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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 20
Technical content
Features
- High Efficiency, Up to 91%
- Output Voltage Can Track VDDQ to within +/- 1.5%
- Source and Sink Capability up to 5A
- 125mm 2 Total Solution Size
- VDDQ Range (1.0V to 1.8V )
- Monotonic Startup With Pre-bias
- Programmable Soft-Start Time
- Thermal Shutdown Protection
- Over Current and Short Circuit Protection
- Under-Voltage Protection
- RoHS Compliant, MSL level 3, 260°C reflow
Applications
- Bus Termination: DDR2, DDR3, & QDR™ Memory
- General Low V IN Applications Figure 2: Typical VTT Application Schematic (VDDQ is the memory core voltage; VTT is memory termination voltage that tracks VDDQ) EV1340QI 10 mm x 5.5 mm 100µF 1206 100µF 1206 47µF 0805 0402 0402 0402 04020402 0402 0402 0402 0402 0603
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 2 www.enpirion.com
Ordering Information
(°C) Package EV1340QI -40 to +85 54-pin QFN T&R EV1340QI-E QFN Evaluation Board Pin Assignments (Top View) Figure 3: Pinout Diagram (Top View). All pins must be soldered to PCB NOTE: There are specific keep-out areas underneath the EV1340 to consider when laying out a PCB for this device. Please see Figures 8, 10, and 11 for more layout details. Pin Description PIN NAME FUNCTION 1-9, 18, 36, 37, 53, NC NO CONNECT: These pins must be soldered to PCB but not electrically connected to each other or to any external signal, voltage, or ground. These pins may be connected internally. Failure to follow this guideline may result in device damage. 10 -17 VOUT Regulated converter output. Decouple with output filter capacitor to PGND. Refer to layout section for specific layout requirements 19, 20, SW These pins are internally connected to the common switching node of the internal MOSFETs. The anode of a Schottky diode needs to be connected to these pins. The cathode of the diode needs to be connected to VDDQ. 21-27 PGND Input and output power ground. Refer to la yout section for specific layout requirements. 28-31 VDDQ In DDR applications the input to this pin is the DDR core voltage. This is the input power supply to the power train which will be divided by two to create an output voltage that tracks with the input voltage applied to this pin. Decouple with input capacitor to PGND. Refer to layout section for specific layout requirements 32 AGND2 Ground for the gate driver supply. Connec t to the GND plane with a via next to the pin. 33, 39 AVIN1, AVIN2 Analog input voltage for the controller circuits. Each of these pins needs to be separately connected to the 3.3V input supply. Decouple with a capacitor to AGND. 34 VDDB Internal regulated voltage used for the internal control circuitry. This pin is reserved for Enpirion testing, and should be left floating. 35 BGND This pin is reserved for Enpirion testing, and should be left floating. 38 ENABLE This is the Device Enable pin. Floating this pin or a high level enables the device while a low level disables the device. 40 AGND This is the quiet ground for the controller. Connect to the GND plane with a via next to the pin.
41 POK
POK is a logical AND of VDDQOK and the internally generated POK of the EV1340. POK is an open drain logic output that requires an external pull-up resistor. This pin guarantees a logic low even when the EV1340 is completely un-powered. This pin can sink a maximum 4mA. The pull-up resistor may be connected to a power supply other than AVIN or VDDQ but the voltage should be <3.6Volts.
42 VFB
This is the feedback input pin which is always active. A resistor divider connects from the output to AGND. The mid-point of the resistor divider is connected to VFB. (A feed-forward capacitor and a resistor are required across the upper resistor.) The output voltage regulates so as to make the VFB node voltage = 600mV.
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 3 www.enpirion.com PIN NAME FUNCTION 43 EAOUT Optional Error Amplifier Output. A llows for customization of the control loop.
44 VREF
External voltage reference input. A resistor divider connects from VDDQ to AGND. The mid- point of the resistor divider is connected to VREF. The resistor divider has to be chosen to make the voltage applied to this pin 600mV. An optional capacitor (for soft-start) may be connected from VREF to AGND. 45 VSENSE This pin senses the output voltage when the device is in pre-bias (or backfeed) mode. Connect to VOUT if EN_PB is high. Leave this pin floating if EN_PB is pulled to GND. 46 EN_PB Monotonic start-up with pre-bias is enabled by either pulling this pin high or letting it float. A logical low on this pin will disable pre-bias mode operation. 47 FQADJ Optimized frequency adjust pin. Connect a 3.57kΩ resistor from this pin to AGND to optimize on switching frequency.
