ERB1885C2D100RDX1D MURATA1 | Alldatasheet
Document overview
- PDF pages: 20
Technical content
ERB Series: Exhibiting a capacitance range of 0.5 to 1,000pF , the ERB series of capacitors comes with higher Q and lower ESR which is better than the standard products of equivalent packages. For high performance, medium power RF designs, this series offers low ESR in the 1MHz to 1GHz frequency range. The temperature stability of the C0G dielectrics ensures low power dissipation. The ERB series is designed with precious metal inner electrodes. These surface mount capacitors are available in voltages up to 500VDC in a 1210 EIA size. Features: Size: 0603, 0805, and 1210 Voltage: 50, 100, 250, 300, 500VDC Cap Range: 0.5 to 1000pF Internal Electrode: Pd/Ag Termination: Pd/Ag + Ni/Sn plating ESR: Low Power: Medium Power (5-15W) Frequency Range: 1MHz –1GHz Tolerance: Tight Tolerance Available ([W]=+/-0.05pF for <=5pF , [ [B]=+/-0.1pF for Temp. Characteristics: C0G (-55ºC to 125ºC with 0 ±30ppm/ºC) Applications: General purpose high frequency circuits, wireless equipment, high frequency radios, broadcast satellites, terminals, RF and base station power amplifiers ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Summary 44 – Innovator in Electronics www.murata.com C-29-C
Inner Electrode (Pd) Sn Ni Ag/Pd Ceramics Chip Dimensions High Frequency ERB Series Chip Capacitor c b a Land Solder Resist L TW e e g Land Pattern Dimensions Code TC Cap. Change Operating Temp. Range 5C C0G 0+/-30ppm/C 25 to 125C Global Part Numbering ER B 18 8 5C 2D 100 J DX5 B Chip Dimensions Series EIA size L W T max. e max. g min. Flow Soldering Series a b c Re-Flow Soldering Series a b c 1pF 10pF 100pF pF ERB18 C0G 250V 0.5 to 100 pF 250V 0.5 to 100 pF 100V 110 to 130 pF 50V 150 to 160 pF 500V 0.5 to 120 pF 300V 130 to 150 pF 250V 160 to 220 pF 100V 240 to 470 pF 50V 510 to 1000 pF Series TC WV Capacitance Range 1000pF ERB21 C0G ERB32 C0G Unit: mm Inner Electrode (Pd) Sn Ni Ag/Pd Ceramics Dielectric (Ceramic) Plating (Sn) Barrier (Ni) Termination (Ag/Pd) Inner Electrode (Pd) ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Data Sheet Innovator in Electronics – 45C-29-C www.murata.com
Size TC WV Cap Cap Tol Murata Global P/N 0603 C0G 250V 0.5pF +/-0.1pF ERB1885C2ER50BDX1D 0603 C0G 250V 0.5pF +/-0.25pF ERB1885C2ER50CDX1D 0603 C0G 250V 0.75pF +/-0.1pF ERB1885C2ER75BDX1D 0603 C0G 250V 0.75pF +/-0.25pF ERB1885C2ER75CDX1D 0603 C0G 250V 1pF +/-0.1pF ERB1885C2E1R0BDX1D 0603 C0G 250V 1pF +/-0.25pF ERB1885C2E1R0CDX1D 0603 C0G 250V 1.1pF +/-0.1pF ERB1885C2E1R1BDX1D 0603 C0G 250V 1.2pF +/-0.1pF ERB1885C2E1R2BDX1D 0603 C0G 250V 1.3pF +/-0.1pF ERB1885C2E1R3BDX1D 0603 C0G 250V 1.5pF +/-0.1pF ERB1885C2E1R5BDX1D 0603 C0G 250V 1.5pF +/-0.25pF ERB1885C2E1R5CDX1D 0603 C0G 250V 1.6pF +/-0.1pF ERB1885C2E1R6BDX1D 0603 C0G 250V 1.8pF +/-0.1pF ERB1885C2E1R8BDX1D 0603 C0G 250V 2pF +/-0.1pF ERB1885C2E2R0BDX1D 0603 C0G 250V 2pF +/-0.25pF ERB1885C2E2R0CDX1D 0603 C0G 250V 2.2pF +/-0.1pF ERB1885C2E2R2BDX1D 0603 C0G 250V 2.4pF +/-0.1pF ERB1885C2E2R4BDX1D 0603 C0G 250V 2.7pF +/-0.1pF ERB1885C2E2R7BDX1D 0603 C0G 250V 3pF +/-0.1pF ERB1885C2E3R0BDX1D 0603 C0G 250V 3pF +/-0.25pF ERB1885C2E3R0CDX1D 0603 C0G 250V 3.3pF +/-0.1pF ERB1885C2E3R3BDX1D 0603 C0G 250V 3.6pF +/-0.1pF ERB1885C2E3R6BDX1D 0603 C0G 250V 3.9pF +/-0.1pF ERB1885C2E3R9BDX1D 0603 C0G 250V 4pF +/-0.1pF ERB1885C2E4R0BDX1D 0603 C0G 250V 4pF +/-0.25pF ERB1885C2E4R0CDX1D 0603 C0G 250V 4.3pF +/-0.1pF ERB1885C2E4R3BDX1D 0603 C0G 250V 4.7pF +/-0.1pF ERB1885C2E4R7BDX1D 0603 C0G 250V 5pF +/-0.1pF ERB1885C2E5R0BDX1D 0603 C0G 250V 5pF +/-0.25pF ERB1885C2E5R0CDX1D 0603 C0G 250V 5.1pF +/-0.25pF ERB1885C2E5R1CDX1D 0603 C0G 250V 5.6pF +/-0.25pF ERB1885C2E5R6CDX1D 0603 C0G 250V 6pF +/-0.25pF ERB1885C2E6R0CDX1D 0603 C0G 250V 6pF +/-0.5pF ERB1885C2E6R0DDX1D 0603 C0G 250V 6.2pF +/-0.25pF ERB1885C2E6R2CDX1D 0603 C0G 250V 6.8pF +/-0.25pF ERB1885C2E6R8CDX1D High Frequency ERB Series (0603 / C0G)ERB18 Series ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Offering 46 – Innovator in Electronics C-29-C www.murata.com
Size TC WV Cap Cap Tol Murata Global P/N 0603 C0G 250V 7pF +/-0.25pF ERB1885C2E7R0CDX5D 0603 C0G 250V 7pF +/-0.5pF ERB1885C2E7R0DDX5D 0603 C0G 250V 7.5pF +/-0.25pF ERB1885C2E7R5CDX5D 0603 C0G 250V 8pF +/-0.25pF ERB1885C2E8R0CDX5D 0603 C0G 250V 8pF +/-0.5pF ERB1885C2E8R0DDX5D 0603 C0G 250V 8.2pF +/-0.25pF ERB1885C2E8R2CDX5D 0603 C0G 250V 9pF +/-0.25pF ERB1885C2E9R0CDX5D 0603 C0G 250V 9pF +/-0.5pF ERB1885C2E9R0DDX5D 0603 C0G 250V 9.1pF +/-0.25pF ERB1885C2E9R1CDX5D
0603 C0G 250V 10pF +/-2% ERB1885C2E100GDX5D
0603 C0G 250V 10pF +/-5% ERB1885C2E100JDX5D
