ERF8-010-05.0-S-DV-K-TR SAMTEC | Alldatasheet

Document overview

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Technical content

(0.80 mm) .0315" ERF8 SERIES Robust Edge Rate® contact improves “Zippered” unmating 10 to 150 I/Os WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. Note: Some lengths, styles and options are non-standard, non-returnable. –005, –010, –011, –013, –020, –025, –100 (Available with –05.0 lead style only) = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail = 30 µ" (0.76 µm) Gold on contact, Matte Tin on tail (0.80) .0315 (1.07) .042 (1.32) .052 DIA (5.60) .220 (3.35) .132 (5.30) .209 (3.35) .132 A (5.40) .213 (0.94) .037 (2.50) .098 (7.25) .285 (7.20) .283 (6.20) .244 (0.64) .025 No. of Positions x –L & –EGP = No. of Positions x –EGPS = No. of Positions x Specify LEAD STYLE from chart LEAD STYLE A (5.10) .200–05.0 –07.0 (7.00) .276 ERF8 NO. OF POSITIONS PER ROW TRPLATING OPTION OTHER OPTION LEAD STYLE DV –TR = Tape & Reel Packaging = Latching (Lead Style –05.0 only) (N/A with –EGP or –EGPS option) –EGP = Extended Guide Post (Lead Style –07.0 only) (N/A with –L & –EGPS option) –EGPS = Extended Guide Post Shield (Lead Style –07.0 only) (N/A with –L & –EGP option) Polyimide Film Pick & Place Pad –EGP –EGPS RUGGED HIGH-SPEED SOCKET Board Mates: ERM8 Cable Mates: ERCD, ERDP (1.50 mm) .059" NOMINAL WIPE MATED HEIGHT* ERF8 LEAD STYLE ERM8 LEAD STYLE –05.0 (7.00) .276 (10.00) .394 (13.00) .512 (14.00) .551 –07.0 (9.00) .354 (12.00) .472 (15.00) .591 (16.00) .629 *Processing conditions will affect mated height.

APPLICATIONS

STANDARD POS. PART NOs. SERIES NEXUS5001™.org POWER.org™

10 ASP-148421-01 ERF8-DV

11 ASP-137969-01 ERF8-DV

17 ASP-137973-01 ERF8-DV

ARM/HSSTP 20 ASP-130367-01 ERF8-DV NEXUS5001™.org POWER.org™

23 ASP-130368-01 ERF8-DV

25 ASP-148422-01 ERF8-DV

35 ASP-135029-01 ERF8-DV

40 ASP-148424-01 ERF8-DV

(MOQ Required)

  • Mezzanine stack heights Contact Samtec. Note: Patented For complete specifications and recommended PCB layouts see www.samtec.com?ERF8 Insulator Material: Black LCP Contact Material: BeCu Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating:

2.2 A per pin

(1 pin powered per row) Operating Temp Range: -55 °C to + 125 °C Voltage Rating:

225 VAC / 318 VDC

RoHS Compliant: Ye s For complete scope of recognitions see www.samtec.com/quality RECOGNITIONS PROCESSING SPECIFICATIONS Lead–Free Solderable: Ye s SMT Lead Coplanarity: FILE NO. E111594 PROTOCOLS

  • 100 GbE
  • PCI Express™ EXTENDED LIFE PRODUC T

10 YEAR MFG

WITH 30 µ" GOLD HIGH MATING CYCLESGbps HIGH-SPEED CHANNEL PERFORMANCE ERM8/ERF8 @ 7 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com F-217 (Rev 06MAR17)