ECMF02-2AMX6 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Features

■ Very large differential bandwidth > 6 GHz ■ High common mode attenuation: – -34 dB at 900 MHz – -20 dB between 800 MHz and 2.2 GHz ■ Very low PCB space consumption ■ Thin package: 0.55 mm max ■ Lead-free package ■ High reduction of parasitic elements through integration Complies with the following standards: ■ IEC 61000-4-2 level 4 input and output pins: – ±15 kV (air discharge) – ±8 kV (contact discharge)

Applications

■ Mobile phones ■ Notebook, laptop ■ Portable devices ■ PND

Description

The ECMF02-2AMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY , MDDI or USB 2.0. The ECMF02-2AMX6 can protect and filter one differential lane. Figure 1. Pin configuration (top view)

1 Characteristics

Figure 2. Electrical characteristics (definitions) Compliant with USB 2.0 high speed sync field test (150 mV diff). Table 1. Absolute maximum ratings (T amb = 25 °C)

  1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353.

Table 2. Electrical characteristics (values, T amb = 25 °C)

Figure 10. MIPI D-PHY low power mode test setup Figure 11. Low power pulse response - see Figure 10 for test setup Figure 8. ESD response to IEC 61000-4-2 Figure 9. ESD response to IEC 61000-4-2

20 V/Div 20 ns/Div

50 V/Div 20 ns/Div

2 Application schematics

Figure 15. MIPI D-PHY

Figure 16. USB 2.0

3 Ordering information scheme

Figure 17. Ordering information scheme

4 Package information

  • Epoxy meets UL94, V0
  • Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose.

Table 3. µQFN-6L dimensions Figure 18. Footprint (dimensions in mm) Figure 19. Marking

Figure 20. Tape and reel specifications

5 Recommendation on PCB assembly

5.1 Stencil opening design

  1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 21. Stencil opening dimensions b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 22. Recommended stencil window position

Recommendation on PCB assembly ECMF02-2AMX6 12/15 Doc ID 17815 Rev 2

5.2 Solder paste

  1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: powder particle size 20-45 µm.

5.3 Placement

  1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.

5.4 PCB design preference

  1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.

5.5 Reflow profile

Figure 23. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement.

5.6 Layout recommendation

Figure 24. Layout recommendation

6 Ordering information

For the latest information on available order codes see the product pages on www.st.com.

7 Revision history

Table 4. Ordering information

  1. The marking can be rotated by 90° to differentiate assembly location

Table 5. Document revision history 10-Aug-2010 1 Initial release. differential cross-coupling measurements.