0603 C0G 250V 12pF +/-2% ERB1885C2E120GDX5D
0603 C0G 250V 12pF +/-5% ERB1885C2E120JDX5D
0603 C0G 250V 15pF +/-2% ERB1885C2E150GDX5D
0603 C0G 250V 15pF +/-5% ERB1885C2E150JDX5D
0603 C0G 250V 18pF +/-2% ERB1885C2E180GDX5D
0603 C0G 250V 18pF +/-5% ERB1885C2E180JDX5D
0603 C0G 250V 22pF +/-2% ERB1885C2E220GDX5D
0603 C0G 250V 22pF +/-5% ERB1885C2E220JDX5D
0603 C0G 250V 27pF +/-2% ERB1885C2E270GDX5D
0603 C0G 250V 27pF +/-5% ERB1885C2E270JDX5D
0603 C0G 250V 33pF +/-2% ERB1885C2E330GDX5D
0603 C0G 250V 33pF +/-5% ERB1885C2E330JDX5D
0603 C0G 250V 39pF +/-2% ERB1885C2E390GDX5D
0603 C0G 250V 39pF +/-5% ERB1885C2E390JDX5D
0603 C0G 250V 47pF +/-2% ERB1885C2E470GDX5D
0603 C0G 250V 47pF +/-5% ERB1885C2E470JDX5D
0603 C0G 250V 56pF +/-2% ERB1885C2E560GDX5D
0603 C0G 250V 56pF +/-5% ERB1885C2E560JDX5D
0603 C0G 250V 68pF +/-2% ERB1885C2E680GDX5D
0603 C0G 250V 68pF +/-5% ERB1885C2E680JDX5D
0603 C0G 250V 82pF +/-2% ERB1885C2E820GDX5D
0603 C0G 250V 82pF +/-5% ERB1885C2E820JDX5D
0603 C0G 250V 100pF +/-2% ERB1885C2E101GDX5D
0603 C0G 250V 100pF +/-5% ERB1885C2E101JDX5D
High Frequency ERB Series (0603 / C0G)ERB18 Series ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Offering Innovator in Electronics – 47C-29-C www.murata.com
Size TC WV Cap Cap Tol Murata Global P/N 0805 C0G 250V 0.5pF +/-0.1pF ERB21B5C2ER50BDX1L 0805 C0G 250V 0.5pF +/-0.25pF ERB21B5C2ER50CDX1L 0805 C0G 250V 0.75pF +/-0.1pF ERB21B5C2ER75BDX1L 0805 C0G 250V 0.75pF +/-0.25pF ERB21B5C2ER75CDX1L 0805 C0G 250V 1pF +/-0.1pF ERB21B5C2E1R0BDX1L 0805 C0G 250V 1pF +/-0.25pF ERB21B5C2E1R0CDX1L 0805 C0G 250V 1.1pF +/-0.1pF ERB21B5C2E1R1BDX1L 0805 C0G 250V 1.2pF +/-0.1pF ERB21B5C2E1R2BDX1L 0805 C0G 250V 1.3pF +/-0.1pF ERB21B5C2E1R3BDX1L 0805 C0G 250V 1.5pF +/-0.1pF ERB21B5C2E1R5BDX1L 0805 C0G 250V 1.5pF +/-0.25pF ERB21B5C2E1R5CDX1L 0805 C0G 250V 1.6pF +/-0.1pF ERB21B5C2E1R6BDX1L 0805 C0G 250V 1.8pF +/-0.1pF ERB21B5C2E1R8BDX1L 0805 C0G 250V 2pF +/-0.1pF ERB21B5C2E2R0BDX1L 0805 C0G 250V 2pF +/-0.25pF ERB21B5C2E2R0CDX1L 0805 C0G 250V 2.2pF +/-0.1pF ERB21B5C2E2R2BDX1L 0805 C0G 250V 2.4pF +/-0.1pF ERB21B5C2E2R4BDX1L 0805 C0G 250V 2.7pF +/-0.1pF ERB21B5C2E2R7BDX1L 0805 C0G 250V 3pF +/-0.1pF ERB21B5C2E3R0BDX1L 0805 C0G 250V 3pF +/-0.25pF ERB21B5C2E3R0CDX1L 0805 C0G 250V 3.3pF +/-0.1pF ERB21B5C2E3R3BDX1L 0805 C0G 250V 3.6pF +/-0.1pF ERB21B5C2E3R6BDX1L 0805 C0G 250V 3.9pF +/-0.1pF ERB21B5C2E3R9BDX1L 0805 C0G 250V 4pF +/-0.1pF ERB21B5C2E4R0BDX1L 0805 C0G 250V 4pF +/-0.25pF ERB21B5C2E4R0CDX1L 0805 C0G 250V 4.3pF +/-0.1pF ERB21B5C2E4R3BDX1L 0805 C0G 250V 4.7pF +/-0.1pF ERB21B5C2E4R7BDX1L 0805 C0G 250V 5pF +/-0.1pF ERB21B5C2E5R0BDX1L 0805 C0G 250V 5pF +/-0.25pF ERB21B5C2E5R0CDX1L 0805 C0G 250V 5.1pF +/-0.25pF ERB21B5C2E5R1CDX1L 0805 C0G 250V 5.6pF +/-0.25pF ERB21B5C2E5R6CDX1L 0805 C0G 250V 6pF +/-0.25pF ERB21B5C2E6R0CDX1L 0805 C0G 250V 6pF +/-0.5pF ERB21B5C2E6R0DDX1L 0805 C0G 250V 6.2pF +/-0.25pF ERB21B5C2E6R2CDX1L 0805 C0G 250V 6.8pF +/-0.25pF ERB21B5C2E6R8CDX1L 0805 C0G 250V 7pF +/-0.25pF ERB21B5C2E7R0CDX1L 0805 C0G 250V 7pF +/-0.5pF ERB21B5C2E7R0DDX1L 0805 C0G 250V 7.5pF +/-0.25pF ERB21B5C2E7R5CDX1L High Frequency ERB Series (0805 / C0G)ERB21 Series ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Offering 48 – Innovator in Electronics C-29-C www.murata.com
Size TC WV Cap Cap Tol Murata Global P/N 0805 C0G 250V 8pF +/-0.25pF ERB21B5C2E8R0CDX1L 0805 C0G 250V 8pF +/-0.5pF ERB21B5C2E8R0DDX1L 0805 C0G 250V 8.2pF +/-0.25pF ERB21B5C2E8R2CDX1L 0805 C0G 250V 9pF +/-0.25pF ERB21B5C2E9R0CDX1L 0805 C0G 250V 9pF +/-0.5pF ERB21B5C2E9R0DDX1L
0805 C0G 250V 10pF +/-2% ERB21B5C2E100GDX1L
0805 C0G 250V 10pF +/-5% ERB21B5C2E100JDX1L
0805 C0G 250V 12pF +/-2% ERB21B5C2E120GDX1L
0805 C0G 250V 12pF +/-5% ERB21B5C2E120JDX1L
0805 C0G 250V 15pF +/-2% ERB21B5C2E150GDX1L
0805 C0G 250V 15pF +/-5% ERB21B5C2E150JDX1L
0805 C0G 250V 18pF +/-2% ERB21B5C2E180GDX1L
0805 C0G 250V 18pF +/-5% ERB21B5C2E180JDX1L
0805 C0G 250V 22pF +/-2% ERB21B5C2E220GDX1L
0805 C0G 250V 22pF +/-5% ERB21B5C2E220JDX1L
0805 C0G 250V 27pF +/-2% ERB21B5C2E270GDX1L
0805 C0G 250V 27pF +/-5% ERB21B5C2E270JDX1L
0805 C0G 250V 33pF +/-2% ERB21B5C2E330GDX1L
0805 C0G 250V 33pF +/-5% ERB21B5C2E330JDX1L
0805 C0G 250V 39pF +/-2% ERB21B5C2E390GDX1L
0805 C0G 250V 39pF +/-5% ERB21B5C2E390JDX1L
0805 C0G 250V 47pF +/-2% ERB21B5C2E470GDX1L
0805 C0G 250V 47pF +/-5% ERB21B5C2E470JDX1L
0805 C0G 250V 56pF +/-2% ERB21B5C2E560GDX1L
0805 C0G 250V 56pF +/-5% ERB21B5C2E560JDX1L
0805 C0G 250V 68pF +/-2% ERB21B5C2E680GDX1L
0805 C0G 250V 68pF +/-5% ERB21B5C2E680JDX1L
0805 C0G 250V 82pF +/-2% ERB21B5C2E820GDX1L
0805 C0G 250V 82pF +/-5% ERB21B5C2E820JDX1L
