ECLAMP0501T SEMTECH | Alldatasheet

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1 www.semtech.com PROTECTION PRODUCTS - EMIClamp ® EClamp0501T Low Profile EClamp® 1-Line ESD protection Description Features Schematic Package Configuration Revision 04/14/2010 The EClamp® 0501T TVS diode is designed to protect sen- sitive electronics from damage or latch-up due to ESD. This state-of-the-art device utilizes solid-state silicon-ava- lanche technology for superior clamping performance and DC electrical characteristics. It has been optimized for protection of digital lines protection of digital lines protection of digital lines protection of digital lines protection of digital lines in cellular phones and other portable electronics. The device replaces two discrete components in a small footprint. It consists of a TVS diode and a series 1K Ohm resistor. The TVS diode presents a maximum loading capacitance of 15pF for maximum signal integrity. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. The EClamp0501T is in a 3-pin, SLP1006P3T package. It measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applica- tions where arrays are not practical. The small pack- age makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs.

Applications

Mechanical Characteristics ‹ Cellular Handsets & Accessories ‹ Personal Digital Assistants (PDAs) ‹ Notebooks & Handhelds ‹ Portable Instrumentation ‹ Peripherals ‹ MP3 Players ‹ Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) ‹ Ultra-small package (1.0 x 0.6 x 0.4mm) ‹ Protects one data line ‹ TVS working voltage: 5V ‹ Series Resistor: 1K Ohm ‹ Capacitance: 15pF (Maximum at VR = 0V) ‹ Low leakage current ‹ Solid-state silicon-avalanche technology ‹ SLP1006P3T package ‹ Pb-Free, Halogen Free, RoHS/WEEE Compliant ‹ Nominal Dimensions: 1.0 x 0.6 x 0.4 mm ‹ Lead Finish: NiPdAu ‹ Molding compound flammability rating: UL 94V-0 ‹ Marking : Marking code, cathode band ‹ Packaging : Tape and Reel 0.65 0.40 0.60 1.0

3 Pin SLP package (Bottom Side View)

Pin Identification and Configuration (Top Side View) 15pF 1K Ω

2© 2010 Semtech Corp. www.semtech.com PROTECTION PRODUCTS EClamp0501T Absolute Maximum Rating Electrical Characteristics (T=25 oC) gnitaRl obmySe ulaVs tinU )sμ02/8=pt(rewoPesluPkaePP kp 52s ttaW (tnerruCesluPkaePmumixaM) sμ02/8=ptI pp 2s pmA )riA(2-4-00016CEIrepDSE 1 )tcatnoC(2-4-00016CEIrepDSE 1 V DSE 71-/+ 21-/+ Vk erutarepmeTgnitarepOT J 58+ot04-C ° erutarepmeTegarotST GTS 051+ot55-C ° retemaraPr etemaraP retemaraP retemaraPr etemaraPl obmySl obmyS lobmyS lobmySl obmySs noitidnoCs noitidnoC snoitidnoC snoitidnoCs noitidnoCm uminiMm uminiM muminiM muminiMm uminiMl acipyTl acipyT lacipyT lacipyTl acipyTm umixaMm umixaM mumixaM mumixaMm umixaMs tinUs tinU stinU stinUs tinU egatloVffO-dnatSesreveRSVTV MWR 5V egatloVnwodkaerBesreveRSVTV RB It Am1=6 8 0 1V tnerruCegakaeLesreveRSVTI R V MWR V0.5=5 .0A μ ecnatsiseRseireSlatoTR e niLhcaE0 580 0010 511s mhO ecnaticapaClatoTC ni ,dnGottupnI eniLhcaE VR zHM1=f,V0= 012 15 1F p Pin Configuration (Top View) niPl obmySn oitacifitnedI 1n IO/I) ediSrotcennoC(tupnIataD 2t uOO/I) CIdetcetorPoT(tuptuOataD 3D NGd nuorG Pin Identification and Configuration Notes: 1) ESD rating between pin 1 and ground. Pin 2 not rated for IEC level ESD discharges

