LO-RHO-F1812L AITSEMI | Alldatasheet
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AiT Semiconductor Inc. www.ait-ic.com Lo Rho F1812L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 1 - Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices Operation Current: 1.40A~6.00A Maximum Voltage: 6VDC Temperature Range : -40℃ to 85℃ Applications: All high-density boards Electrical Characteristics (23℃) Part Number Hold Current Trip Current Rated Voltage Max Current Typical Power Max Time to Trip Resistance Current Time RMIN R1MAX IH, A IT, A VMAX,VDC IMAX, A Pd, W A Sec Ohms Ohms Thermal Derating for PPTC Device at Various Ambient Temperatures Temperatures -40℃ -20℃ 0℃ 23℃ 30℃ 40℃ 50℃ 60℃ 70℃ 85℃ Current Derating % 145% 130% 115% 100% 92% 84% 77% 69% 61% 50%
AiT Semiconductor Inc. www.ait-ic.com Lo Rho F1812L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 2 - Typical Time-To-Trip at 23℃ A = F1812L140SL-06 B = F1812L190SL-06 C = F1812L270SL-06 D = F1812L300SL-06 E = F1812L370SL-06 F = F1812L500SL-06 G = F1812L600SL-06 Product Dimensions (Millimeters) Part Number A B C D E Min Max Min Max Min Max Min Max Min Max
AiT Semiconductor Inc. www.ait-ic.com Lo Rho F1812L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 3 - Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each F1812 L device Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal F1812L 3.45 1.78 3.50 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3℃/second max. Preheat: Temperature Min (Tsmin) Temperature Max Tsmax) Time (tS Tsmin to Tsmax) 150℃ 200℃ 60~180 seconds Time maintained above: Temperature(TL) Time (tL) 217℃ 60~150 seconds Peak/Classification Temperature(Tp): 260℃ Time within 5℃ of actual Peak: Temperature (tp) 20~40 seconds Ramp-Down Rate: 6℃/second max. Time 25℃ to Peak Temperature: 8 minutes max. Note 1: All temperatures refer to of the package, measured on the package body surface. Solder reflow ※ Due to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than th ose for Regula r. This may cause damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment: < 30℃ / 60%RH Caution: 1. If reflow te mperatures excee d the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Reflow Profile NOTE: Specification subject to change without notice.