0805 C0G 250V 100pF +/-2% ERB21B5C2E101GDX1L
0805 C0G 250V 100pF +/-5% ERB21B5C2E101JDX1L
0805 C0G 100V 120pF +/-2% ERB21B5C2A121GDX1L
0805 C0G 100V 120pF +/-5% ERB21B5C2A121JDX1L
0805 C0G 50V 150pF +/-2% ERB21B5C1H151GDX1L
0805 C0G 50V 150pF +/-5% ERB21B5C1H151JDX1L
High Frequency ERB Series (0805 / C0G)ERB21 Series ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Offering Innovator in Electronics – 49C-29-C www.murata.com
Size TC WV Cap Cap Tol Murata Global P/N 1210 C0G 500V 0.5pF +/-0.1pF ERB32Q5C2HR50BDX1L 1210 C0G 500V 0.75pF +/-0.1pF ERB32Q5C2HR75BDX1L 1210 C0G 500V 1pF +/-0.1pF ERB32Q5C2H1R0BDX1L 1210 C0G 500V 1.1pF +/-0.1pF ERB32Q5C2H1R1BDX1L 1210 C0G 500V 1.2pF +/-0.1pF ERB32Q5C2H1R2BDX1L 1210 C0G 500V 1.3pF +/-0.1pF ERB32Q5C2H1R3BDX1L 1210 C0G 500V 1.5pF +/-0.1pF ERB32Q5C2H1R5BDX1L 1210 C0G 500V 1.6pF +/-0.1pF ERB32Q5C2H1R6BDX1L 1210 C0G 500V 1.8pF +/-0.1pF ERB32Q5C2H1R8BDX1L 1210 C0G 500V 2pF +/-0.1pF ERB32Q5C2H2R0BDX1L 1210 C0G 500V 2.2pF +/-0.1pF ERB32Q5C2H2R2BDX1L 1210 C0G 500V 2.4pF +/-0.1pF ERB32Q5C2H2R4BDX1L 1210 C0G 500V 2.7pF +/-0.1pF ERB32Q5C2H2R7BDX1L 1210 C0G 500V 3pF +/-0.1pF ERB32Q5C2H3R0BDX1L 1210 C0G 500V 3.3pF +/-0.1pF ERB32Q5C2H3R3BDX1L 1210 C0G 500V 3.6pF +/-0.1pF ERB32Q5C2H3R6BDX1L 1210 C0G 500V 3.9pF +/-0.1pF ERB32Q5C2H3R9BDX1L 1210 C0G 500V 4pF +/-0.1pF ERB32Q5C2H4R0BDX1L 1210 C0G 500V 4.3pF +/-0.1pF ERB32Q5C2H4R3BDX1L 1210 C0G 500V 4.7pF +/-0.1pF ERB32Q5C2H4R7BDX1L 1210 C0G 500V 5pF +/-0.1pF ERB32Q5C2H5R0BDX1L 1210 C0G 500V 5.1pF +/-0.25pF ERB32Q5C2H5R1CDX1L 1210 C0G 500V 5.6pF +/-0.25pF ERB32Q5C2H5R6CDX1L 1210 C0G 500V 6pF +/-0.25pF ERB32Q5C2H6R0CDX1L 1210 C0G 500V 6.2pF +/-0.25pF ERB32Q5C2H6R2CDX1L 1210 C0G 500V 6.8pF +/-0.25pF ERB32Q5C2H6R8CDX1L 1210 C0G 500V 7pF +/-0.25pF ERB32Q5C2H7R0CDX1L 1210 C0G 500V 7.5pF +/-0.25pF ERB32Q5C2H7R5CDX1L 1210 C0G 500V 8pF +/-0.25pF ERB32Q5C2H8R0CDX1L High Frequency ERB Series (01210 / C0G)ERB32 Series ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Offering 50 – Innovator in Electronics C-29-C www.murata.com
Size TC WV Cap Cap Tol Murata Global P/N 1210 C0G 500V 8.2pF +/-0.25pF ERB32Q5C2H8R2CDX1L 1210 C0G 500V 9pF +/-0.25pF ERB32Q5C2H9R0CDX1L 1210 C0G 500V 9.1pF +/-0.25pF ERB32Q5C2H9R1CDX1L
1210 C0G 500V 10pF +/-5% ERB32Q5C2H100JDX1L
1210 C0G 500V 12pF +/-5% ERB32Q5C2H120JDX1L
1210 C0G 500V 15pF +/-5% ERB32Q5C2H150JDX1L
1210 C0G 500V 18pF +/-5% ERB32Q5C2H180JDX1L
1210 C0G 500V 20pF +/-5% ERB32Q5C2H200JDX1L
1210 C0G 500V 22pF +/-5% ERB32Q5C2H220JDX1L
1210 C0G 500V 27pF +/-5% ERB32Q5C2H270JDX1L
1210 C0G 500V 33pF +/-5% ERB32Q5C2H330JDX1L
1210 C0G 500V 39pF +/-5% ERB32Q5C2H390JDX1L
1210 C0G 500V 47pF +/-5% ERB32Q5C2H470JDX1L
1210 C0G 500V 56pF +/-5% ERB32Q5C2H560JDX1L
1210 C0G 500V 68pF +/-5% ERB32Q5C2H680JDX1L
1210 C0G 500V 82pF +/-5% ERB32Q5C2H820JDX1L
1210 C0G 500V 100pF +/-5% ERB32Q5C2H101JDX1L
1210 C0G 500V 120pF +/-5% ERB32Q5C2H121JDX1L
1210 C0G 300V 150pF +/-5% ERB32Q5CYD151JDX1L
1210 C0G 250V 180pF +/-5% ERB32Q5C2E181JDX1L
1210 C0G 250V 220pF +/-5% ERB32Q5C2E221JDX1L
1210 C0G 100V 270pF +/-5% ERB32Q5C2A271JDX1L
1210 C0G 100V 330pF +/-5% ERB32Q5C2A331JDX1L
1210 C0G 100V 390pF +/-5% ERB32Q5C2A391JDX1L
1210 C0G 100V 470pF +/-5% ERB32Q5C2A471JDX1L
1210 C0G 50V 560pF +/-5% ERB32Q5C1H561JDX1L
1210 C0G 50V 680pF +/-5% ERB32Q5C1H681JDX1L
1210 C0G 50V 820pF +/-5% ERB32Q5C1H821JDX1L
1210 C0G 50V 1000pF +/-5% ERB32Q5C1H102JDX1L
High Frequency ERB Series (1210 / C0G)ERB32 Series ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Product Offering Innovator in Electronics – 51C-29-C www.murata.com
Specifications and Test Methods ERB Series Item Specifications Test Method Operating Temperature ᧩55°C to 125°C Reference Temperature: 25ഒ Appearance No defects or abnormalities. Visual inspection. Dimension Within the specified dimensions. Using calipers. Dielectric Strength No defects or abnormalities. 300%* of the rated voltage *250V/300V: 250%, 500V: 200% Insulation Resistance 1,000,000Mȍmin.