EGA040212P020 YINT | Alldatasheet

Document overview

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Technical content

Features

  • Protection against ESD voltages and currents (IEC61000-4-2 Level 4)
  • Extremely quick response time (<1ns) present ideal ESD protection
  • Extremely low capacitance (0.2pF typical)
  • Extremely low leakage current
  • Bi-directional device
  • SMD (Surface Mount Device)
  • Zero signal distortion

Applications

EGA040212P020 s applied to high speed signal interface.

  • Antenna circuit
  • USB2.0/3.0
  • IEEE-1394
  • DVI
  • HDMI Product Model
  • Digital Video Equipment
  • Mobile Phone
  • GPS Antenna
  • Bluetooth Communication Equipment Explanation of Part Number EGA 0402 12 P020 C：0.2pF Rated voltage. VDC 12V Chip size, EIA 0402 ESDGUARD Series Construction & Dimensions Substrate : Ceramic (Alumina) Encapsulate : Polymer End termination : Ag/Ni/Sn Construction & Dimension : A ll data sheet.com

Trustworthy electronic circuit protection expert EGA040212P020 www.yint.com.cn Rev:19.32 Unit：mm L W H B Performance Characteristics Characteristic Symbol Unit Min. Typical. Max. Rated voltage VDC V 12 Leakage current IL μA 0.01 Peak voltage Vp V 300 Trigger voltage Vt V 300 Clamping voltage Vc V 30 Capacitance, @1MHz Cp pF 0.2 0.5 Response time ns 1 ESD voltage capability, Contact discharge mode kV 8 ESD voltage capability, Air discharge mode kV 15 ESD pulse withstand pulses 1000 Rated voltage - IL measurement rated voltage Vp – The peak voltage value shall be measured under the following conditions. ESD test conditions : IEC61000-4-2, 8 kV contact discharge Vt – measurement by using Transmission Line Pulse (TLP) Vc –measurement by using Transmission Line Pulse (TLP) Cp – Device capacitance measured with 1Vrms General specifications Temperature Specifications Operating Temperature range : -55℃ to +125℃ Storage Temperature range : -55℃ to +125℃ A ll data sheet.com

Trustworthy electronic circuit protection expert EGA040212P020 www.yint.com.cn Rev:19.33 Environmental Specifications Item Specifications Test condition Reference Bias humidity IL ≦ 10 μA 90%RH, 40℃, Rated voltage, 1000hrs MIL-STD-202 Method 103 Thermal Shock IL ≦ 10 μA -55℃ to 125℃, 30 min. cycle, 5 cycles JIS C 0025 (1998) Test Na High Temperature load voltage IL ≦ 10 μA Rated voltage , 85℃, 1000 hrs MIL-STD-202 Method 108 Solder leach resistance IL ≦ 10 μA 260℃, 10s MIL-STD-202 Method 210F IL – Leakage current at rated voltage, the maximum leakage current was measured after reliability test. Taping Package and Label Marking Packaging method 1. Products shall be heat-sealed in the chip pocket, spacing pitch 2-mm of paper carrier tape with cover tape, and the carrier tape shall be reeled to the reel. 3. Cover tape adhesion to be 35± 25 grams. Carrier tape dimensions Unit:mm A B C D E F L W T Taping reel dimensions: Taping specifications A ll data sheet.com

Trustworthy electronic circuit protection expert EGA040212P020 www.yint.com.cn Rev:19.34 There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. Quantity of products in the taping package (1) Standard quantity：10000pcs/Reel for EGA040212P020 (2) Shipping quantity is a multiple of standard quantity. Precautions for Handling Solder cream in reflow soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 0.10 to 0.15 mm. Unit:mm A B C Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples)

  • Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board.
  • Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely.
  • Do not break the board by hand. We recommend to use the machine or the jig to break it. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling. Recommendable reflow soldering A ll data sheet.com

Trustworthy electronic circuit protection expert EGA040212P020 www.yint.com.cn Rev:19.35 Profile Feature Pb free Assembly Average Ramp Rate (Ts max to Tp) 3 ℃/second max Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) 150℃ 200℃ 60-180 seconds Time maintained above: - Temperature (TL) Time (tL) 217℃ 60-150 seconds Peak Temperature (Tp) 260℃ +0/-5 ℃ Time within 5℃ of actual Peak Temperature (Tp) 20-40 seconds Ramp-Down Rate 6 ℃/second max. Time 25℃ to Peak Temperature 8 minutes max Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280°C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. Taping Package Storage Condition Storage Temperature : 5 to 40℃ Relative Humidity : < 65%RH Storage Time : 12 months max A ll data sheet.com