ET8001-2FR4 EDGE-CORE | Alldatasheet

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Technical content

800G OSFP-2xFR4 2km Transceiver ET8001-2FR4 Based on a 5nm DSP and cooled 1271/1291/1311/1331 EML laser technology, the ET8001-2FR4 is an OSFP 2 x 400G-FR4 transceiver module, compliant with the 800 Gigabit hot-pluggable OSFP Multi-Source Agreement (MSA) used for up to 8 x 100G PAM4 data rates over 2 km single mode fiber. Optical PMD Illustration Datasheet Transceiver

■ Hot-pluggable OSFP form factor ■ Compliant with IEEE Std 802.3cu 400GBASE-FR4 ■ Electrical interface compliant with 100Gbps per lane defined by IEEE 802.3ck ■ 8 x 100G PAM4/8 x 50G PAM4 data rates ■ OSFP MSA package with dual duplex-LC connectors ■ Cooled 1271/1291/1311/1331 EML laser ■ 5nm DSP for low power dissipation: <14 W ■ I 2C management interface compliant to CMIS Rev5.0 with integrated Digital Diagnostics Monitoring ■ Control interface compliant with OSFP MSA ■ Internal CDR on both transmitter and receiver channels ■ Up to 2 km on 9/125um SMF ■ Single 3.3 V power supply ■ Class 1 laser safety certified ■ Operating case temperature range: 0℃ to 70 ℃ ■ RoHS6 compliant

Applications

■ High-speed Ethernet networks ■ 2 x 400G-FR4 applications ■ 2 x 200G-FR4 applications

Ordering Information

Part No. Transmitter Output Power OMA @106.25G Receiver Reach OMA Sensitivity @106.25G Case Temp. DDMI CMIS ET8001-2FR4 Cooled EML -0.2 ~ +3.7dBm PIN 2km <-4.6dBm 0~70℃ Yes CMIS5.0

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min. Max. Unit Storage Temperature TS -40 85 °C Relative Humidity RH 58 5% Supply Voltage VCC -0.53 .6 V Recommended Operating Conditions Parameter Symbol Min. Typical Max. Unit Operating Case Temperature TC 02 57 0° C Supply Voltage VCC 3.135 3.33 .465 V Data Rate per Channel - 53.125±100ppm V GBd Modulation Format PAM4 Transceiver Electrical Characteristics Parameter Symbol Min. Typical Max. Unit Notes Power Dissipation PD -- 14 W Input Differential Impedance ZIN 90 100 110 Ω- Differential Data Input Swing VIN, P-P -- 900 mVP-P - DC Common-Mode Input Voltage -350 - 2850 mV Receiver Electrical Characteristics Parameter Symbol Min. Typical Max. Unit Notes Output Differential Impedance ZO 90 100 110 Ω Differential Data Output Swing VOUT, P-P -- 900 mVP-P 1 Dual Function Signals Parameter Symbol Min. Typical Max. Unit Notes INT/RSTn V_INT/RSTn_1 0.000 0.000 1.000 V2 V_INT/RSTn_2 0.000 0.000 1.000 V3 V_INT/RSTn_3 1.500 1.900 2.250 V4 V_INT/RSTn_4 2.750 3.000 3.465 V5 LPWn/PRSn V_ LPWn/PRSn_1 0.000 0.950 1.100 V6 V_ LPWn/PRSn _2 1.400 1.700 2.250 V7 V_ LPWn/PRSn _3 2.750 3.300 3.465 V8 Notes: 1. Internally AC coupled, but requires an external 100Ω differential load termination. 2. INT/RSTn voltage for no module. 3. INT/RSTn voltage for module installed, H_RSTn=Low. 4. INT/RSTn voltage for module installed, H_RSTn=High, M_INT=Low. 5. INT/RSTn voltage for module installed, H_RSTn=High, M_INT= High. 6. LPWn/PRSn voltage for module installed, H_LPWn=Low. 7. LPWn/PRSn voltage for module installed, H_LPWn =High. 8. LPWn/PRSn voltage for no module.