(Cู470pF) 100,000 Mȍmin. (C᧺470pF) C: Nominal capacitance (pF) DC voltage not exceeding the rated voltage at 25°C and 75%RH max. and within 2 minutes of charging. Q Cู220pF: Qฺ10,000 Frequency 1±0.1MHz 220pF᧸Cู470pF: Qฺ5,000 Voltage 1±0.2Vrms 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) Adhesive Strength of Termination No removal of the terminations or other defect should occur. Solder the capacitor to the test jig (glass epoxy board) then apply 10N force in parallel with the test jig for 10±1sec. Vibration Resistance Appearance: No defects or abnormalities. Capacitance: Within the specified tolerance. Cู220pF: Qฺ10,000 220pF᧸Cู470pF: Qฺ5,000 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) Frequency range, from 10 to 55Hz and return to 10Hz, should be traversed in approximately 1 minute. This motion should be applied for a period of 2 hours in each of 3 mutually perpendicular directions total of 6 hours). Deflection No crack or marked defect should occur. Flexure: 1mm Solderability of Termination 95% of the terminations are to be soldered evenly and continuously. Immerse in eutectic solder solution for 5±0.5 seconds at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for 5±0.5 seconds at 245±5°C. Resistance to Soldering Heat Appearance: No marking defects Capacitance Change: Within ±2.5% or ±0.25 pF (Whichever is larger) Cู220pF: Qฺ10,000 220pF᧸Cู470pF: Qฺ5,000 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) Immerse the capacitor in a eutectic solder solution or Sn-3.0Ag-0.5Cu solder solution at 270±5°C for 10±0.5 seconds. Let sit at room temperature for 24±2 hours. Temperature Cycle Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5 pF (Whichever is larger) Cู220pF: Qฺ10,000 220pF᧸Cู470pF: Qฺ5,000 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) ᧩55ഒ to 125ഒ Five cycles Humidity Steady State Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5pF (Whichever is larger) Cู30pF: Qฺ350 10pFูC<30pF: Qฺ275+ 5°C/2°C᧸10pF: Qฺ200+10C C: Nominal capacitance (pF) Apply the 24-hour heat (-10 to +65ഒ) and humidity (80 to 100%) treatment, 10 consecutive times. High Temperature Load Appearance: No marking defects Capacitance Change: Within ±3% or ±0.3pF (Whichever is larger) Cู30pF: Qฺ350 10pFูC<30pF: Qฺ275+5°C/2°C ᧸10pF: Qฺ200+10°C C: Nominal capacitance (pF) Apply 200% (500V only 150%) of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. Specifications and Test Methods ERB Series Item Specifications Test Method Operating Temperature ᧩55°C to 125°C Reference Temperature: 25ഒ Appearance No defects or abnormalities. Visual inspection. Dimension Within the specified dimensions. Using calipers. Dielectric Strength No defects or abnormalities. 300%* of the rated voltage *250V/300V: 250%, 500V: 200% Insulation Resistance 1,000,000Mȍmin.(Cู470pF) 100,000 Mȍmin. (C᧺470pF) C: Nominal capacitance (pF) DC voltage not exceeding the rated voltage at 25°C and 75%RH max. and within 2 minutes of charging. Q Cู220pF: Qฺ10,000 Frequency 1±0.1MHz 220pF᧸Cู470pF: Qฺ5,000 Voltage 1±0.2Vrms 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) Adhesive Strength of Termination No removal of the terminations or other defect should occur. Solder the capacitor to the test jig (glass epoxy board) then apply 10N force in parallel with the test jig for 10±1sec. Vibration Resistance Appearance: No defects or abnormalities. Capacitance: Within the specified tolerance. Cู220pF: Qฺ10,000 220pF᧸Cู470pF: Qฺ5,000 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) Frequency range, from 10 to 55Hz and return to 10Hz, should be traversed in approximately 1 minute. This motion should be applied for a period of 2 hours in each of 3 mutually perpendicular directions total of 6 hours). Deflection No crack or marked defect should occur. Flexure: 1mm Solderability of Termination 95% of the terminations are to be soldered evenly and continuously. Immerse in eutectic solder solution for 5±0.5 seconds at 245±5°C or Sn-3.0Ag-0.5Cu solder solution for 5±0.5 seconds at 245±5°C. Resistance to Soldering Heat Appearance: No marking defects Capacitance Change: Within ±2.5% or ±0.25 pF (Whichever is larger) Cู220pF: Qฺ10,000 220pF᧸Cู470pF: Qฺ5,000 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) Immerse the capacitor in a eutectic solder solution or Sn-3.0Ag-0.5Cu solder solution at 270±5°C for 10±0.5 seconds. Let sit at room temperature for 24±2 hours. Temperature Cycle Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5 pF (Whichever is larger) Cู220pF: Qฺ10,000 220pF᧸Cู470pF: Qฺ5,000 470pF᧸Cู1000pF: Qฺ3,000 C: Nominal capacitance (pF) ᧩55ഒ to 125ഒ Five cycles Humidity Steady State Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5pF (Whichever is larger) Cู30pF: Qฺ350 10pFูC<30pF: Qฺ275+ 5°C/2°C᧸10pF: Qฺ200+10C C: Nominal capacitance (pF) Apply the 24-hour heat (-10 to +65ഒ) and humidity (80 to 100%) treatment, 10 consecutive times. High Temperature Load Appearance: No marking defects Capacitance Change: Within ±3% or ±0.3pF (Whichever is larger) Cู30pF: Qฺ350 10pFูC<30pF: Qฺ275+5°C/2°C ᧸10pF: Qฺ200+10°C C: Nominal capacitance (pF) Apply 200% (500V only 150%) of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. Specifications and Test Methods The temperature coefficient is determined using the capacitance