LO-RHO-F0402L AITSEMI | Alldatasheet
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AiT Semiconductor Inc. www.ait-ic.com Lo Rho F0402L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 1 - Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices Operation Current: 0.10A~0.50A Maximum Voltage: 6VDC Temperature Range : -40℃ to 85℃ Applications: All high-density boards Electrical Characteristics (23℃) Part Number Hold Current Trip Current Rated Voltage Max Current Typical Power Max Time to Trip Resistance Current Time RMIN R1MAX IH, A IT, A VMAX,VDC IMAX, A Pd, W A Sec Ohms Ohms Thermal Derating for PPTC Device at Various Ambient Temperatures Temperatures -40℃ -20℃ 0℃ 23℃ 30℃ 40℃ 50℃ 60℃ 70℃ 85℃ Current Derating % 145% 130% 115% 100% 92% 84% 77% 69% 61% 50%
AiT Semiconductor Inc. www.ait-ic.com Lo Rho F0402L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 2 - Typical Time-To-Trip at 23℃ A = F0402L010SL-06 B = F0402L020SL-06 C = F0402L035SL-06 D = F0402L050SL-06 Product Dimensions (Millimeters) Part Number A B C D E Min Max Min Max Min Max Min Max Min Max
AiT Semiconductor Inc. www.ait-ic.com Lo Rho F0402L SMD PPTC RESETTABLE FUSE REV1.0 - OCT 2017 RELEASED - - 3 - Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each F 0402L device Pad dimensions (millimeters) Device A Nominal B Nominal C Nominal F0402L 0.40 0.60 0.70 Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3℃/second max. Preheat: Temperature Min (Tsmin) Temperature Max Tsmax) Time (tS Tsmin to Tsmax) 150℃ 200℃ 60~180 seconds Time maintained above: Temperature(TL) Time (tL) 217℃ 60~150 seconds Peak/Classification Temperature(Tp): 260℃ Time within 5℃ of actual Peak: Temperature (tp) 20~40 seconds Ramp-Down Rate: 6℃/second max. Time 25℃ to Peak Temperature: 8 minutes max. Note 1: All temperatures refer to of the package, measured on the package body surface. Solder reflow ※ Due to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment: < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Reflow Profile NOTE: Specification subject to change without notice.