ES2AG CHENDA | Alldatasheet
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The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Low reverse leakage B uilt-in strain relief,ideal for automated placement High forward surge current capability High temperature soldering guaranteed: 250°C/10 seconds at terminals Glass passivated chip junction DO-214AC/SMA Dimensions in inches and (millimeters) Case : JEDEC DO-214AC/SMA Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.002 ounce, 0.055 grams Maximum Ratings And Electrical Characteristics Ratings at 25°C ambient temperature unlss otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. 0.208(5.30) 0.067 (1.70) 0.051 (1.30) 0.177(4.50) 0.157(3.99) 0.110(2.80) 0.094(2.40) 0.060(1.52) 0.030(0.76) 0.188(4.80) 0.012(0.305) 0.006(0.152) 0.008(0.203)MAX. 0.096(2.42) 0.078(1.98) Parameter SYMBOLS ES2AG ES2BG ES2CG ES2DG ES2EG ES2GG ES2JG UNITSMarking Code MDD ES2A MDD ES2B MDD ES2C MDD ES2D MDD ES2E MDD ES2G MDD ES2J Maximum repetitive peak reverse voltage VRMM 50 100 150 200 300 400 600 V Maximum RMS voltage VRMS 35 70 105 140 210 280 420 V Maximum DC blocking voltage VDC 50 100 150 200 300 400 600 V Maximum average forward rectified current at TL=55℃ I(AV) 2.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 50 A Maximum instantaneous forward voltage at 2.0A VF 1 1.25 1.68 V TA=25℃Maximum DC reverse current at rated DCblocking voltage TA=125℃ IR 5.0 100.0 μA Maximum reverse recovery time (NOTE 1) trr 35 ns Typical junction capacitance (NOTE 2) CJ 40.0 pF Typical thermal resistance (NOTE 3) RJA 60.0 ℃/W Operating junction and storage temperature range TJ,TSTG - 5 5t o+ 1 5 0 ℃ Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A 3.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 4.The typical data above is for referenceonly.
Rev:2019A0 Page :2 Ratings And Characteristic Curves https://www.microdiode.com Reverse Voltage - 50 to 600 Volts Forward Current - 2.0 Ampere ES2AG THRU ES2JG The curve above is for reference only. 10 100 Fig.6 Maximum Non-Repetitive Peak Forward Surge Current Peak Forward Surge Current (A) Number of Cycles Fig.3 Typical Reverse Characteristics IR- Reverse Current ( μA) 20 100600 0.1 1.0 100 40 80 300 TJ=25°C TJ=75°C TJ=125°C Fig.4 Typical Forward Characteristics 2.0 2.51.50 0.01 0.1 1.0 0.5 1.0 0.001 Instaneous Forward Current (A) Instaneous Forward Voltage (V) TJ=25°C ES2J ES2E/ES2G ES2A~ES2D Noninductive 25Vdc approx D.U.T 10 ohm Noninductive NonInductive 1 ohm OSCILLOSCOPE Note 1 PULSE GENERATOR Note 2 Note:1 .Rise Time = 7ns, max. Input Impedance = 1megohm,22pF. 2. Ries Time =10ns, max. Sou r ce Impedance = 50 ohms. -0.25 -1.0 +0.5 50 ohm trr 10ns/div Set time Base for 10ns/div 0.5 1.0 1.5 2.0 2.5 3.0 0.0 25 50 75 100 125 150 175 Average Forward Current (A) Case Temperature (°C) Fig.2 Maximum Average Forward Current Rating Single phase half-wave 60 Hz resistive or inductive load 8.3 ms Single Half Sine Wave (JEDEC Method) Junction Capacitance (pF) 1.0 10 1000.1 100 Reverse Voltage (V) TJ=25°C % of PIV.VOLTS Fig.5 Typical Junction Capacitance TJ=25°C f = 1.0MHz Vsig = 50mV p-p
https://www.microdiode.com Rev:2019A0 Page :3 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). Suggested Pad Layout E B d F W PA D D1D2 C T Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing SMA 7" 2,000 4.0 4,000 183*155*183 178 382*356*392 160,000 16.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) SMA 11" 5,000 4.0 10,000 290* 290*38 330 310*3 10*360 80,000 11.0 Reverse Voltage - 50 to 600 Volts Forward Current - 2.0 Ampere ES2AG THRU ES2JG SMA 13" 7,500 4.0 15,000 335*335*38 330 350*330*360 120,000 14.5 unit:mm Item Symbol Tolerance SMA Carrier width A 0.1 2.80 Carrier length B 0.1 5.33 Carrier depth C 0.1 2.36 Sprocket hole d 0.05 1.50 13" Reel outside diameter D 2.0 330.00 13" Reel inner diameter D 1 min 50.00 7" Reel outside diameter D 2.0 178.00 7" Reel inner diameter D 1 min 62.00 Feed hole diameter D2 0.5 13.00 Sprocket hole position E 0.1 1.75 Punch hole position F 0.1 5.50 Punch hole pitch P 0.1 4.00 Sprocket hole pitch P0 0.1 4.00 Embossment center P1 0.1 2.00 Overall tape thickness T 0.1 0.28 Tape width W 0.3 12.00 Reel width W1 1.0 18.00 Symbol Unit (mm) Unit (inch) A 1.68 0.066 B 1.52 0.060 C 3.90 0.154 D 2.41 0.095 E 5.45 0.215