EGL34A SEMTECH_ELEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- Plastic package has Underwriters Laboratories Flammability Classification 94V-0
- High temperature metallurgically bonded construction
- Cavity-free glass passivated junction
- Fast switching for high efficiency Mechanical Data
- Case: MiniMELF (DO-213AA), molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any Absolute Maximum Ratings and Characteristics Ratings at 25 OC ambient temperature unless otherwise specified. Parameter Symbols EGL34A EGL34B EGL34C EGL34D EGL34F EGL34G Units Maximum Repetitive Peak Reverse Voltage V RRM 50 100 150 200 300 400 V Maximum RMS Voltage V RMS 35 70 105 140 210 280 V Maximum DC Blocking Voltage V DC 50 100 150 200 300 400 V Maximum Average Forward Rectified Current at T T = 75 OC IF(AV) 0.5 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) IFSM 10 A Maximum Forward Voltage at 0.5 A V F 1.25 1.35 V M a x i m u m R e v e r s e C u r r e n t TA = 25 OC at Rated DC Blocking Voltage T A = 125 OC IR 5 50 μA Maximum Reverse recovery time 1) t rr 50 ns Typical Junction Capacitance 2) C J 7 pF Typical Thermal Resistance 3), 4) RθJA RθJT 150 OC/W Operating and Storage Temperature Range T j ,Tstg - 65 to + 175 OC Test conditions: IF = 0.5 A, IR = 1 A, Irr = 0.25 A Measured at 1 MHz and applied reverse voltage of 4 VDC. Thermal resistance from junction to ambient, 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals. Thermal resistance from junction to terminal, 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals. MiniMELF (DO-213AA) Plastic Package
Dated : 12/02/2009 V SEMTECH ELECTRONICS LTD. (Subsidiary of Sino-Tech International Holdings Limited, a company listed on the Hong Kong Stock Exchange, Stock Code: 724) EGL34A THRU EGL34G