Transmitter Optical Characteristics Parameter Symbol Minimum Typical Maximum Unit Notes Average Launch Power, each lane P0 (100G) -3.24 .4 dBm 1 P0 (50G) -4.2- 4.7 dBm 1 100G OMA per Channel TDECQ<1.4dB -0.2- 3.7 dBm 1 1.4≤TDECQ≤3.4dB -1.6+TDECQ -3 .7 dBm 1 50G OMA per Channel P1 (50G) -1.24 .5 dBm 1 Extinction RatioE R3 .5 -- dB - Center Wavelength Range CH1 1264.5 1271 1277.5n m CH2 1284.5 1291 1297.5n m CH3 1304.5 1311 1317.5n m CH4 1324.5 1331 1337.5n m CH5 1264.5 1271 1277.5n m CH6 1284.5 1291 1297.5n m CH7 1304.5 1311 1317.5n m CH8 1324.5 1331 1337.5n m Side Mode Suppression Ratio SMSR 30 -- dB PAM4 TDECQ -- 3.4d B Optical Return Loss Tolerance ORLT 17.1d B Pout of OFF Transmitter, each lane Poff -30 dBm Notes: 1. Class 1 laser safety per FDA/CDRH and EN (IEC) 60825 regulations. Receiver Optical Characteristics Parameter Symbol Minimum Typical Maximum Unit Notes Optical Wavelength Range CH1 1264.5 1271 1277.5n m CH2 1284.5 1291 1297.5n m CH3 1304.5 1311 1317.5n m CH4 1324.5 1331 1337.5n m CH5 1264.5 1271 1277.5n m CH6 1284.5 1291 1297.5n m CH7 1304.5 1311 1317.5n m CH8 1324.5 1331 1337.5n m 100G Receiver Sensitivity (OMA) RxSENS1 -4.6 dBm 1 50G Receiver Sensitivity (OMA) RxSENS2 -5.5 dBm 2 Receiver Overload (Pavg)P OL 4.4- dBm 1 Receiver Reflectance -26 dB RSSI Accuracy -2 2d B LOS De-Assert LOSD -10 dBm LOS Assert LOSA -16 dBm LOS Hysteresis 0.5d B Notes: 1. Measured with PRBS31Q test pattern, 53.125GBd, PAM4, BER<2.4E-4. 2. Measured with PRBS31Q test pattern, 26.5625GBd, PAM4, BER<2.4E-4.

Electrical Pin Description Pin Name Function/Description LogicD irection Plug Sequence Notes

