ES1ES

ES1AS BYTESONIC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 2

Technical content

Features

• Low profile space
• Ideal for automated placement
• Glass passivated chip junctions
• Low forward voltage drop
• Low leakage current
• High forward surge capability
• High temperature soldering： 260℃/10 seconds at terminals
• Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date
• Case: JEDEC SOD-123FL molded plastic body over glass passivated chip
• Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
• Polarity: Laser band denotes cathode end
• Weight: 0.00 92gram Maximum Ratings & Thermal Characteristics & Electrical Characteristics (TA = 25 °C unless otherwise noted) Symbol ES1AS ES1BS ES1CS ES1DS ES 1ES ES1GS ES1JS UNIT VRRM 50 100 150 200 300 400 600 V VRMS 35 70 105 140 210 280 420 V VDC 50 100 150 200 300 400 600 V IF(AV) A IFSM A VF 1.70 V IR μA trr nS RθJA ℃/W TJ, TSTG ℃ 1.25 Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 mS single half sine- wave superimposed on rated load 30 Operating junction and storage temperature range –55 to +150 0.95 35Maximum reverse recovery time at I F = 0.5 A , IR = 1.0 A , Irr = 0.25 A Typical thermal resistance 150 Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA = 25 ℃ at Rated DC blocking voltage TA = 100℃ 5.0 150 Lead free Finish/ROHS Compliant● http://www.bytesonic.com. tw Version 1.4 2019/6/18 Dimensions in inches and (millimeters) SOD-123FL .011(0.3) 004(0.1) 0.0 82(2.00) 0.0 55(1.40) 044(1.10) 28(0.70) 0.1 16(2.95) .100(2.55) 152(3.85) 140(3.55) 047(1.20) 0.035(0.90) A ll data sheet.com

NO T E:1 .Ri se T im e = 7ns m ax. In p u t Im p ed ance = 1 me g oh m . 22 p F 2 .Rise T im e = 10ns m ax. S our c e Im p eda nce = 50 O h m s trr +0.5A -0.25 -1.0 SET T IM E 1c m BA SE FO R 50 n s/cm 2. 0 1. 0 100 S I NG L E P HAS E HA L F WAVE R ES I S T IVE OR INDUCT IVE P .C. B M OUNT E D ON m ) P A D A R EAS LEAD T EM P ER A T UR E, ¢J Fi g. 1-REVE R S E R ECO VER Y T IM E CHARA CT ERI S T IC A ND T ES T CI RCUI T DI A G RAM F ig. 2-MAX IMUM AVERAGE FO R W ARD CURRENT RA T ING 000 100 0 .1 20 40 60 80 100 120 T J = 2 5 ¢J T J = 1 25 ¢J T J = 7 5 ¢J % O F PIV. V O L T S 0.1 0 .01 0 .00 0 .2 0.4 ES 1ES ES 1AS ES 1JS T J = 25 ¢J INS T A N T A N EO U S FO RW A RD V OL T AGE V OL T S Fi g. 3-T YPI C AL REV ERSE CHA RACT E RI ST ICS Fig. 4-T Y PI CA L F ORW ARD CHARACT ERI ST ICS 10 20 0 100 8. 3m s SI N GL E H A LF SI N E WA V E J ED EC M ETH OD NU MBER O F C Y C L ES A T 60 Hz 8 .0 6 .0 4 .0 2 .0 100 T J = 25 ¢J f = 1 .0M Hz V s ig = 50 m V p -p RE V ERSE V O L T A G E, VO L T S Fig. 5-MA X IMUM NO N-REPE T IT IVE SURGE CURRENT Fig. 6-T Y PI CA L JUNCT IO N CAPA CI TANCE INST ANT ANEOUS FORWARD CURRENT AMPERES IR- REVERSE LEAKAGE CURRENT , MICROAMPERES PEAK FORWARD SURGE CURRENT, AMPERES A VERAGE FORWARD CURRENT AMPERES JUN CTION CAPACIT ANCE, pF http://www.bytesonic.com. tw Version 1.4 2019/6/18 A ll data sheet.com