48 VDDQOK
This is an active high input pin that indicates the externally supplied VDDQ input has reached its POK level. This pin should be tied to the VDDQ regulator POK output. It has an internal pull-up, and can be left floating if not needed. 49-52 NC(SW) No Connect – these pins are internally connected to the common switching node of the internal MOSFETs. They are not to be electrically connected to any external signal, ground, or voltage. Failure to follow these guidelines may result in damage to the device. Thermal Pad (PGND) Not a perimeter pin. Device thermal pad and PGND. Connected to the system ground plane. See Layout Recommendations section.
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 4 www.enpirion.com Absolute Maximum Ratings CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. PARAMETER SYMBOL MIN MAX UNITS Input Supply Voltage: AVIN1, AVIN2 VIN -0.5 4.0 V Voltages on: ENABLE, EN_PB, VDDQOK -0.5 V IN V Voltages on: VFB, VREF, EAOUT, VDDQ, VOUT, VSENSE, FQADJ -0.5 2.7 V Voltage on: POK 3.6 V Voltage on: SW -0.5 VDDQ+0.5 V Storage Temperature Range TSTG -65 150 °C Maximum Operating Junction Temperature TJ-ABS Max 150 °C Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A 260 °C ESD Rating (based on Human Body Model) 2000 V ESD Rating (based on CDM) 500 V Recommended Operating Conditions PARAMETER SYMBOL MIN MAX UNITS Input Voltage Range: AVIN1, AVIN2 2.9 3.7 V Input Voltage Range: VDDQ 1.0 1.8 V Input Voltage Range: VREF VEXTREF 0.4 0.72 V EN_PB, VDDQOK, EN 0 AVIN V Operating Ambient Temperature TA - 40 +85 °C Operating Junction Temperature TJ - 40 +125 °C Thermal Characteristics PARAMETER SYMBOL TYP UNITS Thermal Resistance: Junction to Ambient (0 LFM) (Note 1) θJA 22 °C/W Thermal Resistance: Junction to Case (0 LFM) θJC 2 °C/W Thermal Shutdown TSD 150 °C Thermal Shutdown Hysteresis TSDH 20 °C Note 1: Based on 2oz. external copper layers and proper thermal design in line with EIA/JEDEC JESD51-7 standard for high thermal conductivity boards.
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 5 www.enpirion.com
Electrical Characteristics
NOTE: AVIN1, AVIN2 = 3.3V, over operating temperature range unless otherwise noted. Typical values are at TA = 25°C. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Input Power Supply Voltage VDDQ 1.0 1.8 V Controller Supply Voltage AVIN 2.9 3.3 3.7 V Under Voltage Lock-out – AVIN Rising V UVLOR Voltage above which UVLO is not asserted 2.3 V Under Voltage Lock-out – AVIN Falling V UVLOF Voltage below which UVLO is asserted 2.1 V Shut-Down VDDQ Current I SD_VDDQ ENABLE = 0 150 µA Shut-Down AVIN Current I SD_AVIN ENABLE = 0 900 µA VREF Pin Current 20nA Output Voltage Accuracy – Initial ΔV OUT VOUT =1/2 VDDQ (e.g. @ VDDQ = 1.500V), 0.1% VREF and VOUT resistor dividers) 0.740 0.750 0.760 V VFB Pin Voltage VVFB 2.9V ≤ AVIN ≤ 3.7V, VREF=600mV, 0A ≤ ILOAD ≤ 5A 591 600 609 mV VFB Pin Input Leakage Current IVFB VFB pin input leakage current 20 nA Continuous Output Sourcing Current IOUT_SRC 0 5 A Continuous Output Sinking Current I OUT_SNK 0 5 A Over Current Trip Level I OCPH Sourcing. VDDQ = 1.35V 11 A Switching Frequency F SW R FQADJ = 3.57kOhms 1.5 MHz Frequency Adjust Resistor R FQADJ 3.57 k Ω Pre-Bias Level VPB Allowable pre-bias as a fraction of programmed output voltage for monotonic start up 20 85 % Non-Monotonicity V PB_NM Allowable non-monotonicity under pre- bias start up 50 mV VOUT Range for POK = High Range of output voltage as a fraction of programmed value when P OK is asserted 92 110 % POK Deglitch Delay Falling edge deglitch delay after output crossing 90% level 64 Clock cycles VPOK Output Low Level With 4mA current sink into P OK pin 0.6 V VPOK Output High Level When pulled up to AVIN (3.3V) with RPOK = 100k; VPOK = AVIN * (196k/(RPOK + 196k); 2.2 V POK Current Sink Capability 2.9V ≤ AVIN ≤ 3.7V 4 mA Enable Threshold V ENABLE 2.9V ≤ AVIN ≤ 3.7 V; Min voltage to ensure the converter is enabled 1.3 V
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 6 www.enpirion.com PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS Disable Threshold V DISABLE Max voltage to ensure the converter is disabled 0.8 V Enable Pin Current IEN AVIN = 3.6V 50 μA Binary Pin Logic Low Threshold V B-LOW VDDQOK, EN_PB 0.8 V Binary Pin Logic High Threshold V B-HIGH VDDQOK, EN_PB 1.8 V
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 7 www.enpirion.com Typical Performance Curves 100 EFFICIENCY (%) OUTPUT CURRENT (A) EFFICIENCY vs. OUTPUT CURRENT VOUT = 0.6V CONDITIONS AVIN = 3.3V VDDQ = 2*VOUT CONDITIONS AVIN = 3.3V VDDQ = 1.8V CONDITIONS AVIN = 3.3V VDDQ = 1.5V CONDITIONS AVIN = 3.3V VDDQ = 1.8V 100 EFFICIENCY (%) OUTPUT CURRENT (A) EFFICIENCY vs. OUTPUT CURRENT VOUT = 0.675V CONDITIONS AVIN = 3.3V VDDQ = 2*VOUT CONDITIONS AVIN = 3.3V VDDQ = 1.8V 100 EFFICIENCY (%) OUTPUT CURRENT (A) EFFICIENCY vs. OUTPUT CURRENT VOUT = 0.75V CONDITIONS AVIN = 3.3V VDDQ = 2*VOUT 100 EFFICIENCY (%) OUTPUT CURRENT (A) EFFICIENCY vs. OUTPUT CURRENT VOUT = 1.5V CONDITIONS AVIN = 3.3V VDDQ = 1.8V 100 EFFICIENCY (%) OUTPUT CURRENT (A) EFFICIENCY vs. OUTPUT CURRENT VOUT = 1.2V CONDITIONS AVIN = 3.3V VDDQ = 1.5V CONDITIONS AVIN = 3.3V VDDQ = 1.8V 0.56 0.57 0.58 0.59 0.6 0.61 0.62 0.63 0.64 OUTPUT VOLTAGE (V) OUTPUT CURRENT (A) VOUT vs. IOUT VOUT = 0.6V CONDITIONS VDDQ = 2*VOUT
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 8 www.enpirion.com Typical Performance Curves (Continued) 0.63 0.645 0.66 0.675 0.69 0.705 0.72 OUTPUT VOLTAGE (V) OUTPUT CURRENT (A) VOUT vs. IOUT VOUT = 0.675V CONDITIONS VDDQ = 2*VOUT CONDITIONS VDDQ = 2*VOUT 0.705 0.72 0.735 0.75 0.765 0.78 0.795 OUTPUT VOLTAGE (V) OUTPUT CURRENT (A) VOUT vs. IOUT VOUT = 0.75V CONDITIONS VDDQ = 2*VOUT 1.16 1.17 1.18 1.19 1.20 1.21 1.22 1.23 1.24 OUTPUT VOLTAGE (V) OUTPUT CURRENT (A) VOUT vs. IOUT VOUT = 1.2V CONDITIONS VDDQ = 1.5V AVIN = 3.3V 1.46 1.47 1.48 1.49 1.5 1.51 1.52 1.53 1.54 OUTPUT VOLTAGE (V) OUTPUT CURRENT (A) VOUT vs. IOUT VOUT = 1.5V CONDITIONS VDDQ = 1.8V AVIN = 3.3V 0.635 0.645 0.655 0.665 0.675 0.685 0.695 0.705 0.715 -40 -25 -10 5 20 35 50 65 80 95 110 125 OUTPUT VOLTAGE (V) JUNCTION TEMPERATURE ( C) VOUT vs. TEMPERATURE LOAD = 0A CONDITIONS VOUT = 0.675V VDDQ = 2*VOUT AVIN = 3.3V 0.635 0.645 0.655 0.665 0.675 0.685 0.695 0.705 0.715 -40 -25 -10 5 20 35 50 65 80 95 110 125 OUTPUT VOLTAGE (V) JUNCTION TEMPERATURE ( C) VOUT vs. TEMPERATURE LOAD = 1A CONDITIONS VOUT = 0.675V VDDQ = 2*VOUT AVIN = 3.3V