measured in step 3 as a reference. When cycling the temperature sequentially from step 1 through 5 the capacitance should be within the specified tolerance for the temperature coefficient and capacitance change as in Table A-1. The capacitance drift is calculated by dividing the differences between the maximum and minimum measured values in steps 1, 3 and 5 by the cap. value in step 3. Capacitance Change: Within the specified tolerance. (Table A-1) Temperature Coefficent: Within the specified tolerance. (Table A-1) Capacitance Drift: Within ±0.2% or ±0.5pF (Whichever is larger) Capacitance Temperature Characteristics Step Temperature (°C) 1 25±2 2 -55±3 3 25±2 4 125±3 5 25±2 ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Specifications and T est Methods 52 – Innovator in Electronics C-29-C www.murata.com
Specifications and Test Methods ERB Series Item Specification Test Method Humidity Steady State Appearance: No marking defects Capacitance Change: Within ±5% or ±0.5 pF (Whichever is larger) C30pF: Q >350, 10pFC 30pF: Q>275+5°C/2C 10pF:Q >200+10C C: Nominal Capacitance (puff) Apply the 24-hour heat (-10 to +65°C) and humidity (80 to 100%) treatment, 10 consecutive times. High Temperature Load Appearance: No marking defects Capacitance Change Within ±3% or ±0.3pF (Whichever is larger) C30pFmin.: Q> 350 10pFC 30pF: Q >275+5C/2C 10pF: Q >200+10C ɹɹ C: Nominal Capacitance (pF) Apply 200% (500V only 150%) of the rated voltage for 1000±12 hours at the maximum operating temperature ±3°C. Table A-1 Capacitance Change from 25°Cʢ%ʣ Note: Nominal values denote the temperature coefficient within a range of 25°C to 125°C. ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Specifications and T est Methods Innovator in Electronics – 53C-29-C www.murata.com
-2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 -75 -50 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) CAPACITANCE CHANGE (%) CERAMIC HIQ CAPACITOR Technical Data (Typical) Capacitance – Temperature Characteristics Spec. (upper) Spec. (lower) C0G Characteristics (ERB) High Frequency Type ERB Series Self Resonant Frequency - Capacitance 10G 001011 CAPACITANCE (pF) RESONANT FREQUENCY (Hz) ERB Series 100M Resonant Frequency Characteristics Capacitance - T emperature Characteristics Measurement Equipment HP8753D ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB T echnical Data (Typical) 54 – Innovator in Electronics C-29-C www.murata.com
ESR - Frequency Characteristics CERAMIC HIQ CAPACITOR Technical Data (Typical) 0 .0 1 0 .1 1 0 1 0 0 M 100 0 M 1 0 000 M F R E Q U E N C Y (H z ) ESR (ohm) 1p F 10 p F 10 0 p F
1 G 1 0 G
0 .0 1 0 .1 1 0 1 0 0 M 100 0 M 1 0 000 M F R E Q U E N C Y (H z ) ESR (ohm) 1p F 10 p F 10 0 p F 0 .0 1 0 .1 1 0 1 0 0 M 100 0 M 1 0 000 M F R E Q U E N C Y (H z ) ESR (ohm) 3 .3 p F 10 p F 10 0 p F ERB ESR-FrequencyCharacteristics Measurement Equipment Boontoon Resonant Coaxial Line 34A ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB T echnical Data (Typical) Innovator in Electronics – 55C-29-C www.murata.com
Q - Frequency Characteristics 100 1000 10000 Q FREQUENCY (Hz) 1G 10G100M 100 1000 10000 Q FREQUENCY (Hz) 1G 10G100M ERB18 Series ERB21 Series ERB32 Series 100 1000 10000 FREQUENCY (Hz) Q 1G 10G100M Equipment Measurement Boonton Resonant Coaxial-Line 34A CERAMIC HIQ CAPACITOR Technical Data (Typical) Q - Frequency Characteristics 1pF 10pF 100pF 1pF 10pF 100pF 3.3pF 10pF 100pF ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB T echnical Data (Typical) 56 – Innovator in Electronics C-29-C www.murata.com
CERAMIC HIQ CAPACITOR Technical Data (Typical) ERB Temperature Rise - Current Characteristics ERB18 Series (1GHz) CURRENT (Arms) TEMP. RISE (°C) 2.4pF 10pF 82pF ERB Temperature Rise-CurrentCharacteristics T emperature Rise - Current Characteristics ERB21 Series (1GHz) CURRENT (Arms) Temp. Rise ( ) 2.4pF 10pF 82pF ERB21 Series (1GHz) CURRENT (Arms) TEMP. RISE (°C) ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB T echnical Data (Typical) Innovator in Electronics – 57C-29-C www.murata.com
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. 1. Mounting Position Locate chip horizontal to the direction in which stress acts Chip arrangement Worst A-C-(B~D) Best Component Direction Chip Mounting Close to Board Separation Point A B D CPerforation Slit Continued on the following page. 2. Chip Placing An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. So adjust the suction nozzle's bottom dead point by correcting warp in the board. Normally, the suction nozzle's bottom dead point must be set on the upper surface of the board. Nozzle pressure for chip mounting must be a 1 to 3N static load. Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent the nozzle from moving smoothly. This imposes great force on the chip during mounting, causing cracked chips. And the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained, checked and replaced periodically. Board GuideCorrect Suction Nozzle Board Support Pin Incorrect Deflection /uni25A0 !Caution(Soldering and Mounting) !Caution !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
