supply Setup and Logic Control Setup sections above. Enable the V CC supply. Set the desired logic setting to achieve the desired Table 5 configuration. Note that external control logic should not be applied without V CC being present. Turn Off Procedure Set the logic control to a logic low. Disable the V CC supply.

Figure 22. Package Outline Drawing

Figure 23. Recommended Land Pattern

© 2016 Integrated Device Technology, Inc 18 August 30, 2016

Ordering Information

Orderable Part Number Package MSL Rating Shipping Packaging Temperature F2910NBGP 2 x 2 x 0.9 mm 8 -VFQFP -N MSL1 Bulk -55° to +105 °C F2910NBGP8 2 x 2 x 0.9 mm 8 -VFQFP -N MSL1 Tape and Reel -55° to +105 °C F2910EVBI Evaluation Board Marking Diagram 1. Line 1 is the part number. 2. Line 2 – “6” is last digit of the year. 3. Line 2 – “U” is the workweek code 4. Line 2 – AG is the sequential code

6024 Silver Creek Valley Road

San Jose, CA 95138 www.IDT.com Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales Tech Support www.IDT.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or s pecifications described herein at any time, without notice, at IDT's sole discretion. Performance spec ifications and operating parameters of the described products are determined in an independent state and are not guar anteed to perform the same way when installed in cu stomer products. The information contained herein i s provided without representation or warranty of any kind, whe ther express or implied, including, but not limited to, the suitability of IDT's products for any part icular purpose, an implied warranty of merchantabil ity, or non-infringement of the intellectual property rights of others. This do cument is presented only as a guide and does not co nvey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applicat ions involving extreme environmental conditions or in life support systems or similar devices where th e failure or malfunction of an IDT product can be r easonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written ag reement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other cou ntries. Other trademarks used herein are the proper ty of IDT or their respective third party owners. For datasheet type d efinitions and a glossary of common terms, visit www.idt.com/go/glossary . All contents of this document are copyright of In tegrated Device Technology, Inc. All rights reserved F2910 Datasheet © 2016 Integrated Device Technology, Inc 19 August 30, 2016

Revision History

Revision Date Description of Change 2016 -Aug -29 Initial Release