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 9 www.enpirion.com Typical Performance Characteristics VOUT (AC Coupled) Output Ripple at 20MHz Bandwidth CONDITIONS VDDQ = 1.2V VOUT = 0.6V IOUT = 4A CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206) VOUT (AC Coupled) Output Ripple at Full Bandwidth CONDITIONS VDDQ = 1.2V VOUT = 0.6V IOUT = 4A CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206) VOUT (AC Coupled) Output Ripple at 20MHz Bandwidth CONDITIONS VDDQ = 1.5V VOUT = 0.75V IOUT = 4A CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206) VOUT (AC Coupled) Output Ripple at Full Bandwidth CONDITIONS VDDQ = 1.5V VOUT = 0.75V IOUT = 4A CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206) EN Startup with Enable CONDITIONS VDDQ = 1.5V VOUT = 0.75V IOUT = 5A CSS = 3300pF LOAD VOUT EN Shutdown with Enable CONDITIONS VDDQ = 1.5V VOUT = 0.75V IOUT = 5A CSS = 3300pF LOAD VOUT
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 10 www.enpirion.com Typical Performance Characteristics (Continued) VDDQ CONDITIONS VDDQ = 1.5V, VOUT = 0.75V, IOUT = 5A, CSS = 3300pF LOAD VOUT VDDQOK (Tied to Upstream POK) Startup with VDDQ EV1340 POK VDDQ CONDITIONS VDDQ = 1.5V, VOUT = 0.75V, IOUT = 5A, CSS = 3300pF LOAD VOUT VDDQOK (Tied to Upstream POK) Shutdown with VDDQ EV1340 POK VOUT (AC Coupled) Load Transient from 0 to 4A CONDITIONS VDDQ = 1.2V VOUT = 0.6V CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206 )LOAD VOUT (AC Coupled) Load Transient from 0 to 4A CONDITIONS VDDQ = 1.3V VOUT = 0.65V CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206 ) LOAD VOUT (AC Coupled) Load Transient from 0 to 4A CONDITIONS VDDQ = 1.5V VOUT = 0.75V CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206 ) LOAD VOUT (AC Coupled) Load Transient from 0 to 4A CONDITIONS VDDQ = 1.8V VOUT = 0.9V CIN = 1 X 47µF (0805) COUT = 2 x 100 µF (1206 ) LOAD
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 11 www.enpirion.com Functional Block Diagram Figure 4: Functional Block Diagram
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 12 www.enpirion.com Functional Description Synchronous Buck Converter The EV1340 is a synchronous, programmable buck power supply with integrated power MOSFET switches and integrated inductor. The switching supply uses voltage mode control and a low noise PWM topology. Two power sources are required to operate this device; a power supply for the controller (AVIN) with a nominal input volt age range of 2.9-3.7V. The second supply (VDDQ) is the supply that is tracked - the recommended operating range is 1.0 to 1.8V. With the right choice of input and output dividers, the output voltage of the EV1340 will produce an output voltage which tracks to ½ VDDQ. The EV1340 can continuously source or sink currents up to 5A. The 1.5MHz nominal switching frequency enables small-size input and output capacitors. Enable Operation The ENABLE pin provides a means to enable normal operation or to shut down the device. When the ENABLE pin is asserted (high) the device will undergo a normal soft-start. A logic low on this pin will power the device down. Soft-Start and Soft-Shutdown The EV1340 can operate with the controller power supply (AVIN) ON, ENABLE High, and VDDQ ramped up and down at a relatively slow rate (~1V/ms). It is also expected that VDDQ may be dynamically scaled within a small voltage range. If, however, VDDQ should ramp up at a high rate, or if the device is enabled with a stable VDDQ, a capacitor connected between VREF and AGND provides the