- This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, itís specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. !Note C02E.pdf 07.2.6 ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Soldering and Mounting 58 – Innovator in Electronics C-29-C www.murata.com
- Reflow Soldering When sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 1. It is required to keep temperature differential between the soldering and the components surface ($T) as small as possible. Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. When components are immersed in solvent after mounting, be sure to maintain the temperature difference ($T) between the component and solvent within the range shown in the Table 1. GRM02/03/15/18/21/31 GJM03/15 LLL15/18/21/31 ERB18/21 GQM18/21 GRM32/43/55 LLA18/21/31 LLM21/31 GNM ERB32 $T-190% $T-130% Part Number Temperature Differential Table 1 Recommended Conditions Standard Conditions for Reflow Soldering Allowable Soldering Temperature and Time In case of repeated soldering, the accumulated soldering time must be within the range shown above. Soldering Time (sec.) 260 270 280 250 240 230 220 0 30 60 90 120 Soldering Temperature (%) Inverting the PCB Make sure not to impose an abnormal mechanical shock on the PCB. Continued from the preceding page. Continued on the following page. Peak Temperature Atmosphere Pb-Sn Solder Infrared Reflow 230-250oC Air Vapor Reflow 230-240oC Air Lead Free Solder 240-260oC Air or N2 Infrared Reflow Vapor Reflow 60-120 seconds 30-60 seconds Gradual Cooling Soldering Preheating 200oC 170oC 150oC 130oC Time Temperature (%) Peak Temperature 60-120 seconds 20 seconds max. Gradual Cooling Soldering Preheating 170oC 150oC 130oC Time Temperature (%) Peak Temperature Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu Optimum Solder Amount for Reflow Soldering Overly thick application of solder paste results in excessive fillet height solder. This makes the chip more susceptible to mechanical and thermal stress on the board and may cause cracked chips. Too little solder paste results in a lack of adhesive strength on the outer electrode, which may result in chips breaking loose from the PCB. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min. Optimum Solder Amount for Reflow Soldering 0.2mm min. Caution Note • Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
- This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
- This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
- This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. Note C02E.pdf 07.2.6 ERB18/21 ERB32 ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Soldering and Mounting Innovator in Electronics – 59C-29-C www.murata.com
Optimum Solder Amount for Flow Soldering The top of the solder fillet should be lower than the thickness of components. If the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. 5. Flow Soldering When sudden heat is applied to the components, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. And an excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion or a reduction in capacitance value due to loss of contact between electrodes and end termination. In order to prevent mechanical damage in the components, preheating shoud be required for the both components and the PCB board. Preheating conditions are shown in Table 2. It is required to keep temperature differential between the soldering and the components surface ($T) as small as possible. When components are immersed in solvent after mounting, be sure to maintain the temperature difference between the component and solvent within the range shown in Table 2. Do not apply flow soldering to chips not listed in Table 2. GRM18/21/31 LLL21/31 ERB18/21 GQM18/21 $T-150% Part Number Temperature Differential Table 2 Standard Conditions for Flow Soldering Allowable Soldering Temperature and Time In case of repeated soldering, the accumulated soldering time must be within the range shown above. Soldering Time (sec.) 260 270 280 250 240 230 220 0 10 20 30 40 Soldering Temperature (%) Up to Chip Thickness Adhesive Continued from the preceding page. Continued on the following page. Recommended Conditions Peak Temperature Atmosphere Pb-Sn Solder 240-250oC Air Lead Free Solder 250-260oC 60-120 seconds 5 seconds max. Gradual Cooling Soldering Preheating 170oC 150oC 130oC Time Temperature (%) Peak Temperature Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu 4. Leaded Component Insertion If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted, chips may crack and solder joints may break. Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping. Caution Note • Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
