MMG3004NT1 NXP | Alldatasheet
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Features
Frequency: 400- -2200 MHz P1dB: 27 dBm @ 2140 MHz Small- -Signal Gain: 17 dB @ 2140 MHz Third Order Output Intercept Point: 44 dBm @ 2140 MHz Single 5 V Supply Internally Prematched to 50 Ohms In Tape and Reel. T1 Suffix = 1,000 Units, 16 mm Tape Width, 13- -inch Reel. 400- -2200 MHz, 17 dB 27 dBm InGaP HBT GPA PQFN 5 5 Table 1. Typical Performance(1)
- VDC =5V d c ,TA =2 5C, 50 ohm system, application circuit
tuned for specified frequency. Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2005- -2011, 2014.All rights reserved.
Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VDC = 5 Vdc, 2140 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit) Table 5. Functional Pin Description requires a DC- -blocking series capacitor. and requires a DC- -blocking series capacitor. VCC 14 Collector voltage supply. Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Pin Connections
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
Figure 2. Collector Current versus Bias Voltage Figure 3. Third Order Output Intercept Point obtained for other frequency bands. Figure 4. MTTF versus Junction Temperature
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 900 MHz
Figure 5. 50 Ohm Test Circuit Schematic Table 8. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 6. 50 Ohm Test Circuit Component Layout
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS: 900 MHz
Figure 7. Small- -Signal Gain (S21) versus Figure 8. Input Return Loss (S11) versus Figure 9. Output Return Loss (S22) versus Figure 10. P1dB versus Frequency Figure 11. Third Order Output Intercept
1 MHz Tone Spacing
Figure 12. Noise Figure versus Frequency
Freescale Semiconductor, Inc. Figure 13. IS- -95 Adjacent Channel Power Ratio Figure 14. IS- -95 Adjacent Channel Power Ratio
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 1900- -2200 MHz
Figure 15. 50 Ohm Test Circuit Schematic Table 9. 50 Ohm Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 16. 50 Ohm Test Circuit Component Layout
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS: 1900- -2200 MHz
Figure 17. Small- -Signal Gain (S21) versus Figure 18. Input Return Loss (S11) versus Figure 19. Output Return Loss (S22) versus Figure 20. P1dB versus Frequency Figure 21. Third Order Output Intercept Figure 22. Noise Figure versus Frequency
Freescale Semiconductor, Inc. Figure 23. IS- -95 Adjacent Channel Power Ratio Figure 24. IS- -95 Adjacent Channel Power Ratio Figure 25. Single- -Carrier W- -CDMA Adjacent
Freescale Semiconductor, Inc. Table 10. Common Emitter S- -Parameters(VDC =5V d c ,TA =2 5C, 50 Ohm System)
Freescale Semiconductor, Inc. Table 10. Common Emitter S- -Parameters(VDC =5V d c ,TA =2 5C, 50 Ohm System)(continued)
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MMG3004NT1 PACKAGE DIMENSIONS
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MMG3004NT1
Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 2 Mar. 2007 Replaced Case Outline 1543- -02 with updated 1543- -03, Issue C, pp. 1, 16- -18 Added VCC callout to Pin Connections 10, 11, and12 in Fig. 1, Pin Connections, p. 3 Updated Part Numbers in Table 8, Component Designations and Values, 900 MHz, to RoHS compliant part numbers, p. 5 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 5, 50 Ohm Test Circuit Component Layout, 900 MHz, p. 6 Removed IDC value due to its variability over temperature, Figs. 12- -13, IS- -95 Adjacent Channel Power Ratio versus Output Power, 900 MHz, p. 8 Updated Part Numbers in Table 9, Component Designations and Values, 1900- -2200 MHz, to RoHS compliant part numbers, p. 9 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 15, 50 Ohm Test Circuit Component Layout, 1900- -2200 MHz, p. 10 Removed IDC value due to its variability over temperature, Figs. 22- -23, IS- -95 Adjacent Channel Power Ratio versus Output Power, 1900- -2200 MHz, and Fig. 24, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power, 1900- -2200 MHz, p. 12 Replaced Table 10, S- -Parameters, pp. 13- -15 Added Product Documentation and Revision History, p. 19 3 Mar. 2008 Corrected Tape and Reel information from 12 mm, 7- -inch Reel to 16 mm, 13- -inch Reel, p. 1 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Corrected Fig. 24, Single- -Carrier W- -CDMA Adjacent Channel Power Ratio versus Output Power y- -axis (ACPR) unit of measure to dBc, p. 12 Corrected S- -Parameter table frequency column labelto read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, pp. 13, 14, 15 4 June 2009 Replaced Case Outline 1543- -03, Issue C, with 1543- -04, Issue D, pp. 1, 17- -19. Corrected I/O dimension from Corrected temperature at which ThetaJC is measured from 25Ct o8 8C, Thermal Characteristics table, p. 1 Replaced Figs. 12 and 22, IS- -95 Adjacent Channel Power Ratio versus Output Power, with revised graphs, pp. 8, 12 (continued)
Freescale Semiconductor, Inc. MMG3004NT1 REVISION HISTORY (continued) Revision Date Description 5 May 2010 Changed Thermal Characteristics table values for Thermal Resistance from 33 to 23.2 as a result of an improvement made in the thermal measurement method. IDC changed from 250 mA to 260 mA and TC changed from 88Ct o9 0C,p .1 Added new Fig. 3, Third Order Output Intercept Point versus Output Power and Supply Current, p. 4 Added AN3778, PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation, Application Notes, p. 20 Added .s2p File availability to Product Software, p. 20 6 Sept. 2010 Modified data sheet to reflect slight IDC and Gain performance shift. Specification change allows recentering for new GaAs Fab devices as described in Productand Process Change Notification number, PCN14154, p. 2 7 Jan. 2011 Corrected temperature at which ThetaJC is measured from 25Ct o9 0C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Removed IDC bias callout from Table 10, Common Emitter S- -Parameters heading as bias is not a controlled value, pp. 13- -15 Added Printed Circuit Boards availability to Development Tools, p. 20 8 Oct. 2011 Updated Small- -Signal Gain performance to align with production test, p. 1 Table 6, ESD Protection Characteristics, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product developmentbut are not 100% tested during production. ESD ratings provided in the data sheet are intended to be used as aguideline when handling ESD sensitive devices, p. 3 9 Oct. 2014 Added Fig. 27, Product Marking, p. 15 Added Failure Analysis information, p. 19
Freescale Semiconductor, Inc. Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2005- -2011, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MMG3004NT1 Rev. 9, 10/2014