EGL1A BILIN | Alldatasheet
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Technical content
FEATURES
◇ Plastic package has underwriters laboratories flammability classification 94V-0 ◇ Glass passivated chip junction ◇ For surface mount applications ◇ High temperature metallurgically bonded construction of 265℃ for 10 seconds in solder bath MECHANICAL DATA ◇ Case: JEDEC DO-213AB,molded plastic ◇ Terminals: Axial lead ,solderable per MIL- STD-750,Method 2026 ◇ Polarity: Color band denotes cathode ◇ Weight: 0.0046 ounces, 0.116 grams ◇ Mounting position: Any MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25℃ ambient temperature unless otherwise specified. Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%. EGL EGL EGL EGL EGL EGL 1J UNITS Maximum recurrent peak reverse voltage 100 200 300 400 500 600 V Maximum RMS voltage 70 140 210 280 350 420 V Maximum DC blocking voltage 100 200 300 400 500 600 V Maximum average forward rectified current TT=75℃ Peak forward surge current 8.3ms single half-sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage @1.0A V Maximum reverse current @TA=25℃ at rated DC blocking voltage @TA=125℃ Maximum reverse recovery time (Note 1) ns Typical junction capacitance (Note 2) pF Typical thermal resistance (Note 3) K/W Operating junction temperature range ℃ Storage temperature range ℃ NOTE: 1. Measured with IF=0.5A,IR=1.0A,Irr=0.25A 2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC. 1.25 1.35 1.70 trr 50 VDC A µA I(AV) 1.0 IFSM 30 A VF IR 5.0 www.galaxycn.com VRRM VRMS EGL Cj Tj TSTG RθJA - 55 ---- +175 - 55 ---- +175 150 BL GALAXY ELECTRICAL EGL1A - - - EGL1J ◇ High temperature soldering guaranteed:450 ℃/5 seconds DO - 213AB VOLTAGE RANGE: 50 --- 600 V CURRENT: 1.0 A at terminals.Complete device sub-mersible temperature ◇ Cavity-free glass passivated junction SURFACE MOUNT RECTIFIER BLGALAXY ELECTRICALDocument Number 0280092 1.
0.01 0.1 100 Tj=25 C Pulse Width=300 s 1% Duty Cycle o EGL1A-EGL1D EGL1F-EGL1G EGL1H-EGL1J .4 1.0 2 100 41 0 20 4 01 0 0 f=1MHz TJ=25 25 50 75 100 125 150 175 0.6 1.0 1.5 0.8 0.4 0.2 RESISTIVE OR INDUCTIVE LOAD COPPER PAD AREAS 11 0 100 TL=110℃ 8.3ms SINGLE HALF SINE-WAVE (JEDEC METHOD) BLGALAXY ELECTRICALDocument Number 0280092 2. www.galaxycn.com 0.1 20 40 60 80 1000.01 TA=125℃ TA=100℃ TA=25℃ 100 0.1 1 100.01 0.1 100 100 AVERAGE FORWARD RECTIFIED CURRENT,AMPERES PEAK FORWARD SURGE CURRENT,AMPERES INSTANTANEOUS FORWARD CURRENT,AMPERES INSTANTANEOUS REVERSE LEAKAGE CURRENT(mA) REVERSE VOLTAGE(V) FIG.2 -- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT TERMINAL TEMPERATURE ℃ NUMBER OF CYCLES AT 60HZ INSTANTANEOUS FORWARD VOLTAGE(V) FIG.6 -- TYPICAL TRANSIENT THERMAL IMPEDANCE PERCENT OF RATED PEAK REVERSE VOLTAGE. ( ％) JUNCTION CAPACITANCE(pF) T,PULSE DURATION, RATINGS AND CHARACTERISTIC CURVES EGL1A - - - EGL1J FIG.3 -- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG.4 -- TYPICAL REVERSE CHARACTERISTICS FIG.5 -- TYPICAL JUNCTION CAPACITANCE TRANSIENT THERMAL IMPEDANCE (oC/W) FIG.1 -- FORWARD CURRENT DERATING CURVE