1 GND Ground 1

2 TX2p Transmitter Data Non-Inverted CML-I Input from Host 3

3 TX2n Transmitter Data Inverted CML-I Input from Host 3

4 GND Ground 1

5 TX4p Transmitter Data Non-Inverted CML-I Input from Host 3

6 TX4n Transmitter Data Inverted CML-I Input from Host 3

7 GND Ground 1

8 TX6p Transmitter Data Non-Inverted CML-I Input from Host 3

9 TX6n Transmitter Data Inverted CML-I Input from Host 3

10 GND Ground 1

11 TX8p Transmitter Data Non-Inverted CML-I Input from Host 3

12 TX8n Transmitter Data Inverted CML-I Input from Host 3

13 GND Ground 1

14 SCL 2-Wire Serial Interface Clock LVCMOS-I/O Bi-directional 31

15 VCC +3.3 V Power Power from Host 2 16 VCC +3.3 V Power Power from Host 2

17 LPWn/PRSn Low-Power Mode/Module Present Multi-Level Bi-directional 32

18 GND Ground 1

19 RX7n Receiver Data Inverted CML-O Output to Host 3

20 RX7p Receiver Data Non-Inverted CML-O Output to Host 3

21 GND Ground 1

22 RX5n Receiver Data Inverted CML-O Output to Host 3

23 RX5p Receiver Data Non-Inverted CML-O Output to Host 3

24 GND Ground 1

25 RX3n Receiver Data Inverted CML-O Output to Host 3

26 RX3p Receiver Data Non-Inverted CML-O Output to Host 3

27 GND Ground 1

28 RX1n Receiver Data Inverted CML-O Output to Host 3

29 RX1p Receiver Data Non-Inverted CML-O Output to Host 3

30 GND Ground 1

Electrical Pin Description Pin Name Function/Description LogicD irection Plug Sequence Notes

31 GND Ground 1

32 RX2p Receiver Data Non-Inverted CML-O Output to Host 3

33 RX2n Receiver Data Inverted CML-O Output to Host 3

34 GND Ground 1

35 RX4p Receiver Data Non-Inverted CML-O Output to Host 3

36 RX4n Receiver Data Inverted CML-O Output to Host 3

37 GND Ground 1

38 RX6p Receiver Data Non-Inverted CML-O Output to Host 3

39 RX6n Receiver Data Inverted CML-O Output to Host 3

40 GND Ground 1

41 RX8p Receiver Data Non-Inverted CML-O Output to Host 3

42 RX8n Receiver Data Inverted CML-O Output to Host 3

43 GND Ground 1

44 INT/RSTn Module Interrupt / Module Reset Multi-Level Bi-directional 32

45 VCC +3.3 V Power Power from Host 2 46 VCC +3.3 V Power Power from Host 2

47 SDA 2-Wire Serial Interface Data LVCMOS-I/O Bi-directional 31

48 GND Ground 1

49 TX7n Transmitter Data Inverted CML-I Input from Host 3

50 TX7p Transmitter Data Non-Inverted CML-I Input from Host 3

51 GND Ground 1

52 TX5n Transmitter Data Inverted CML-I Input from Host 3

53 TX5p Transmitter Data Non-Inverted CML-I Input from Host 3

54 GND Ground 1

55 TX3n Transmitter Data Inverted CML-I Input from Host 3

56 TX3p Transmitter Data Non-Inverted CML-I Input from Host 3

57 GND Ground 1

58 TX1n Transmitter Data Inverted CML-I Input from Host 3

59 TX1p Transmitter Data Non-Inverted CML-I Input from Host 3

60 GND Ground 1

Notes: 1. Open-Drain with pull-up resistor on host. 2. See pin description of OSFP MSA for required circuit. Top Side GND 1 Tx2p 2 Tx2n 3 GND 4 Tx4p 5 Tx4n 6 GND 7 Tx6p 8 Tx6n 9 GND 10 Tx8p 11 Tx8n 12 GND 13 SCL 14 VCC 15 VCC 16 LPWn/PRSn 17 GND 18 Rx7n 19 Rx7p 20 GND 21 Rx5n 22 Rx5p 23 GND 24 Rx3n 25 Rx3p 26 GND 27 Rx1n 28 Rx1p 29 GND 30

60 GND

59 Tx1p

58 Tx1n

57 GND

56 Tx3p

55 Tx3n

54 GND

53 Tx5p

52 Tx5n

51 GND

50 Tx7p

49 Tx7n

48 GND

47 SDA

46 VCC

45 VCC

44 INT/SRTn

43 GND

42 Rx8n

41 Rx8p

40 GND

39 Rx6n

38 Rx6p

37 GND

36 Rx4n

35 Rx4p

34 GND

33 Rx2n

32 Rx2p

31 GND

viewed from top viewed from bottom

Digital Diagnostic Memory Map Digital Diagnostics Monitoring is available on all OSFP products. A 2-wire serial interface provides users access to the module with a high clock frequency up to 100 KHz. The control interface and memory map of the OSFP modules are compliant with CMIS (Common Management Interface Specification) for pluggable transceivers. The memory space is arranged into a lower 128 bytes page and multiple upper space pages.

