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Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses Current Resistance Voltage Drop Fusing Current Pre-Arc I 2t ColorPart Number Rating @0.1 x I RATED @IRATED (within 5 sec) @10xI RATED CodeA Ω (max.) mV (max.) A A -sec (typ) F0603G0R05FNTR 0.050 3.4 250 0.125 2 x 10 -6 Blue F0603G0R06FNTR 0.062 2.5 280 0.155 2 x 10 -6 Yellow F0603G0R07FNTR 0.075 2.0 280 0.1875 4 x 10 -6 Brown F0603G0R10FNTR 0.100 2.4 300 0.250 7 x 10 -6 Red F0603G0R12FNTR 0.125 1.6 250 0.312 1 x 10 -5 White F0603G0R15FNTR 0.150 1.2 220 0.375 2 x 10 -5 Green F0603G0R20FNTR 0.200 0.8 210 0.500 4 x 10 -5 Pink ACCU-GUARD® TECHNOLOGY The new F0603G Accu-Guard® II low current fuses is based on thin-film technology which allows precise control of the component electrical and physical characteristics that is not possible with standard fuse technologies. The Accu-Guard II Low Current series encompasses the lowest current ratings in a 0603 package and features LGA terminations. L T S W A B H

FEATURES

  • Accurate current rating
  • Fast acting
  • Standard 0603 chip size
  • Color coded
  • Taped and reeled
  • RoHS compliant
  • UL Approval: E141069

APPLICATIONS

  • Cellular Telephones
  • Two-Way Radios
  • Computers
  • Battery Chargers
  • Rechargeable Battery Packs
  • Hard Disk Drives
  • PDA’s
  • LCD Screens
  • Digital and Video Cameras
  • Instrumentation ELECTRICAL SPECIFICATIONS Operating temperature: -55ºC to +125ºC Current carrying capacity: -55ºC to -11ºC 107% of rating -10ºC to +60ºC 100% of rating +61ºC to +100°C 85% of rating +101ºC to +125°C 80% of rating Rated voltage: 32V Post-fusing resistance: >1MΩ TERMINATION Nickel/Solder coating compatible with automatic soldering technolgies: relow wave sodering, vapor phase and manual. ELECTRICAL PARAMETERS RECOMMEND PAD LAYOUT millimeters (inches) RECOMMEND PAD LAYOUT millimeters (inches) 0.85 (0.033) 2.4 (0.095) 1.1 (0.043)

Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses Test Conditions Requirement Solderability Components completely immersed in a Total area of imperfections in solder coating solder bath at 245 ±5°C for 3 secs. up to 5% of the land suface area Leach Resistance Components completely immersed in a solder Dissolution of termination bath at 255 ±5°C for 60 secs. ≤ 15% of the land surface area Storage 12 months minimum with components Good solderability stored in “as received” packaging. Shear Components mounted to a substrate. Destruction at 5N force minimum Increasing shearing force applied paralled to the sufstrate till destruction. Temperature Components mounted to a flexible substrate No Visible damage Cycling (e.g. FR – 4). 1000 cycles -55ºC to +125ºC. ΔR/R<10% Bend Tested as shown in diagram No visible damage ΔR/R<10% ENVIRONMENTAL CHARACTERISTICS 45mm 45mm 3 mm Deflection

Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses FUSE TIME – CURRENT CHARACTERISTICS 0111.0 Current, Amp 100 mA 125 mA 150 mA 50 mA 62 mA 75 mA 10-2 10-1 10-3 10-6 10-5 10-4 Pre-Arc Time, sec 200 mA

FUSE PRE-ARC JOULE INTEGRALS VS PRE-ARC TIME Accu-Guard® II Low Current Miniature 0603 Size Thin-Film Fuses FUSE PRE-ARC JOULE INTEGRALS VS CURRENT 00 . 511 . 522 . 53 Current, Amp 50 mA 62 mA 75 mA100 mA125 mA150 mA 10-2 10-1 10-3 10-6 10-5 10-4 200 mA Pre-Arc I2t, A2sec 10-2 10-1 10-3 10-6 10-5 10-4 50 mA 62 mA 75 mA100 mA125 mA150 mA 200 mA Pre-Arc I2t, A2sec Pre-Arc Time, sec 10-2 10-110-3 110-6 10-5 10-4 10