soft-start function to limit in-rush current. The soft-start time constant is determined by the input voltage divider and the soft-start capacitor. See Figure 5. Pre-Bias Start-up The EV1340 supports start up into a pre- biased load. A proprietary circuit ensures the output voltage ramps up monotonically from the pre-bias value to the programmed output voltage. Monotonic star t-up is guaranteed for pre-bias voltages in the range of >20% to <85% of the programmed output voltage. Outside of this range, the output voltage may not rise monotonically. T he Pre-Bias feature is controlled by the EN_PB pin. For the pre-Bias feature to function pr operly, VDDQ must be stable, and the device mu st be turned on and off using the ENABLE pin. VDDQOK Operation The VDDQOK pin can be used to indicate that the VDDQ voltage is in r egulation by tying it to an upstream POK signal. The upstream device is assumed to be driving the EV1340QI. VDDQOK is internally pulled up to 2.5V through a 94k resistor and is AND’ed with the POK of the EV1340QI. The VDDQOK’s high logic level voltage is cl amped at a diode drop above 2.5V. VDDQOK signal must be high in order for the POK of the EV1340QI to be high. POK Operation The internal EV1340 PO K is AND’ed with the VDDQOK input. POK is meant to be used with VDDQOK in a tracking application with VDDQ ramping. The VDDQOK input is assumed to be driven by the upstream VDDQ regulator’s POK output. Normally the VDDQOK input indicates that VDDQ has settled to the required level. If VDDQ is dynamically switched, VDDQOK is expected to mask the EV1340 POK during the voltage transition. POK is de-asserted low 64 clock cycles (~43µs at 1.5MHz) after the falling VOUT voltage crosses 45% (nominal) of VDDQ. POK is also de-asserted if VOUT exceeds 55% (nominal) of VDDQ. For proper POK thresholds, the input voltage divider must generate VREF nominally set to 0.4*VDDQ. Over-Current Protection The current limit function is achieved by sensing the current flowing in the hi-Side FET. When the sensed current exceeds the current limit, the PWM pulse is terminated for the rest
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 13 www.enpirion.com of the switching cycle. If the over-current condition lasts only a few switching cycles, normal PWM operation is resumed. If the over- current condition persists, the circuit will continue to protect the load by entering a hiccup mode. In the hicc up mode, the output is disabled for approximately 20ms and then it goes through a soft-start. The output will no longer track the input voltage briefly as a result of the fault condition. This cycle can continue indefinitely as long as the over current condition persists. Thermal Overload Protection Temperature sensing circuits in the controller will disable operation when the Junction temperature exceeds approximately 150ºC. When the junction temperature drops by approx 20ºC, the conver ter will re-start with a normal soft-start cycle. Input Under-Voltage Lock-Out When the AVIN pin voltage is below a required voltage level (V UVLOR) for normal operation, converter switching is inhibited. The lock-out threshold has hysteresis to prevent chatter. When the device is operating normally, the AVIN voltage must fall below the lower threshold (V UVLOF) for the device to stop switching.