EEPROM Serial ID Memory Contents CMIS transceivers define the lower 128 bytes of the two-wire serial bus address space for access to a variety of measurements and diagnostic functions, a set of control functions, and a means to select which of the various upper memory map pages are accessed on subsequent accesses. This portion of the address space is always directly addressable and thus is chosen for monitoring and control functions that may need to be repeatedly accessed. The lower page is subdivided into several areas as illustrated. Address Size Subject Area Description 0-2 3 Management Characteristics Basic information about how this module is managed

31 Global Status Information Current state of module, interrupt signal status

4-7 4F lags Summary Summary of flags set on specific pages (and banks) 8-13 6 Module-Level Flags Flags that are not lane or data path specific 14-25 12 Module-Level Monitors Monitors that are not lane or data path specific 26-30 5 Module-Level Controls Controls applicable to the module as a whole 31-36 6 Module-Level Masks Mask bits for the Module-Level Flags 37-38 2 CDB Command Status Status of current CDB command 39-40 2 Module Active Firmware Version Module Active Firmware Version number 41 1F ault Information Fault cause for entering module fault state 42-63 22 - Reserved[22] 64-84 21 - Custom[21] 85-117 33 Supported Applications Advertising Applications supported by module data path(s) 118-125 8P assword Facilities Password entry and change (mechanism only) 126-127 2P age Mapping Page mapping into host addressable upper memory

Data Address Name of Field Contents (Hex) Description

128 Identifier1 9 OSFP

Edgecore (ASCII) 63 6F 72 65 20 20 20 20 20 20 20 20 145-147 Vendor OUI 5A ED 67 - 148-163 Vendor PN 45 54 38 30 “ET8001-2FR4” (ASCII) 30 31 2D 32 46 52 34 20 20 20 20 20 164-165 Vendor REV 31 30 1.0 (ASCII) 166-181 Vendor SN 32 33 32 38 “2328100001” 31 30 30 30 30 31 20 20 20 20 20 20 182-189 Date Code 32 33 30 31 Year (2 bytes), Month (2 bytes), Day (2 bytes) 31 36 20 20 “230616” 190-199 CLEI Code 200-201 Module Power Characteristics C0 38 Power class 7, 14W Maximum

202 Cable Assembly Link Length 00

203 Connector Type 07 LC

204-209 Copper Cable Attenuation 00 00 00 00 - 00 00

210 Media Lane Information 00

211 Cable Assembly Information 00

212 Media Interface Technology 06 1310nm EML

221 Custom 00

222 Checksum xx

Note: 1. The “xx” byte should be filled in according to practical case. For more information, please refer to the related document of CMIS transceivers.

Recommended Host Board Power Supply Filter Network Recommended Application Interface Block Diagram VCC Module 3.3 V VCC HOST 3.3 V 0.25ohms 47uF 0.1uF 470nH VCC HOST 3.3 V 2.2K ohms2.2K ohms OSFP Module VCC HOST 3.3 V VCC Module 3.3 V CPLD/FPGA Micro Controller INT/RSTn Module Circuit LPWn/PRSn Module Circuit INT/PRTn Host Circuit LPWn/PRSn Host Circuit OpticsSwitch ASIC 8 x 50G PAM4 CDR SDA SCL INT/RSTn LPWn/PRSn Power Filter VCC VCC VCC VCC H_RSTn H_LPWn M_RSTn M_LPWn H_INTn H_PRSn M_INT ENABLE_L ECB (optional) TX[8:1]p/n RX[8:1]p/n AC CAPS AC CAPS

Mechanical Specifications Unit: mm 6.25 1±0.1 22.58±0.13.4±0.1 1.5±0.1 18.77±0.07 116.2±0.2 7.23 139.1 R0.5 Unit: mm 16.25±0.1 12.95±0.15

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