EPE6303S PCA | Alldatasheet

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Technical content

CSE6303Sa Rev. - 9/12/97 E L E C T R O N I C S I N C . Package Dimensions A B C D E F G H I J K L M N P Q Dim. Min. .460 .260 .225 Typ. .015 Typ. .375 .022 Typ. Typ. .045 Max. Nom. (Inches) (millimeters) 11.18 6.09 5.46 8.89 .127 1.27 8.76 .406 .254 1.27 .508 Min. 11.68 6.60 5.72 Typ. .381 Typ. 9.53 .559 Typ. Typ. 1.14 Max. Nom. .440 .240 .215 .350 .005 .050 .345 .016 .010 .050 .020 TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com PCA ELECTRONICS, INC

16799 SCHOENBORN ST

NORTH HILLS, CA 9134 Electrical Parameters @ 25° C Media Isolation Transformers

  • Optimized for Level One LXT901 IC •
  • For application requiring enhanced common mode attenuation •
  • Robust design allows for toughest soldering processes •
  • Small outline package on 0.050” pitch •
  • Complies with or exceeds IEEE 802.3, 10 Base-T Requirements • Schematic EPE6303S Cable Side Inductance (µH ±30%) @ 100 KHz,

0.1 Vrms

(pF Max.) 0.5 Leakage Inductance (µH Max.) 2000 Hipot (Vrms) DCR (Ω Max.) Xmit Rcv 0.6 Xmit Rcv 0.6 C E FH .030 .050 .070 .400 .762 1.27 1.78 10.16 1:1 Receive Cable Side Chip Side 2 Transmit 1: 2 Cable Side Chip Side 10 7 @ 100 KHz, @ 100 KHz, (dB Min.) 1-50 Mhz 100 Mhz 200 Mhz 300 Mhz -55 -45 -35 -25 Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Suggested Solder Pad Layout M N Q P PCA EPE6303S Date Code A B J D Pin 1 I.D. G K L I Product performance is limited to specified parameters. Data is subject to change without prior notice.