EP2W-D

EP2W-D MINI | Alldatasheet

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Power Splitter/Combiner Die Page 1 of 5 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits EP2W-D+ 2 Way-0° 50Ω 0.5 to 9.5 GHz The Big Deal

• Ultra-Wide Bandwidth, 0.5 to 9.5 GHz
• High Power Handling, 2.5W as a splitter Product Overview Mini-Circuits’ EP2W-D+ is a MMIC 2-way 0˚ splitter/combiner Die designed for wideband operation from 0.5 to 9.5 GHz supporting many applications requiring high performance across a wide frequency range includ- ing all the LTE bands through WiMax an WiFi, as well as instrumentation and more. This model provides excellent power handling up to 2.5W (as a splitter) with low insertion loss, good isolation, and low phase and amplitude unbalance. Manufactured using GaAs IPD technology, the EP2W-D+ provides a high level of ESD protection and excellent repeatability. Feature Advantages Wideband, 0.5 to 9.5 GHz One power splitter can be used in all the LTE bands through WiMAX and WiFi, saving component count. Also ideal for wideband applications such as military and instrumenta- tion. Excellent power handling
• 2.5W as a splitter
• 1.7W internal dissipation as a combiner In power combiner applications, half the power is dissipated internally. EP2W-D+ is designed to handle 1.7W internal dissipation as a combiner allowing reliable operation without excessive temperature rise. Similar splitters implemented as Wilkinson splitters on PCB require big resistors and additional heat sinking. As a splitter, EP2W-D+ can handle up to 2.5W. DC Passing DC current passing is helpful in applications where both RF & DC need to pass through the DUT, such as antenna mounted hardware. Unpackaged Die Enables user to integrate it directly into hybrids. Key Features

Power Splitter/Combiner Die Page 2 of 5 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits Product Features

• Wide bandwidth, 0.5 to 9.5 GHz
• Excellent amplitude unbalance, 0.1 dB typ. to 6 GHz
• Good phase unbalance, 1 to 3 deg. typ.
• DC passing
• High ESD level REV. OR M163099 EP2W-D+ MCL NY 171011 General Description Mini-Circuits’ EP2W-D+ is a MMIC 2-way 0˚ splitter/combiner Die designed for wideband operation from 0.5 to 9.5 GHz supporting many applications requiring high performance across a wide frequency range includ- ing all the LTE bands through WiMax an WiFi, as well as instrumentation and more. This model provides excellent power handling up to 2.5W (as a splitter) with low insertion loss, good isolation, and low phase and amplitude unbalance. Manufactured using GaAs IPD technology, the EP2W-D+ provides a high level of ESD protection and excellent repeatability. Typical Applications
• WIMAX
• ISM
• Instrumentation
• Radar
• WLAN
• Satellite communications
• LTE EP2W-D+ +RoHS Compliant The +Suffix identifies RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications Ordering Information: Refer to Last Page Pad# Function

1 SUM PORT (RF IN 1)

2 PORT 1 (RF OUT 1)

3 PORT 2 (RF OUT 2)

Simplified Schematic and Pad Description 2 Way-0° 50Ω 0.5 to 9.5 GHz Bonding Pad Position L1 L2 L3 Note: 1. Bond Pad material - Gold 2. Bottom of Die is ground - Gold plated Dimensions in µm, Typical L1 L2 L3 L4 W1 W2 H1 H2 Thickness Width Length Bond Pad Size, RF-IN Bond Pad Size, RF-OUT 112 3426 3550 3426 124 3426 1775 3550 200 3550 3550 150 x 175 175 x 175

MMIC Power Splitter/Combiner Die Page 3 of 5 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits EP2W-D+ Electrical Specifications at 25°C1 Parameter Frequency (GHz) Min. Typ. Max. Unit Frequency Range 0.5 9.5 GHz Insertion Loss, above 3.0 dB 0.5 - 1.5 — 1.0 — dB 1.5 - 3.0 — 1.3 — 3.0 - 6.0 — 1.8 — 6.0 - 9.5 — 3.4 — Isolation 0.5 - 1.5 — 9.3 — dB 1.5 - 3.0 — 19.8 — 3.0 - 6.0 — 19.4 — 6.0 - 9.5 — 10.2 — Phase Unbalance 0.5 - 1.5 — 0.5 — Degree 1.5 - 3.0 — 0.9 — 3.0 - 6.0 — 1.7 — 6.0 - 9.5 — 2.5 — Amplitude Unbalance 0.5 - 1.5 — 0.1 — dB 1.5 - 3.0 — 0.1 — 3.0 - 6.0 — 0.1 — 6.0 - 9.5 — 0.5 — VSWR (Port S) 0.5 - 1.5 — 1.6 — 1.5 - 3.0 — 1.5 — 3.0 - 6.0 — 1.6 — 6.0 - 9.5 — 1.7 — VSWR (Port 1-2) 0.5 - 1.5 — 1.3 — 1.5 - 3.0 — 1.3 — 3.0 - 6.0 — 1.4 — 6.0 - 9.5 — 1.5 — Maximum Ratings Parameter Ratings Operating Temperature -40°C to 85°C Power Input (as a splitter) 2.5W2 max. Internal Dissipation 1.75W3 max. DC Current 0.4A max 2. Derate linearly to 1.25W at 85°C 3. Derate linearly to 1.1W at 85°C Permanent damage may occur if any of these limits are exceeded. 1. Measured on Mini-Circuits Die Characterization Test Board. Die packaged in 5x5 mm, 32-lead MCLP package.

MMIC Power Splitter/Combiner Die Page 4 of 5 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits EP2W-D+ Assembly Diagram 1. Storage Dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. ESD MMIC dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter ESD damage to dice. 3. Die Attach The Die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet height and epoxy coverage around total Die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s cure condition. It is recommended to use antistatic Die pick up tools only. 4. Wire Bonding Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the Die to the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. Assembly and Handling Procedure

MMIC Power Splitter/Combiner Die Page 5 of 5 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits Additional Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp D. Mini-Circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an “As is” basis, with all faults. E. Purchasers of this part are solely responsible for proper storing, handling, assembly and processing of Known Good Dice (including, without limitation, proper ESD preventative measures, Die preparation, Die attach, wire bond ing and related assembly and test activities), and Mini-Circuits assumes no responsibility therefor or for environmental effects on Known Good Dice. F . Mini-Circuits and the Mini-Circuits logo are registered trademarks of Scientific Components Corporation d/b/a Mini- Circuits. All other third-party trademarks are the property of their respective owners. A reference to any third-party trademark does not constitute or imply any endorsement, affiliation, sponsorship, or recommendation by any such third-party of Mini-Circuits or its products. ESD Rating Human Body Model (HBM): Class 2 (2000V to <4000V) in accordance with ANSI/ESD STM 5.1 - 2001 Tested in industry standard, 5x5mm, 32-lead MCLP package. EP2W-D+ Performance Data Data Table Swept Graphs S-Parameter (S2P Files) Data Set with and without port extension(.zip file) Case Style Die Die Ordering and packaging information (Note 5) Quantity, Package Model No. Small, Gel - Pak: 5,10 Medium†, Partial wafer: 160 Max. Large†, Full wafer EP2W-DG+ EP2W-DP+ EP2W-DF+ †Available upon request contact sales representative Refer to AN-60-067 Environmental Ratings ENV-80 Additional Detailed Technical Information additional information is available on our dash board. 5. Dice taken from PCM good wafer. No RF or DC test performed.