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 15 www.enpirion.com Output Capacitor Selection The EV1340 has been optimized for use with 200µF of output capac itance. Low ESR ceramic capacitors are required with X5R or X7R dielectric formulation. Y5V or equivalent dielectric formulations must not be used as these lose capacitance with frequency, temperature and bias voltage. The capacitors shown in the table below are some typical output capacitors. Other capacitors with similar characteristics may also be used. Typical Recommended Output Capacitors Description MFG P/N 47µF, 10V, X5R, 1206 Taiyo Yuden LMK316BJ476ML-T 47µF, 6.3V, X5R, 1206 Taiyo Yuden Murata JMK316BJ476ML-T GRM31CR60J476ME19L 100µF, 6.3V, X5R, 1206 Murata GRM31CR60J107M Output ripple voltage is primarily determined by the aggregate output capac itor impedance. At the 1.5MHz switchi ng frequency output impedance, denoted as Z, is comprised mainly of effective series resistance, ESR, and effective series inductance, ESL: Z = ESR + ESL Placing multiple capacitors in parallel reduces the impedance and hence will result in lower ripple voltage. nTotal Z Z Z Z 1...1 1 1 2 1 + + + = Typical Ripple Voltages Output Capacitor Configuration Typical Output Ripple (mVp-p) VDDQ = 1.5V, VOUT = 0.75V 2 x 100 µF <10mV Schottky Diode Selection The EV1340 requires a Schottky diode from the SW pin to the VDDQ pin. The anode should be facing the SW pin and the cathode facing the VDDQ pi n. Enpirion has characterized the ST Microelectronics TMBYV10-40FILM diode with the EV1340. Contact Enpirion Applications Support for alternate options for this diode. Low V IN Applications The EV1340 is an excellent solution for low V IN applications where highest efficiency is very critical. Reference the low V IN efficiency chart in the Typical Performance Characteristics section for estimated efficiencies at several use cases. In these applications, a precision voltage reference is required for the VREF input of the EV1340. Figure 7 shows a schematic for a typical low V IN application. Figure 7: Typical Low VIN Application Schematic Power-Up Sequencing During power up, neither ENABLE nor VDDQ should be asserted before AVIN. There are two common acceptable turn-on/off sequences for the device. ENABLE can be tied to AVIN and come up with it, and VDDQ can be ramped up and down as needed. Alte rnatively, VDDQ can be brought high after AVIN is asserted, and the device can be turned on and off by toggling the ENABLE pin.
0.33mm, and the vias must have at least 1 oz. converter. Please see Figures 8, 9, 10, and 11. output capacitors to the system ground plane. proper filtering of the control circuit. Figure 8. See the section regarding exposed converter package on other layers. coupling into the control loop. the trace to this pin as short as possible. connection between AGND and PGND. further reduce noise coupling to VREF. customers to take advantage of this service.
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 18 www.enpirion.com Design Considerations for Lead-Frame Based Modules Exposed Metal on Bottom of Package Package lead frames offer advantages in thermal performance, in reduced electrical lead resistance, and in overall foot print. They do, however, require some special considerations. In the assembly process, lead-frame construction requires-for mechanical support- that some of the le ad-frame cantilevers be exposed at the point where wire-bonds or internal passives are attached. Because of this lead frame requirement, several small pads are exposed on the bottom of the package. Only the large thermal pad and the perimeter pads should be mechanically or electrically connected to the PC boar d. The PCB top layer under the EV1340 should be clear of any metal except for the large thermal pad. The hatched area in Figure 10 repres ents the area that should be clear of all me tal (traces, vias, or planes) on the top layer of the PCB. Figure 10: Lead-Frame Exposed Metal (Bottom View). The dimensioned hatched area highlights exposed metal below the device which should not be soldered down. There should not be any metal (traces, vias, or planes) on the top layer of the PCB below the hatched area.
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 19 www.enpirion.com Recommended PCB Footprint Figure 11: EV1340 Package PCB Footprint (Top View)
06218 10/19/2011 Rev: A EV1340QI ©Enpirion 2011 all rights reserved, E&OE 20 www.enpirion.com Package and Mechanical Figure 12: EV1340 Package Dimensions Contact Information Enpirion, Inc. Perryville III Corporate Park
53 Frontage Road, Suite 210
Hampton, NJ 08827 USA Phone: 908-894-6000 Fax: 908-894-6090 Enpirion reserves the right to make changes in circuit design and/or specifications at any time without notice. Information furnished by Enpirion is believed to be accurate and reliable. Enpirion assumes no responsibility for its use or for infringement of patents or other third party rights, which may result from its use. Enpirion products are not authorized for use in nuclear control systems, as critical components in life support systems or equipment used in hazardous environment without the express written authority from Enpirion.