- This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
- This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
- This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. Note C02E.pdf 07.2.6 ERB18/21 ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Soldering and Mounting 60 – Innovator in Electronics C-29-C www.murata.com
Optimum Solder Amount when Corrections Are Made Using a Soldering lron The top of the solder fillet should be lower than the thickness of components. If the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. Soldering iron ø3mm or smaller should be required. And it is necessary to keep a distance between the soldering iron and the components without direct touch. Thread solder with ø0.5mm or smaller is required for soldering. Up to Chip Thickness 6. Correction with a Soldering Iron (1) For Chip Type Capacitors When sudden heat is applied to the components by soldering iron, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 3. It is required to keep temperature differential between the soldering and the components surface (∆T) as small as possible. After soldering, it is not allowed to cool it down rapidly. GRM15/18/21/31 GJM15 LLL15/18/21/31 GQM18/21 ERB18/21 GRM32/43/55 GNM LLA18/21/31 LLM21/31 ERB32 ∆TV190D ∆TV130D Part Number Temperature Differential Table 3 Continued from the preceding page. 7. Washing Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or broken solder. Take note not to vibrate PCBs. FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY RESULT, WORST CASE, IN A SHORT CIRCUIT AND FUMING WHEN THE PRODUCT IS USED. 300°C max. 3 seconds max. / termination 270°C max. 3 seconds max. / termination Peak Temperature Air Air Atmosphere *Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu !Caution !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
- This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, itís specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. !Note C02E.pdf 07.2.6 ERB18/21 ERB32 Optimum Solder Amount when Corrections Are Made Using a Soldering lron The top of the solder fillet should be lower than the thickness of components. If the solder amount is excessively big, the risk of cracking is higher during board bending or under any other stressful conditions. Soldering iron ø3mm or smaller should be required. And it is necessary to keep a distance between the soldering iron and the components without direct touch. Thread solder with ø0.5mm or smaller is required for soldering. Up to Chip Thickness 6. Correction with a Soldering Iron (1) For Chip Type Capacitors When sudden heat is applied to the components by soldering iron, the mechanical strength of the components should go down because remarkable temperature change causes deformity inside components. In order to prevent mechanical damage in the components, preheating should be required for both of the components and the PCB board. Preheating conditions are shown in Table 2. It is required to keep temperature differential between the soldering and the components surface (∆T) as small as possible. After soldering, it is not allowed to cool it down rapidly. GRM15/18/21/31 GJM15 LLL15/18/21/31 GQM18/21 ERB18/21 GRM32/43/55 GNM LLA18/21/31 LLM21/31 ERB32 ∆TV190D ∆TV130D Part Number Temperature Differential Table 2 7. Washing Excessive output of ultrasonic oscillation during cleaning causes PCBs to resonate, resulting in cracked chips or broken solder. Take note not to vibrate PCBs. FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY RESULT, WORST CASE, IN A SHORT CIRCUIT AND FUMING WHEN THE PRODUCT IS USED. 300°C max. 3 seconds max. / termination 270°C max. 3 seconds max. / termination Peak Temperature Air Air Atmosphere *Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu !Caution !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
