F0603L AITSEMI | Alldatasheet

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AiT Semiconductor Inc. www.ait-ic.com F0603L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 1 - Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices Operation Current: 0.01A~0.25A Maximum Voltage: 9VDC~60VDC Temperature Range: -40℃ to 85℃ Applications: All high-density boards Electrical Characteristics (23℃) Part Number Hold Current Trip Current Rated Voltage Max Current Typical Power Max Time to Trip Resistance Current Time RMIN R1MIN IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms F0603L002-60 0.02 0.03 IH=Hold current-maximum current at which the device will not trip at 23℃still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. VMAX=Maximum voltage device can withstand without damage at it rated current. (IMAX) IMAX= Maximum fault current device can withstand without damage at rated voltage (VMAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin

AiT Semiconductor Inc. www.ait-ic.com F0603L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 2 - Thermal Derating Curve Typical Time-To-Trip at 23℃ A = F0603L001-60 B = F0603L002-60 C = F0603L003-30 D = F0603L004-24 E = F0603L005-15 F = F0603L008-15 G = F0603L010-15 H = F0603L012-09 I = F0603L016-09 J = F0603L020-09 K = F0603L025-09

AiT Semiconductor Inc. www.ait-ic.com F0603L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 3 - Product Dimensions (Millimeters) Part Number A B C D E Min Max Min Max Min Max Min Max Min Max

AiT Semiconductor Inc. www.ait-ic.com F0603L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 4 - Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each F0603 L device Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal F0603L 0.80 0.60 0.80 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3℃/second max. Preheat: Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) 150℃ 200℃ 60~180 seconds Time maintained above: Temperature(TL) Time (tL) 217℃ 60~150 seconds Peak/Classification Temperature(Tp): 260℃ Time within 5℃ of actual Peak: Temperature (tp) 20~40 seconds Ramp-Down Rate: 6℃/second max. Time 25℃ to Peak Temperature: 8 minutes max. Note 1: All temperatures refer to of the package, measured on the package body surface. Solder reflow ※ Due to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max paste thickness is 0.25mm. (Nominal) 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment: < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board.

AiT Semiconductor Inc. www.ait-ic.com F0603L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 5 - Reflow Profile NOTE: Specification subject to change without notice. Warning ⚫ Each product should be carefully evaluated and tested for their suitability of application. ⚫ Operation beyond the specified maximum rating or imprope r use may result in damage and possible electrical arcing and/or flame. ⚫ PPTC device are inten ded for occasional o vercurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. ⚫ Avoid contact of PPTC device w ith chemical solvent, including some inert material such as silicone based oil, lubricant and etc. Prolonged contact will damage the device performance. ⚫ Additional protection mechanism ar e strongly recommended to be used in conjunction with the PPTC device for protection against abnormal or failure conditions. ⚫ Avoid use of PPTC device in a constrained space such as potting material, housing and containers where have limited space to accommodate device thermal expansion and/or contraction