3© 2010 Semtech Corp. www.semtech.com PROTECTION PRODUCTS EClamp0501T Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 100 110 0 2 55 07 5 1 0 0 1 2 5 1 5 0 Ambient Temperature - T A (oC) % of Rated Power or IPP Power Derating Curve Normalized Junction Capacitance vs. Reverse Voltage Forward Voltage vs. Forward Current Insertion Loss S21 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Forward Current - I F (A) Forward Voltage - VF V) Waveform Parameters: tr = 8μs td = 20μs 0.01 0.1 0.1 1 10 100 Pulse Duration - tp (us) Peak Pulse Power - PPP (kW) Note: Data is taken with a 10x attenuator 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.1 012345 Reverse Voltage - V R (V) CJ(VR) / CJ(VR=0) f = 1 MHz ESD Clamping (Measured between Pin2 and Gnd) (8kV Contact per IEC 61000-4-2) START . 030 MHz 3 STOP 000 . 000 000 MHz CH1 S21 LOG 6 dB / REF 0 dB 1: -23.787 dB

300.797 MHz

2: -30.249 dB

800.000 MHz

3: -30.785 dB

900.000 MHz

4: -26.674 dB

1.8 GHz

5: -21.176 dB

2.5 GHz

-6 dB -12 dB -18 dB -24 dB -30 dB -36 dB GHz 100 MHz GHz MHz MHz 2 3

4© 2010 Semtech Corp. www.semtech.com PROTECTION PRODUCTS EClamp0501T Circuit DiagramDevice Connection Options This device is designed to protect one data line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: z Place the TVS near the input terminals or connec- tors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Applications Information 15pF 1K Ω

5© 2010 Semtech Corp. www.semtech.com PROTECTION PRODUCTS EClamp0501T EClamp0501T Spice Model Applications Information - Spice Model D1 1K Ω sretemaraPecipST1050pmalCE-1elbaT retemaraPt inU) SVT(1D SIp mA5 1-E2 VBt loV6 5.7 JVt loV6 77.0 SRm hO2 19.0 VBIp mA3 -E0.1 OJCd araF2 1-E5.11 TTc es9 -E145.2 M- -3 2.0 N- -1 .1 GEV e1 1.1

6© 2010 Semtech Corp. www.semtech.com PROTECTION PRODUCTS EClamp0501T Outline Drawing - SLP1006P3T Land Pattern - SLP1006P3T D b1xN 0.40 CL CL A INCHES .014 BSC aaa N E e .008 .020 DIM A MIN .018 .015 0.30 0.70 0.20 0.50 .003 .010 .024 .012 .028 0.08 0.25 0.60

0.35 BSC

0.55 0.43 DIMENSIONS MIN 0.45 NOM .016 .020 MAX .022 .017 NOM 0.37 0.50 0.40 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: A B C aaa C SEATING PLANE bbb C A B e .004bbb 0.10 .008 0.20 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).1. X2 .022 0.55 THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: DIM Y P G C MILLIMETERSINCHES (0.70) .039 .014 .012 .016 (.028) 1.00 0.40 0.30 0.35 DIMENSIONS COMPANY'S MANUFACTURING GUIDELINES ARE MET. Z P/2 G(C) Y Y Z P

7© 2010 Semtech Corp. www.semtech.com PROTECTION PRODUCTS EClamp0501T Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 Marking Code Ordering Information rebmuNtraP gnikroW egatloV repytQ leeR leeR eziS TCT.T1050pmalCEV 50 00,3h cnI7 Notes: 1) This is a lead-free, RoHS/WEEE compliant product EMIClamp and EClamp are marks of Semtech Corporation Tape and Reel Specification epaT htdiW )xaM(,BD 1 DE F P0 P2 PT W mm8 mm2.4 )561.( mm1.0+5.1 mm0.0- 500.+95.0( )000.- mm4.0 52.0± )130.( 01.±057.1 mm )400.±960.( 50.0±5.3 mm )200.±831.( 01.0±0.4 mm -00.±751.( 1.0±0.4 mm -00.±751.( 50.0±0.2 mm )200.±970.( 20.0±452.0 )610.(mm mm0.8 mm3.0+ mm1.0- )210.±213.( 0A0 B0 K Device Orientation in Tape Pin 1 Location User Direction of feed