- This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. ï This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, itís specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. !Note C02E.pdf 07.2.6 ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Soldering and Mounting Innovator in Electronics – 61C-29-C www.murata.com
N Miniature sizes & stable C0G temperature coefficient N Very high Q at high frequencies N 0603, 0805 and 1210 sizes N Low Power Consumption for Mobile Telecommunication N Base Station, Terminal applications, Wireless equipment and High frequency radio N Miniature sizes & stable C0G temperature coefficient N Very high Q at high frequencies N 0603, 0805 and 1210 sizes N Low Power Consumption for Mobile Telecommunication N Base Station, Terminal applications, Wireless equipment and High frequency radio No. Description M urata Global P/N Q ty. 1 0603/COG/1.0pF/250V ERB1885C2E1R0BDX1 10 2 0603/COG/1.1pF/250V ERB1885C2E1R1BDX1 10 3 0603/COG/1.2pF/250V ERB1885C2E1R2BDX1 10 4 0603/COG/1.3pF/250V ERB1885C2E1R3BDX1 10 5 0603/COG/1.5pF/250V ERB1885C2E1R5BDX1 10 6 0603/COG/1.6pF/250V ERB1885C2E1R6BDX1 10 7 0603/COG/1.8pF/250V ERB1885C2E1R8BDX1 10 8 0603/COG/2.0pF/250V ERB1885C2E2R0BDX1 10 9 0603/COG/2.4pF/250V ERB1885C2E2R4BDX1 10 10 0603/COG/2.7pF/250V ERB1885C2E2R7BDX1 10 11 0603/COG/3.0pF/250V ERB1885C2E3R0CDX1 10 12 0603/COG/3.3pF/250V ERB1885C2E3R3CDX1 10 13 0603/COG/3.6pF/250V ERB1885C2E3R6CDX1 10 14 0603/COG/3.9pF/250V ERB1885C2E3R9CDX1 10 15 0603/COG/4.3pF/250V ERB1885C2E4R3CDX1 10 16 0603/COG/4.7pF/250V ERB1885C2E4R7CDX1 10 17 0603/COG/5.1pF/250V ERB1885C2E5R1CDX1 10 18 0603/COG/5.6pF/250V ERB1885C2E5R6CDX1 10 19 0603/COG/6.2pF/250V ERB1885C2E6R2CDX1 10 20 0603/COG/6.8pF/250V ERB1885C2E6R8CDX1 10 21 0603/COG/7.5pF/250V ERB1885C2E7R5CDX5 10 22 0603/COG/8.2pF/250V ERB1885C2E8R2CDX5 10 23 0603/COG/9.1pF/250V ERB1885C2E9R1CDX5 10 24 0603/COG/10pF/250V ERB1885C2E100JDX5 10 25 0603/COG/12pF/250V ERB1885C2E120JDX5 10 26 0603/COG/15pF/250V ERB1885C2E150JDX5 10 27 0603/COG/18pF/250V ERB1885C2E180JDX5 10 28 0603/COG/22pF/250V ERB1885C2E220JDX5 10 29 0603/COG/27pF/250V ERB1885C2E270JDX5 10 30 0603/COG/33pF/250V ERB 1885C2E330JDX5 10 31 0603/COG/39pF/250V ERB1885C2E390JDX5 10 32 0603/COG/47pF/250V ERB1885C2E470JDX5 10 33 0603/COG/56pF/250V ERB1885C2E560JDX5 10 34 0603/COG/68pF/250V ERB1885C2E680JDX5 10 35 0603/COG/82pF/250V ERB1885C2E820JDX5 10 36 0603/COG/100pF/250V ERB1885C2E101JDX5 10 ERB18-HIQ0603KIT-E 0603 - (250 VDC) No. Description M urata Global P/N Qty. 1 0805/COG/1.2pF/250V ERB21 B5C2E1R2CDX1 10 2 0805/COG/1.5pF/250V ERB21 B5C2E1R5CDX1 10 3 0805/COG/1.8pF/250V ERB21 B5C2E1R8CDX1 10 4 0805/COG/2.2pF/250V ERB21B5C2E2R2CDX1 10 5 0805/COG/2.7pF/250V ERB21B5C2E2R7CDX1 10 6 0805/COG/3.3pF/250V ERB21B5C2E3R3CDX1 10 7 0805/COG/3.9pF/250V ERB21B5C2E3R9CDX1 10 8 0805/COG/4.7pF/250V ERB21B5C2E4R7CDX1 10 9 0805/COG/5.6pF/250V ERB21B5C2E5R6DDX1 10 10 0805/COG/6.8pF/250V ERB21B5C2E6R8DDX1 10 11 0805/COG/8.2pF/250V ERB82185C2E8R2DDX1 10 12 0805/COG/10pF/250V ERB21B5C2E100JDX1 10 13 0805/COG/12pF/250V ERB21B5C2E120JDX1 10 14 0805/COG/15pF/250V ERB21B5C2E150JDX1 10 15 0805/COG/18pF/250V ERB21B5C2E180JDX1 10 16 0805/COG/22pF/250V ERB21B5C2E220JDX1 10 17 0805/COG/27pF/250V ERB21B5C2E270JDX1 10 18 0805/COG/33pF/250V ERB21B5C2E330JDX1 10 19 0805/COG/39pF/250V ERB21B5C2E390JDX1 10 20 0805/COG/47pF/250V ERB21B5C2E470JDX1 10 21 0805/COG/56pF/250V ERB21B5C2E560JDX1 10 22 0805/COG/68pF/250V ERB21B5C2E680JDX1 10 23 0805/COG/82pF/250V ERB21B5C2E820JDX1 10 24 0805/COG/100pF/250V ERB21B5C2E101JDX1 10 ERB21-HIQ0805KIT-E 0805 - (250VDC) No. Description M urata Global P/N Qty. 1 1210/C0G/3.3pF/500V ERB32Q5C2H3R3CDX1 10 2 1210/C0G/3.9pF/500V ERB32Q5C2H3R9CDX1 10 3 1210/C0G/4.7pF/500V ERB32Q5C2H4R7CDX1 10 4 1210/C0G/5.6pF/500V ERB32Q5C2H5R6DDX1 10 5 1210/C0G/6.8pF/500V ERB32Q5C2H6R8DDX1 10 6 1210/C0G/8.2pF/500V ERB32Q5C2H8R2DDX1 10 7 1210/C0G/10pF/500V ERB32Q5C2H100JDX1 10 8 1210/C0G/12pF/500V ERB32Q5C2H120JDX1 10 9 1210/C0G/15pF/500V ERB32Q5C2H150JDX1 10 10 1210/C0G/18pF/500V ERB32Q5C2H180JDX1 10 11 1210/C0G/22pF/500V ERB32Q5C2H220JDX1 10 12 1210/C0G/27pF/500V ERB32Q5C2H270JDX1 10 13 1210/C0G/33pF/500V ERB32Q5C2H330JDX1 10 14 1210/C0G/39pF/500V ERB32Q5C2H390JDX1 10 15 1210/C0G/47pF/500V ERB32Q5C2H470JDX1 10 16 1210/C0G/56pF/500V ERB32Q5C2H560JDX1 10 17 1210/C0G/68pF/500V ERB32Q5C2H680JDX1 10 18 1210/C0G/82pF/500V ERB32Q5C2H820JDX1 10 19 1210/C0G/100pF/500V ERB32Q5C2H101JDX1 10 ERB32-HIQ1210KIT-E 1210 - (500VDC) ERB Series ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Design Engineering Kits 62 – Innovator in Electronics C-29-C www.murata.com
ApplicA tion SpEciFic cAp A citoRS High Frequency Ceramic Capacitors ERB Notes Innovator in Electronics – 63C-29-C www.murata.com