EGS10B CHIPQUIK | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 1
Technical content
D a t a s h e e t r e v i s i o n 1 . 3 www.chipquik.com Electronics Grade Silicone Adhesive Sealant (Black) 10.2oz Cartridge Product Highlights Safe for use with Electronics Seals, Bonds, Encapsulates Resistant to Various Chemicals and Oils Non-Corrosive, Non-Conductive Flexible, Durable, Non-Degrading Withstands Moisture, Vibration, Abrasion Common Uses Protecting, Sealing and Insulating Corrosion Sensitive Electronic Components and Electrical Materials. OEM Commercial and Industrial Manufacturing for Flexible Permanent Bonding and Sealing. Instructions Surfaces should be clean and dry. For detached nozzle cartridge, cut the tip off of the cartridge just above the nozzle threads. Thread nozzle onto cartridge and cut the tip off of the nozzle to the required bead size. Dispense by pushing the silicone in the direction of the nozzle with a cartridge dispensing gun. If tooling is required, do so within the first 10 minutes after dispensing. Apply the silicone to surfaces and remove the excess silicone after tooling with a dry clean cloth. Allow the silicone to cure completely. At room temperature, 25°C (77°F), and 50% relative humidity, the silicone will skin in 10 minutes and fully cure in 24 hours (1/8" bead). The silicone will reach its maximum adhesion in 7 days. Higher humidity accelerates curing. Specifications Meets and Exceeds: ASTM C920 V O C : V O C C o m p l i a n t ( < 3 % ) , L o w O d o r Operating Temperature Range: - 57°C to +204°C (-70°F to +400°F) Curing Time: 10 min (skin), 24 hours (full cure), 7 days (max adhesion) Shore A Hardness: 30 +/-2 Tensile Strength (at Break): 250 +/- 25 psi Elongation (at Break): 400 +/- 25 % Tear Strength: 30 +/- 10 psi Shrinkage (Weight Loss): < 5 % Adhesion Strength (Peel): 8 +/- 2 psi (primed aluminum), 10 +/- 2 psi (glass), 12 +/- 2 psi (primed mortar) Joint Movement Capability: +/ - 25% (4:1 Safety Factor) Dielectric Strength: 460 V/mil (18 kV/mm) Dielectric Constant: 2.7 (a t 50 Hz, 1 kHz, and 1 MHz) Dissipation Factor: 0.0009 (a t 50 Hz), 0.0004 (at 1 kHz), 0.0002 (at 1 MHz) Volume Resistivity: 2 x 10^14 Surface Resistivity: 3 x 10^16 C o l o r : B l a c k S i z e : 1 0 . 2 o z C a r t r i d g e Storage and Handling Store refrigerated or at room temperature 3-25°C (37-77°F). Shelf Life >36 months Transportation This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product's stated shelf life. 1 © 1994-2024 Chip Quik® Inc. EEGGSS1100BB